摘要:
In a layout structure of pads and a structure of pad used for a test or wire bonding of a semiconductor device, a size of at least one or more non-wire bonding pads is relatively small as compared with a size of at least one or more pads to be used for wire bonding of the semiconductor device. In the pad structure, a pad includes a wire bonding region that has an embossed surface for a portion of top metal layer within a determined pad size to improve the bonding process, and a probe tip contact region that does not have the embossed surface for a surface portion of the top metal layer within the determined pad size, so as to reduce wear of probe tip during testing of the device. Pad pitch can thereby be increased within a limited region, and peripheral circuits can be further formed in regions that would have been occupied in a conventional pad formation region. Higher integration of semiconductor devices and reduced wear of probe tip in probing is thereby realized.
摘要:
In a layout structure of pads and a structure of pad used for a test or wire bonding of a semiconductor device, a size of at least one or more non-wire bonding pads is relatively small as compared with a size of at least one or more pads to be used for wire bonding of the semiconductor device. In the pad structure, a pad includes a wire bonding region that has an embossed surface for a portion of top metal layer within a determined pad size to improve the bonding process, and a probe tip contact region that does not have the embossed surface for a surface portion of the top metal layer within the determined pad size, so as to reduce wear of probe tip during testing of the device. Pad pitch can thereby be increased within a limited region, and peripheral circuits can be further formed in regions that would have been occupied in a conventional pad formation region. Higher integration of semiconductor devices and reduced wear of probe tip in probing is thereby realized.
摘要:
A semiconductor memory device includes a memory core unit, N data output buffers, N data output ports, and a plurality of test logic circuits. The memory core unit stores test data through N data lines. The N data output buffers are respectively connected to the corresponding N data lines. The N data output ports are connected to the corresponding N data output buffers, and exchange the test data with an external tester respectively. The plurality of test logic circuits receives the test data through the K data lines from the N data lines, performs test logic operation on the received test data, and provides a data output buffer control signal that determines activation of K data output buffers of the N data output buffers in test mode. The semiconductor memory device reduces test cycle.
摘要:
A bit line pre-charge circuit of a semiconductor memory device includes a pre-charge circuit connected between a pair of bit lines for pre-charging the pair of bit lines in response to a pre-charge control signal and a pre-charge voltage transmitting circuit for transmitting a pre-charge voltage to the pre-charge circuit in response to the pre-charge control signal. A voltage drop in a pre-charge voltage generation line may be prevented when a short circuit is formed between a word line and a pair of bit lines, and current consumption during a standby operation of the semiconductor memory device may also be reduced, by preventing current from flowing from the pair of bit lines to the pre-charge voltage generation line.
摘要:
A semiconductor device that performs stable circuit operations is provided. The device includes: a pull-up driver for pulling up a first node in response to first states of input and control signals; a pull-down driver for pulling down a second node in response to a second state of the input signal; at least one fuse connected between the first node and the second node; a latch for generating an output signal to maintain the state of the second node; and a controller for generating the control signal that is maintained in a first state when the input signal is in the second state, and maintained in the first state and then transitioned to the second state after a predetermined delay time when the input signal is transitioned to the first state. In this construction, even if the fuse is incompletely cut during a process of cutting the fuse, the pull-up driver or the pull-down driver is turned off, thus preventing unnecessary current flow in advance.
摘要:
A semiconductor memory device including a plurality of memory blocks having associated with one or more circuit blocks therearound, and a plurality of input/output lines associated with the memory blocks, is disclosed. The input/output lines are divided into at least a first group and a second group. First portions of the input/output lines of the first group are arranged between the adjacent memory blocks while first portions of the input/output lines of the second group are arranged within the circuit blocks around the adjacent memory blocks. Second portions of the input/output lines of the first group are arranged on the circuits blocks around the memory blocks while second portions of the input/output lines of the second group are arranged between the adjacent memory blocks.
摘要:
Integrated circuit memory devices include first and second memory cell arrays, first and second transmission parts between the first and second memory cell arrays, and first and second input/output selection parts between the first and second memory cell arrays, wherein the first transmission part is adjacent the first input/output selection part and wherein the second transmission part is adjacent the second input/output selection part. A transistor in the first transmission part and a transistor in the first input/output selection part can share a first common source/drain region. A transistor in the second transmission part and a transistor in the second input/output selection part also can share a second common source/drain region. First and second input/output selection parts also may be provided between the first and second transmission parts. At least one sense amplifier part may be provided between the first and second input/output selection parts.
摘要:
A layout of a bit line sensing control circuit for a semiconductor memory device includes two bit line pairs extending in a first direction. A power contact is arranged between the two bit line pairs. A power gate is arranged around the power contact. A plurality of sense transistors respectively have a plurality of sense transistor gates. The plurality of sense transistor gates are arranged around the power gate. A pair of control line contacts is arranged in a second direction at an adjacent location outside the two bit line pairs. A control line extends in the second direction and is connected to the power gate through the pair of control line contacts. A power line extends in the second direction adjacent to the control line and is connected to an active area surrounded by the power gate through the power contact.
摘要:
An internal power supply circuit for use in a semiconductor device includes a clamp circuit for clamping an internal voltage to a constant level. The clamped internal voltage is distributed to internal circuits of the semiconductor device through an output node. When the internal voltage rises momentarily due to noise in the internal power supply circuit due to open-circuit phenomenon, the rising internal voltage is discharged through the clamp circuit, thereby maintaining the internal voltage at a constant value. The clamp circuit includes a first transistor for discharging the output node, and a diode-connected transistor for generating a charge voltage at the gate of the first transistor. The threshold voltage of the diode-connected transistor is preferably equal to or lower than the threshold voltage of the first transistor.
摘要:
Provided is a fuse circuit capable of selectively using a power supply voltage for a logic operation according to an operation mode. The fuse circuit includes a mode generating circuit, a power supply voltage selection circuit, and at least one fuse unit. The mode generating circuit generates a plurality of mode signals. The power supply voltage selection circuit selects one out of a plurality of power supply voltages in response to the plurality of mode signals and outputs the selected power supply voltage to a first node. Each of the fuse units is coupled between the first node and a ground voltage and uses the selected power supply voltage as a power supply voltage for a logic operation. Thus, a semiconductor device including the fuse circuit may accurately test a connection state of a fuse.