公开(公告)号：US6065771A

公开(公告)日：2000-05-23

申请号：US171300

申请日：1998-11-12

申请人： Yasushi Kawakubo ,  Takeshi Yamaji ,  Kazuhiko Yoshioka ,  Shiro Ozaki ,  Masahiko Yanagihara

发明人： Yasushi Kawakubo ,  Takeshi Yamaji ,  Kazuhiko Yoshioka ,  Shiro Ozaki ,  Masahiko Yanagihara

IPC分类号： B29C59/00 ,  B60R21/2165 ,  B60R21/20

CPC分类号： B60R21/2165 ,  B29C59/007 ,  B29L2031/3038 ,  B60R2021/21652

摘要： In order to reconcile the cleaving performance and the quality of appearance of an instrument panel for an bag, an instrument panel is provided having a skin member of a single layer structure, a cleaving section formed by a groove provided on the back of the skin member is composed of a longitudinal cleaving section which is substantially linear and a pair of "V " shaped lateral cleaving sections which are ramified respectively from both ends of the longitudinal cleaving section and which open forward and extend obliquely with respect to the direction of extension of the longitudinal cleaving section. Furthermore, where a skin member of a double-layered structure in which at least a cushion layer is disposed on the back of a skin layer, a door member is formed on the back of a skin member, in which a brittle section is created, as one body there with by injection-molding a resin material and a brittle section of the door member facing the brittle section of the skin member.

摘要翻译： PCT No.PCT / JP97 / 04840 Sec。 371日期：1998年11月12日 102（e）日期1998年11月12日PCT 1997年12月25日PCT公布。 第WO98 / 36948号公报 日期1998年8月27日为了调节用于袋子的仪表板的劈裂性能和外观质量，提供了具有单层结构的皮肤构件的仪表板，由设置在其上的凹槽形成的劈开部分 皮肤部件的背部由基本上线性的纵向切开部分和一对“V”形横向分离部分组成，该分离部分分别从纵向切割部分的两端分开，并相对于 纵向切割部分的延伸方向。 此外，在皮肤层的背面设置有至少缓冲层的双层结构的皮肤部件的情况下，在形成有脆性部的皮肤部件的背面形成有门部件， 作为一体，通过注塑树脂材料和面对脆皮部分的门部件的脆性部分。

公开(公告)号：US06447004B1

公开(公告)日：2002-09-10

申请号：US09116003

申请日：1998-07-15

申请人： Yasushi Kawakubo ,  Shiro Ozaki

发明人： Yasushi Kawakubo ,  Shiro Ozaki

IPC分类号： B60R2116

CPC分类号： B29C44/141 ,  B60R21/2165

摘要： An instrument panel for an air bag device has a surface member having a first surface component and a second surface component each with backsides. A foamed member is formed on the back sides of the surface member and cleavable by expanding pressure of an air bag of the air bag device where the air bag device is disposed adjacent the foam member. The first surface component and the second surface component respectively having first and second side edge portions with respective first and second engaging portions engaging one another to form an adjoining portion of the surface member whereat the surface member is cleaved by the expanding pressure of the air bag. The first engaging portion included a fitting groove having a generally U-shaped section extending from the backside of the first surface component into the foamed member. The second engaging portion includes a fitting protrusion extending from the backside of the second surface component and adapted to be inserted into the fitting groove. The foamed member is foamed onto the backside of the surface member with the fitting protrusion inserted into the fitting groove such that the fitting groove with the fitting protrusion inserted therein is embedded in the foamed member.

摘要翻译： 用于气囊装置的仪表板具有具有第一表面部件的表面部件和每个都具有背面的第二表面部件。 发泡构件形成在表面构件的背面上，并且通过气囊装置的气泡装置的靠近泡沫构件设置的气囊的压力膨胀而被切割。 第一表面部件和第二表面部件分别具有第一和第二侧边缘部分，其相应的第一和第二接合部分彼此接合，以形成表面部件的邻接部分，在该部分的表面部件被气囊膨胀的压力 。 第一接合部分包括具有从第一表面部件的后侧延伸到发泡部件的大致U形部分的配合槽。 第二接合部分包括从第二表面部件的后侧延伸并适于插入到配合槽中的配件突起。 发泡构件在表面构件的背面发泡，其中装配突起插入到装配槽中，使得嵌入其中的装配突起的装配槽嵌入发泡构件中。

