MULTILAYER STRUCTURE AND RELATED METHOD OF MANUFACTURE FOR ELECTRONICS

    公开(公告)号:US20180359860A1

    公开(公告)日:2018-12-13

    申请号:US16045009

    申请日:2018-07-25

    申请人: TactoTek Oy

    摘要: A method for manufacturing a multilayer structure, includes obtaining a substrate film for accommodating electronics, providing, preferably at least in part by printed electronics technology, a number of conductive traces, and optionally electronic components, at least on a first side of the substrate film to establish a predetermined circuit design, providing a connector element to said substrate film to electrically connect to the circuit, wherein the substrate film is arranged with at least one hole, preferably through hole, substantially matching the location of the connector element so that a number of electrically conductive contact members of the connector element are accessible from a second, opposite side of the substrate film via said at least one hole, and molding thermoplastic material on said first side of the substrate film and said connector element to substantially cover the established circuit and the side of the connector element facing the material.

    ILLUMINATED MULTILAYER STRUCTURE WITH EMBEDDED LIGHT SOURCES

    公开(公告)号:US20220171121A1

    公开(公告)日:2022-06-02

    申请号:US17674894

    申请日:2022-02-18

    申请人: TACTOTEK OY

    IPC分类号: F21V8/00

    摘要: An electronic device includes a substrate film having a first side and a second side, and a number of light sources configured to emit light. A plastic lightguide layer is molded onto the first side of the substrate film. The plastic lightguide layer being of optically at least translucent material to transmit light. The device also includes a masking layer provided on the outer surface of the plastic lightguide layer. The masking layer defines a window for letting the light emitted by the embedded light sources to pass through the masking layer towards the environment.

    ILLUMINATED MULTILAYER STRUCTURE WITH EMBEDDED LIGHT SOURCES

    公开(公告)号:US20200284974A1

    公开(公告)日:2020-09-10

    申请号:US16871548

    申请日:2020-05-11

    申请人: TACTOTEK OY

    摘要: A multilayer assembly for an electronic device includes a substrate film configured to accommodate electronics on at least first side thereof, a number of light sources on the first side of the substrate film and configured to emit light of predetermined frequency or frequency band, a plastic lightguide layer molded onto the first side of the substrate film and at least partially embedding the light sources, the plastic lightguide layer being of optically at least translucent material, and a masking layer provided on the outer surface of the plastic lightguide layer, wherein the masking layer defines a window for letting light emitted by the embedded light sources and propagated within the plastic lightguide layer to pass through the masking layer towards the environment.

    ILLUMINATED MULTILAYER STRUCTURE WITH EMBEDDED AREA LIGHT SOURCE

    公开(公告)号:US20190049650A1

    公开(公告)日:2019-02-14

    申请号:US16156123

    申请日:2018-10-10

    申请人: TACTOTEK OY

    发明人: Antti KERÄNEN

    IPC分类号: F21V8/00 H05K1/02 H05K1/18

    摘要: Multilayer assembly for an electronic device includes a substrate film configured to accommodate electronics, said film having the first side and a second side, at least one area light source and configured to emit light of predetermined frequency or frequency band, a molded lightguide layer, the lightguide layer being of optically at least translucent material, wherein the lightguide layer is configured to transmit light emitted by the embedded light source so that the transmitted light propagates within the lightguide layer and is outcoupled therefrom via an outer surface thereof substantially opposite to the embedded light source, and a masking layer provided on the outer surface of the plastic lightguide layer, containing substantially opaque material to block external view of at least some internals of the multilayer structure, wherein the masking layer defines a window for letting the light emitted by the embedded light source and propagated within the plastic lightguide layer to pass through the masking layer towards the environment.

    ILLUMINATED MULTILAYER STRUCTURE WITH EMBEDDED LIGHT SOURCES

    公开(公告)号:US20190064431A1

    公开(公告)日:2019-02-28

    申请号:US16155956

    申请日:2018-10-10

    申请人: Tactotek Oy

    摘要: An electronic device includes a substrate film having a first side and a second side, and a number of light sources configured to emit light. A plastic lightguide layer is molded onto the first side of the substrate film. The plastic lightguide layer being of optically at least translucent material to transmit light. The device also includes a masking layer provided on the outer surface of the plastic lightguide layer. The masking layer defines a window for letting the light emitted by the embedded light sources to pass through the masking layer towards the environment.