摘要:
A semiconductor memory device includes a test address generating circuit configured on the device. The test address generating circuit generates a plurality of test addresses for a test of the semiconductor memory device in response to at least one externally applied test address generation signal. As a result, the number of DUTs can increase, based on a reduction of required address pins, and manufacturing productivity and test efficiency of semiconductor memory devices can increase.
摘要:
A semiconductor memory device includes a test address generating circuit configured on the device. The test address generating circuit generates a plurality of test addresses for a test of the semiconductor memory device in response to at least one externally applied test address generation signal. As a result, the number of DUTs can increase, based on a reduction of required address pins, and manufacturing productivity and test efficiency of semiconductor memory devices can increase.
摘要:
The invention relates to a method and apparatus for controlling a high voltage generator during wafer burn-in. The method includes generating an enable signal for enabling a high voltage generator responsive to a mode signal, e.g., a wafer burn-in test mode. The method provides an external voltage to a semiconductor memory device through a pad responsive to the enable signal. The method varies a high voltage level being output from the high voltage generator in response to a reference voltage level.
摘要:
The invention relates to a method and apparatus for controlling a high voltage generator during wafer burn-in. The method includes generating an enable signal for enabling a high voltage generator responsive to a mode signal, e.g., a wafer bum-in test mode. The method provides an external voltage to a semiconductor memory device through a pad responsive to the enable signal. The method varies a high voltage level being output from the high voltage generator in response to a reference voltage level.
摘要:
Boosted voltage generates and methods for an integrated circuit are configured to boost an initial boosted voltage to a first boosted voltage in response to detecting a drop in the initial voltage. The first boosted voltage is then boosted to a second boosted voltage in response to a pulse. The second boosted voltage is then repeatedly boosted to approach the initial boosted voltage in response to an oscillating signal. Accordingly, stable boosted voltages may be generated.
摘要:
A boosting voltage level detector for a semiconductor memory device which utilizes a boosting voltage the level of which is higher than that of a power supply voltage, which includes a pull-up portion and a pull-down portion. In a preferred embodiment, the pull-up portion includes a PMOS transistor and a first NMOS transistor connected in series between the power supply voltage and an output node, and the pull-down portion includes second and third NMOS transistors connected in series between the output node and ground. The PMOS transistor has a gate electrode which is coupled to ground, and thus functions as a current source. The second NMOS transistor has a gate electrode which is coupled to a reference voltage, and thus functions as a resistor. The gate electrodes of the first and third NMOS transistors are commonly coupled to the boosting voltage. The detector further includes an inverter circuit coupled to the output node. The voltage value of the output node rises above the trip point level of the inverter in response to the boosting voltage rising above a predetermined voltage level, and the voltage value of the output node falls below the trip point level in response to the boosting voltage falling below the predetermined voltage level.
摘要:
A semiconductor device may include lower electrodes having different heights depending on positions on a substrate. Supporting layer pattern making a contact with the lower electrodes having a relatively large height is provided. The supporting layer pattern is provided between the lower electrodes for supporting the lower electrodes. A dielectric layer is provided on the lower electrodes and the supporting layer pattern. An upper electrode is formed on the dielectric layer and has a planar upper surface. An inter-metal dielectric layer is provided on the upper electrode. A metal contact penetrating through the inter-metal dielectric layer and making a contact with the upper electrode is formed. A bottom portion of the metal contact faces a portion under where the lower electrode having a relatively small height is formed. The device has a higher reliability.
摘要:
In a method of estimating a self refresh period of a semiconductor memory device according to an exemplary embodiment, a plurality of internal address signals are reset in response to a refresh reset signal. The plurality of internal address signals are sequentially changed synchronously with an oscillation signal. A refresh completion signal is generated based on the plurality of internal address signals. The self refresh period is detected based on the refresh reset signal and the refresh completion signal.
摘要:
In a layout structure of pads and a structure of pad used for a test or wire bonding of a semiconductor device, a size of at least one or more non-wire bonding pads is relatively small as compared with a size of at least one or more pads to be used for wire bonding of the semiconductor device. In the pad structure, a pad includes a wire bonding region that has an embossed surface for a portion of top metal layer within a determined pad size to improve the bonding process, and a probe tip contact region that does not have the embossed surface for a surface portion of the top metal layer within the determined pad size, so as to reduce wear of probe tip during testing of the device. Pad pitch can thereby be increased within a limited region, and peripheral circuits can be further formed in regions that would have been occupied in a conventional pad formation region. Higher integration of semiconductor devices and reduced wear of probe tip in probing is thereby realized.
摘要:
A semiconductor memory device for enhancing bitline precharge time and method for accelerating precharge time in the device is provided which may reduce overall precharging time, in an effort to guarantee proper high speed operations in the semiconductor memory device. In the method, an equalization enable signal may be applied to an equalizer of the device to precharge a bitline pair connected a memory cell, isolation part and sense amplifier of the device. Isolation control signals, to be applied to one or more of the isolation parts, may be delayed by a given time, so that a time of applying the isolation control signals is after a time of applying the equalization enable signal to the equalizer.