公开(公告)号：US5976289A

公开(公告)日：1999-11-02

申请号：US976898

申请日：1997-11-24

申请人： Yasushi Kawakubo ,  Shiro Ozaki

发明人： Yasushi Kawakubo ,  Shiro Ozaki

IPC分类号： B29C44/12 ,  B60R21/045 ,  B32B5/20 ,  B32B31/06 ,  B62D25/14

CPC分类号： B29C44/1257 ,  B60R21/045 ,  Y10T29/4987

摘要： A method of fabricating an instrument panel includes providing a skin which forms a surface of the instrument panel and has side face portions extending rearwardly from a front face portion and providing a panel core having a recess for defining a molding space between the panel core and the skin. The front face portion and the side face portions define a bend angle. The recess of the panel core has peripheral walls for engaging the side face portions and the peripheral walls and a surface of the recess define a regular angle which is less than the bend angle. The bend angle, for instance, is larger than the regular angle by 2.degree. to 8.degree., and preferably by 3.degree. to 5.degree.. The panel core is placed in a first die and the skin is place in a second die such that the side face portions are deflected to fit into the recess of the panel core during mold closing. The dies are closed and a foaming material is injected between the panel core and the skin to integrate the panel core and the skin. The side face portions resiliently engage the peripheral walls to prevent leakage of the foaming material. In an embodiment of the method, a skin holding member is movably provided in the second die for holding the side face portions in position during mold closing. The skin holding member is withdrawn to permit engagement of the side face portions with the peripheral walls after mold closing.

摘要翻译： 制造仪表板的方法包括提供形成仪表板表面的皮肤，并且具有从正面部分向后延伸的侧面部分，并提供具有凹部的面板芯，用于在面板芯和第一面之间限定模制空间 皮肤。 前表面部分和侧面部分限定弯曲角度。 面板芯的凹部具有用于接合侧面部分和周壁的周壁，并且凹部的表面限定小于弯曲角度的规则角度。 弯曲角度例如大于常规角度2°至8°，优选3°至5°。 将面板芯放置在第一模具中，并且皮肤位于第二模具中，使得侧模部分在模具闭合期间被偏转以装配到面板芯的凹部中。 模具封闭，并且在面板芯和皮肤之间注入发泡材料以整合面板芯和皮肤。 侧面部分弹性地接合外围壁以防止发泡材料的泄漏。 在该方法的一个实施例中，皮肤保持构件可移动地设置在第二模具中，用于在闭合期间将侧面部分保持在适当的位置。 退出皮肤保持构件以允许在闭合之后侧面部分与周壁接合。

公开(公告)号：US08378489B2

公开(公告)日：2013-02-19

申请号：US12544371

申请日：2009-08-20

申请人： Shiro Ozaki ,  Yoshihiro Nakata ,  Yasushi Kobayashi ,  Ei Yano

发明人： Shiro Ozaki ,  Yoshihiro Nakata ,  Yasushi Kobayashi ,  Ei Yano

IPC分类号： H01L29/40

CPC分类号： H01L21/76834 ,  C09D183/16 ,  H01L21/02123 ,  H01L21/02304 ,  H01L21/02343 ,  H01L21/312 ,  H01L21/3121 ,  H01L21/3125

摘要： A semiconductor device of this invention has a copper wiring layer, of which a layer, to which a composition including at least one substance selected from the group consisting of ammonia and organic bases is applied, and a silicon-containing insulating film are sequentially superimposed on the copper wiring layer. Accordingly, semiconductor devices having insulating layers which adheres well to the copper serving as the wiring material can be obtained.

摘要翻译： 本发明的半导体器件具有铜布线层，其中施加了包含选自氨和有机碱的至少一种物质的组合物的层，并且将含硅绝缘膜依次叠加在 铜布线层。 因此，可以获得具有与用作布线材料的铜附着良好的绝缘层的半导体器件。

公开(公告)号：US20130076442A1

公开(公告)日：2013-03-28

申请号：US13545163

申请日：2012-07-10

申请人： Norikazu Nakamura ,  Atsushi Yamada ,  Shiro Ozaki ,  Kenji Imanishi

发明人： Norikazu Nakamura ,  Atsushi Yamada ,  Shiro Ozaki ,  Kenji Imanishi

IPC分类号： H03F3/16 ,  H01L21/335 ,  H01L29/778

CPC分类号： H01L29/0607 ,  H01L21/02115 ,  H01L21/02266 ,  H01L21/02381 ,  H01L21/02488 ,  H01L21/02513 ,  H01L21/0254 ,  H01L29/2003 ,  H01L29/41766 ,  H01L29/66462 ,  H01L29/778 ,  H01L29/7787 ,  H03F1/3247 ,  H03F3/19 ,  H03F3/245

摘要： An embodiment of a compound semiconductor device includes: a substrate; a compound semiconductor stacked structure formed over the substrate; and an amorphous insulating film formed between the substrate and the compound semiconductor stacked structure.

