公开(公告)号：US20220371047A1

公开(公告)日：2022-11-24

申请号：US17623392

申请日：2020-06-25

Applicant: Tokyo Electron Limited

Inventor： Yusaku HASHIMOTO ,  Masatoshi KAWAKITA ,  Kosuke YOSHIHARA

IPC: B05D1/00 ,  B05B13/02 ,  B05B12/04 ,  B05D1/40

Abstract: A coating method of supplying a treatment solution to a substrate and coating the substrate with the treatment solution by a spin coating method, includes mixing a solvent for the treatment solution lower in surface tension than the treatment solution into the treatment solution concurrently with a start of supply of the treatment solution or later than the start of the supply of the treatment solution, and then supplying the treatment solution to the substrate.

公开(公告)号：US20240249951A1

公开(公告)日：2024-07-25

申请号：US18418757

申请日：2024-01-22

Applicant: Tokyo Electron Limited

Inventor： Kosuke YOSHIHARA ,  Yuichi TERASHITA ,  Yukinobu OTSUKA ,  Shinsuke TAKAKI ,  Hiroki TADATOMO ,  Naoki SHIBATA

IPC: H01L21/308 ,  C23C16/04 ,  C23C16/455 ,  C23C16/46 ,  H01L21/02 ,  H01L21/324

CPC classification number: H01L21/3081 ,  C23C16/042 ,  C23C16/45517 ,  C23C16/46 ,  H01L21/02491 ,  H01L21/3247

Abstract: A substrate treatment method includes: developing a substrate which has a coating film of a metal-containing resist formed thereon and has been subjected to an exposure treatment and a heat treatment after the exposure treatment, the developing including: exposing the substrate to an acid atmosphere being an atmosphere containing gas of a weak acid under a pressure of an atmospheric pressure or higher; and removing a product produced by a reaction between the metal-containing resist and the gas of the weak acid, by heating the substrate.

公开(公告)号：US20200147637A1

公开(公告)日：2020-05-14

申请号：US16468356

申请日：2017-11-24

Applicant: Tokyo Electron Limited

Inventor： Shogo INABA ,  Kosuke YOSHIHARA ,  Shinichi HATAKEYAMA

IPC: B05C11/08 ,  B05C5/02 ,  B05D1/36 ,  B05D3/12

Abstract: A method for coating a top of a substrate with a coating solution, the method includes: supplying, before a solution film of the coating solution formed on the substrate dries, a solvent for the coating solution to a peripheral portion on the solution film of the coating solution on the substrate while rotating the substrate at a predetermined rotation speed to form a mixed layer of the coating solution and the solvent at the peripheral portion; and then, controlling a film thickness of the coating solution after drying by rotating the substrate at a rotation speed higher than the predetermined rotation speed to push the mixed layer to an outer peripheral side.

公开(公告)号：US20240120217A1

公开(公告)日：2024-04-11

申请号：US18473459

申请日：2023-09-25

Applicant: Tokyo Electron Limited

Inventor： Shinichiro KAWAKAMI ,  Kosuke YOSHIHARA ,  Satoru SHIMURA ,  Yuhei KUWAHARA ,  Tomoya ONITSUKA ,  Soichiro OKADA ,  Tetsunari FURUSHO

IPC: H01L21/67 ,  H01L21/027

CPC classification number: H01L21/67109 ,  H01L21/027

Abstract: A substrate treatment method includes: performing a first heat treatment on a substrate on which a coating film of a metal-containing resist has been formed and subjected to an exposure treatment, to form the metal-containing resist into a precursor in an exposed region of the coating film; thereafter, performing a second heat treatment on the substrate to condense the metal-containing resist formed into the precursor in the exposed region of the coating film; and thereafter, performing a developing treatment on the substrate.

公开(公告)号：US20220113628A1

公开(公告)日：2022-04-14

申请号：US17496965

申请日：2021-10-08

Applicant: Tokyo Electron Limited

Inventor： Keiichi TANAKA ,  Kosuke YOSHIHARA ,  Yoshihiro KONDO ,  Makoto MURAMATSU ,  Teruhiko KODAMA

IPC: G03F7/16 ,  G03F7/20

Abstract: A method of processing a substrate, includes emitting light including vacuum ultraviolet light to a front surface of the substrate, which has a resist film formed thereon from a resist material for EUV lithography, before an exposure process in an interior of a processing container.