中科微点-全球专利检索

  1. Login
  2. Sign Up

Search Results

65 records (took 0.043 seconds)

    Embedded semiconductor power modules and packages
    1.
    发明授权
    Embedded semiconductor power modules and packages 失效
    嵌入式半导体电源模块和封装

    公开(公告)号：US08421204B2

    公开(公告)日：2013-04-16

    申请号：US13110865

    申请日：2011-05-18

    Applicant: Yong Liu ,  Qiuxiao Qian ,  Yumin Liu

    Inventor： Yong Liu ,  Qiuxiao Qian ,  Yumin Liu

    IPC: H01L23/52 ,  H01L21/00

    CPC classification number: H01L21/56 ,  H01L23/3107 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/96 ,  H01L25/16 ,  H01L25/162 ,  H01L2224/04105 ,  H01L2224/32245 ,  H01L2224/73267 ,  H01L2224/92244 ,  H01L2924/12042 ,  H01L2924/13055 ,  H01L2924/13091 ,  H05K1/185 ,  H01L2924/00

    Abstract: Disclosed are semiconductor die packages constructed from modules of embedded semiconductor dice and electrical components. In one embodiment, a semiconductor die package comprises a first module and a second module attached to the first module. One or more semiconductor dice are embedded in the first module, and one or more electrical components, such as surface-mounted components, are embedded in the second module. The first module may be formed by a lamination process, and the second module may be formed by a lamination process or a molding process. Patterned metal layers and vias provide electrical interconnections to the package and among the die and components of the package. The second module may be attached to the first module by coupling interconnect lands of separately manufactured modules to one another, or may be directly attached by lamination or molding.

    Abstract translation: 公开了由嵌入式半导体芯片和电气部件的模块构成的半导体管芯封装。 在一个实施例中，半导体管芯封装包括第一模块和连接到第一模块的第二模块。 一个或多个半导体裸片嵌入在第一模块中，并且一个或多个电组件，例如表面安装组件，嵌入在第二模块中。 第一模块可以通过层压工艺形成，并且第二模块可以通过层压工艺或模制工艺形成。 图案化的金属层和通孔提供对封装以及芯片和封装的部件之间的电互连。 第二模块可以通过将单独制造的模块的互连焊盘彼此连接，或者可以通过层压或模制来直接附接到第一模块。

    Package with overlapping devices
    3.
    发明授权
    Package with overlapping devices 有权
    包装重叠设备

    公开(公告)号：US07791084B2

    公开(公告)日：2010-09-07

    申请号：US11971512

    申请日：2008-01-09

    Applicant: Yong Liu ,  Yumin Liu

    Inventor： Yong Liu ,  Yumin Liu

    IPC: H01L31/16

    CPC classification number: H01L25/167 ,  H01L2224/48091 ,  H01L2924/13091 ,  H01L2924/00014 ,  H01L2924/00

    Abstract: A die package is disclosed. The die package includes a substrate, a first device attached to the substrate, and a leadframe structure attached to the substrate. The leadframe structure includes a portion disposed over the first device, and a second device is attached to the first portion of the leadframe structure.

    Abstract translation: 公开了一种模具包装。 模具封装包括基板，附接到基板的第一装置和附接到基板的引线框架结构。 引线框架结构包括设置在第一设备上的部分，并且第二设备附接到引线框架结构的第一部分。

    Ni catalysts and methods for alkane dehydrogenation
    7.
    发明申请
    Ni catalysts and methods for alkane dehydrogenation 有权
    镍催化剂和烷烃脱氢方法

    公开(公告)号：US20070197847A1

    公开(公告)日：2007-08-23

    申请号：US11786573

    申请日：2007-04-11

    Applicant: Yumin Liu

    Inventor： Yumin Liu

    IPC: C07C17/00 ,  C07C5/333

    CPC classification number: C07C45/34 ,  B01J23/76 ,  B01J23/80 ,  B01J23/83 ,  B01J23/8474 ,  B01J23/8476 ,  C07C5/48 ,  C07C45/33 ,  C07C45/35 ,  C07C51/25 ,  C07C2521/04 ,  C07C2521/06 ,  C07C2523/06 ,  C07C2523/10 ,  C07C2523/20 ,  C07C2523/30 ,  C07C2523/75 ,  C07C2523/755 ,  C07C11/02 ,  C07C47/22 ,  C07C49/08 ,  C07C49/10 ,  C07C47/21 ,  C07C49/205 ,  C07C53/08

    Abstract: Catalysts and methods for alkane oxydehydrogenation are disclosed. The catalysts of the invention generally comprise (i) nickel or a nickel-containing compound and (ii) at least one or more of titanium (Ti), tantalum (Ta), niobium (Nb), hafnium (Hf), tungsten (W), yttrium (Y), zinc (Zn), zirconium (Zr), or aluminum (Al), or a compound containing one or more of such element(s). In preferred embodiments, the catalyst is a supported catalyst, the alkane is selected from the group consisting of ethane, propane, isobutane, n-butane and ethyl chloride, molecular oxygen is co-fed with the alkane to a reaction zone maintained at a temperature ranging from about 250° C. to about 350° C., and the ethane is oxidatively dehydrogenated to form the corresponding alkene with an alkane conversion of at least about 10% and an alkene selectivity of at least about 70%.

    Abstract translation: 公开了烷烃氧化脱氢的催化剂和方法。 本发明的催化剂通常包括（i）镍或含镍化合物和（ii）钛（Ti），钽（Ta），铌（Nb），铪（Hf），钨（W）中的至少一种或多种 ），钇（Y），锌（Zn），锆（Zr）或铝（Al），或含有这些元素中的一种或多种的化合物。 在优选的实施方案中，催化剂是负载催化剂，烷烃选自乙烷，丙烷，异丁烷，正丁烷和乙基氯，分子氧与烷烃共同进料至维持在温度 范围为约250℃至约350℃，并且乙烷被氧化脱氢以形成相应的烯烃，烷烃转化率为至少约10％，烯烃选择性为至少约70％。

Patent Agency Ranking