公开(公告)号：US06472305B1

公开(公告)日：2002-10-29

申请号：US09536049

申请日：2000-03-27

申请人： Shiro Ozaki ,  Kenji Edazawa ,  Kazuhiro Sugiyama

发明人： Shiro Ozaki ,  Kenji Edazawa ,  Kazuhiro Sugiyama

IPC分类号： H01L2144

CPC分类号： H01L24/81 ,  H01L21/4846 ,  H01L21/563 ,  H01L23/49811 ,  H01L23/4985 ,  H01L2224/16237 ,  H01L2224/73203 ,  H01L2224/81801 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/00

摘要： The bonding conditions for bonding a semiconductor chip to a film substrate are controlled to allow an adhesive positioned right under the junction between the first connection terminal of the film substrate and the bump electrode of a semiconductor chip to be pushed out to form an opening in the adhesive layer. As a result, the junction between the first connection terminal and the bump electrode floats from the upper surface of the adhesive layer and supports the semiconductor chip in the floating state. It follows that is possible to prevent crack occurrence derived from the difference in thermal expansion coefficient in the junction between the first connection terminal and the bump electrode, thereby ensuring a good electrical connection.

摘要翻译： 控制用于将半导体芯片接合到薄膜基板的接合条件被控制为允许将位于薄膜基板的第一连接端子与半导体芯片的凸块电极之间的接合点正下方的粘合剂推出，以形成开口 粘合剂层。 结果，第一连接端子和凸起电极之间的接合部从粘合剂层的上表面浮起，并将半导体芯片支撑在浮置状态。 因此，可以防止由第一连接端子和凸块电极之间的接合部的热膨胀系数的差异导致的裂纹发生，从而确保良好的电连接。

公开(公告)号：US06375064B1

公开(公告)日：2002-04-23

申请号：US09526665

申请日：2000-03-15

申请人： Kenji Edasawa ,  Shiro Ozaki ,  Kazuhiro Sugiyama ,  Isao Kurashima

发明人： Kenji Edasawa ,  Shiro Ozaki ,  Kazuhiro Sugiyama ,  Isao Kurashima

IPC分类号： B23K108

CPC分类号： H05K3/3484 ,  H01L21/4853 ,  H01L2224/16225 ,  H01L2924/15311 ,  H05K3/0035 ,  H05K3/3452 ,  H05K2201/10734 ,  H05K2203/0191 ,  H05K2203/043 ,  H05K2203/0568 ,  H05K2203/0577

摘要： A conductive paste is loaded in circular holes made in a reinforcing film of a carrier tape which includes a film substrate and the reinforcing film, followed by applying a heat treatment to the conductive paste to form projecting electrodes consisting of solder. Then, the reinforcing film is peeled off to permit the projecting electrode to project from the film substrate.

摘要翻译： 将导电性糊剂装载在由载体带的增强膜中形成的圆形孔中，该载体带包括膜基底和增强膜，然后对导电膏进行热处理，以形成由焊料组成的突起电极。 然后，将增强膜剥离，使突出电极从膜基材突出。

公开(公告)号：US20090309221A1

公开(公告)日：2009-12-17

申请号：US12544371

申请日：2009-08-20

申请人： Shiro Ozaki ,  Yoshihiro Nakata ,  Yasushi Kobayashi ,  Ei Yano

发明人： Shiro Ozaki ,  Yoshihiro Nakata ,  Yasushi Kobayashi ,  Ei Yano

IPC分类号： H01L23/532 ,  H01L21/3205

CPC分类号： H01L21/76834 ,  C09D183/16 ,  H01L21/02123 ,  H01L21/02304 ,  H01L21/02343 ,  H01L21/312 ,  H01L21/3121 ,  H01L21/3125

摘要： A semiconductor device of this invention has a copper wiring layer, of which a layer, to which a composition including at least one substance selected from the group consisting of ammonia and organic bases is applied, and a silicon-containing insulating film are sequentially superimposed on the copper wiring layer. Accordingly, semiconductor devices having insulating layers which adheres well to the copper serving as the wiring material can be obtained.

摘要翻译： 本发明的半导体器件具有铜布线层，其中施加了包含选自氨和有机碱的至少一种物质的组合物的层，并且将含硅绝缘膜依次叠加在 铜布线层。 因此，可以获得具有与用作布线材料的铜附着良好的绝缘层的半导体器件。