Circuit arrangement for a dual bus line
    5.
    发明授权
    Circuit arrangement for a dual bus line 失效
    双总线线路布置

    公开(公告)号:US4931667A

    公开(公告)日:1990-06-05

    申请号:US266172

    申请日:1988-11-02

    CPC分类号: G11C7/1048

    摘要: Data are frequently transmitted via a dual bus line by means of differential signals which are evaluated by a differential amplifier, particularly for reasons of protection against interference. However, such a differential amplifier only has a limited input voltage range, or a dead voltage range of the input signals within which it is not capable of operating. To prevent the voltages on both bus lines from getting into this dead voltage range, either due to a common-mode interference signal on the bus lines or due to a voltage dip in the feed voltage of the differential amplifier, the two bus lines are connected in accordance with the invention to an adjusting circuit which changes the voltages of both bus lines by the same amount in the direction out of the dead voltage range. This prevents unspecified conditions of the differential amplifier without significantly influencing the differential signal on the two bus lines. The application for an integrated memory is described.

    摘要翻译: 通过由差分放大器评估的差分信号经由双总线传输数据,特别是出于防止干扰的原因。 然而,这种差分放大器仅具有有限的输入电压范围,或其中不能操作的输入信号的死电压范围。 为了防止两条总线上的电压进入该死区,由于总线上的共模干扰信号或由于差分放大器的馈电电压的电压下降,两条总线被连接 根据本发明,调整电路使得两个总线的电压在死电压范围之外的方向上改变相同的量。 这可以防止差分放大器的未指定条件,而不会明显影响两条总线上的差分信号。 描述了集成存储器的应用。

    Condensed single block PLA plus PAL architecture
    10.
    发明授权
    Condensed single block PLA plus PAL architecture 失效
    冷凝单块PLA + PAL架构

    公开(公告)号:US5684413A

    公开(公告)日:1997-11-04

    申请号:US623622

    申请日:1996-03-28

    IPC分类号: H03K19/177

    CPC分类号: H03K19/17708

    摘要: A condensed single block PAL plus PLA architecture utilizing a rectangular shape is shown. By interleaving the ORterms of the PLA array with the Pterms of the PAL array, a significant amount of die space is saved when incorporating the circuit with silicon. The decode routing required is now simplified and the propagation delay skews through the array are also reduced.

    摘要翻译: 示出了使用矩形形状的压缩单块PAL plus PLA架构。 通过将PLA阵列的ORterms与PAL阵列的Pterms进行交织,当将电路与硅结合时,可以节省大量的管芯空间。 所需的解码路由现在被简化,并且通过阵列的传播延迟偏移也减少。