公开(公告)号：US20220199479A1

公开(公告)日：2022-06-23

申请号：US17125487

申请日：2020-12-17

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Sreenivasan Kalyani KODURI ,  Leslie Edward STARK

IPC: H01L23/31 ,  H01L23/29

Abstract: In examples, a sensor package includes a semiconductor die, a sensor on the semiconductor die, and a mold compound covering the semiconductor die. The mold compound includes a sensor cavity over the sensor. The sensor package includes a polymer film member on the sensor and circumscribed by a wall of the mold compound forming the sensor cavity. The polymer film member is exposed to an exterior environment of the sensor package.

公开(公告)号：US20200321267A1

公开(公告)日：2020-10-08

申请号：US16843618

申请日：2020-04-08

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Benjamin Stassen COOK ,  Ralf Jakobskrueger MUENSTER ,  Sreenivasan Kalyani KODURI

IPC: H01L23/48 ,  H01L21/768 ,  H01L23/00 ,  H01L23/495

Abstract: In some examples, a semiconductor package comprises a semiconductor die having a first surface and a second surface opposing the first surface. The package comprises an orifice extending through a thickness of the semiconductor die from the first surface to the second surface. The package comprises a set of metallic nanowires positioned within the orifice and extending through the thickness of the semiconductor die from the first surface to the second surface.

公开(公告)号：US20220221353A1

公开(公告)日：2022-07-14

申请号：US17538782

申请日：2021-11-30

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Tobias Bernhard FRITZ ,  Baher S. HAROUN ,  Benjamin Stassen COOK ,  Sreenivasan Kalyani KODURI ,  Michael SZELONG ,  Ernst MUELLNER

IPC: G01L1/18 ,  H01L23/31 ,  H01L23/495

Abstract: A force sensor including a semiconductor die, and a die pad coupled to the semiconductor die, the semiconductor die configured to detect a force in the die pad. In addition, the force sensor includes a mold compound covering the semiconductor die and having an outer perimeter, a first side, and a second side opposite the first side, the outer perimeter extending between the first side and the second side, the die pad exposed out of the mold compound along the first side. Further, the force sensor includes a mounting frame engaged with the die pad along the second side of the mold compound, the mounting frame including multiple mounting pads extended outward in multiple directions from the outer perimeter.

公开(公告)号：US20220028765A1

公开(公告)日：2022-01-27

申请号：US16936290

申请日：2020-07-22

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Sreenivasan Kalyani KODURI

IPC: H01L23/495 ,  H01L23/31 ,  H01L21/56 ,  H05K3/34 ,  H05K1/18 ,  H01L23/552

Abstract: In examples, a semiconductor device comprises a semiconductor die, an opaque mold compound housing covering the semiconductor die, a conductive terminal extending from the mold compound housing, and an insulative coat covering the mold compound housing and at least a portion of the conductive terminal.

公开(公告)号：US20200319038A1

公开(公告)日：2020-10-08

申请号：US16843659

申请日：2020-04-08

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Ralf Jakobskrueger MUENSTER ,  Sreenivasan Kalyani KODURI ,  Benjamin Stassen COOK

IPC: G01L1/00 ,  G01L3/02 ,  C25D7/00

Abstract: In examples, a system comprises a member to receive a mechanical force, and a sensor to sense the mechanical force. The sensor is mounted on the member using a set of nanoparticles and a set of nanowires coupled to the set of nanoparticles.

公开(公告)号：US20240178184A1

公开(公告)日：2024-05-30

申请号：US18433047

申请日：2024-02-05

Applicant: Texas Instruments Incorporated

Inventor： Sreenivasan Kalyani KODURI ,  Leslie Edward STARK

IPC: H01L25/04 ,  G01S17/08 ,  H01L25/075 ,  H01L33/62

CPC classification number: H01L25/042 ,  G01S17/08 ,  H01L25/0753 ,  H01L33/62

Abstract: A packaged integrated circuit (IC), comprising: a lead frame; one or more semiconductor dies on the lead frame, the one or more semiconductor dies including a first circuit and a second circuit; and a molding compound encapsulating the lead frame and the semiconductor die, the molding compound including a first cavity over the first circuit and a second cavity over the second circuit, in which at least one of the first or second cavities includes a second material different from the molding compound.

公开(公告)号：US20230253277A1

公开(公告)日：2023-08-10

申请号：US18299293

申请日：2023-04-12

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Sreenivasan Kalyani KODURI ,  Leslie Edward STARK ,  Steven Alfred KUMMERL ,  Wai LEE

IPC: H01L23/31 ,  H01L25/065 ,  H01L21/56 ,  H01L23/00 ,  H01L23/29 ,  H01L23/14

CPC classification number: H01L23/31 ,  H01L25/0655 ,  H01L21/565 ,  H01L23/564 ,  H01L23/293 ,  H01L23/142

Abstract: In some examples, a sensor package includes a semiconductor die having a sensor; a mold compound covering a portion of the semiconductor die; and a cavity formed in a top surface of the mold compound, the sensor being in the cavity. The sensor package includes an adhesive abutting the top surface of the mold compound, and a semi-permeable film abutting the adhesive and covering the cavity. The semi-permeable film is approximately flush with at least four edges of the top surface of the mold compound.

公开(公告)号：US20220173256A1

公开(公告)日：2022-06-02

申请号：US17109980

申请日：2020-12-02

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Sreenivasan Kalyani KODURI ,  Leslie Edward STARK

IPC: H01L31/0203 ,  H01L31/02 ,  H01L31/0216 ,  H01L31/0232 ,  H01L31/18

Abstract: In some examples, an optical sensor package comprises a semiconductor die; an opaque mold compound covering the semiconductor die and having a cavity; and an optical sensor on the semiconductor die and exposed to the cavity. The optical sensor package includes a glass member inside the cavity. The glass member abuts the sensor and a wall of the cavity. The glass member is exposed to an exterior environment of the optical sensor package. The glass member has a thickness approximately equivalent to a depth of the cavity.

公开(公告)号：US20200321302A1

公开(公告)日：2020-10-08

申请号：US16843559

申请日：2020-04-08

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Benjamin Stassen COOK ,  Ralf Jakobskrueger MUENSTER ,  Sreenivasan Kalyani KODURI

IPC: H01L23/00 ,  H01L23/367 ,  H01L23/15 ,  H01L23/495 ,  H01L23/373

Abstract: In some examples, a system comprises a set of nanoparticles and a set of nanowires extending from the set of nanoparticles.

公开(公告)号：US20240038609A1

公开(公告)日：2024-02-01

申请号：US18484321

申请日：2023-10-10

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Sreenivasan Kalyani KODURI ,  Leslie Edward STARK

IPC: H01L23/16 ,  H01L23/31 ,  H01L21/56 ,  H01L23/00

CPC classification number: H01L23/16 ,  H01L23/315 ,  H01L21/56 ,  H01L24/32 ,  H01L24/48 ,  H01L2224/32245 ,  H01L23/495

Abstract: In some examples, a semiconductor package comprises a semiconductor die; an operational component on an active surface of the semiconductor die; and a cover coupled to the active surface of the semiconductor die and covering the operational component. The cover comprises a monolithic structure including a vertical portion and a horizontal portion. A hollow area is between the cover and the operational component. The package also includes a mold compound covering the semiconductor die and the cover.