公开(公告)号：US08421204B2

公开(公告)日：2013-04-16

申请号：US13110865

申请日：2011-05-18

申请人： Yong Liu ,  Qiuxiao Qian ,  Yumin Liu

发明人： Yong Liu ,  Qiuxiao Qian ,  Yumin Liu

IPC分类号： H01L23/52 ,  H01L21/00

CPC分类号： H01L21/56 ,  H01L23/3107 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/96 ,  H01L25/16 ,  H01L25/162 ,  H01L2224/04105 ,  H01L2224/32245 ,  H01L2224/73267 ,  H01L2224/92244 ,  H01L2924/12042 ,  H01L2924/13055 ,  H01L2924/13091 ,  H05K1/185 ,  H01L2924/00

摘要： Disclosed are semiconductor die packages constructed from modules of embedded semiconductor dice and electrical components. In one embodiment, a semiconductor die package comprises a first module and a second module attached to the first module. One or more semiconductor dice are embedded in the first module, and one or more electrical components, such as surface-mounted components, are embedded in the second module. The first module may be formed by a lamination process, and the second module may be formed by a lamination process or a molding process. Patterned metal layers and vias provide electrical interconnections to the package and among the die and components of the package. The second module may be attached to the first module by coupling interconnect lands of separately manufactured modules to one another, or may be directly attached by lamination or molding.

摘要翻译： 公开了由嵌入式半导体芯片和电气部件的模块构成的半导体管芯封装。 在一个实施例中，半导体管芯封装包括第一模块和连接到第一模块的第二模块。 一个或多个半导体裸片嵌入在第一模块中，并且一个或多个电组件，例如表面安装组件，嵌入在第二模块中。 第一模块可以通过层压工艺形成，并且第二模块可以通过层压工艺或模制工艺形成。 图案化的金属层和通孔提供对封装以及芯片和封装的部件之间的电互连。 第二模块可以通过将单独制造的模块的互连焊盘彼此连接，或者可以通过层压或模制来直接附接到第一模块。

公开(公告)号：US20110070699A1

公开(公告)日：2011-03-24

申请号：US12886614

申请日：2010-09-21

申请人： Yong Liu ,  Yumin Liu ,  Hua Yang ,  Tiburcio A. Maldo ,  Margie T. Rios

发明人： Yong Liu ,  Yumin Liu ,  Hua Yang ,  Tiburcio A. Maldo ,  Margie T. Rios

IPC分类号： H01L21/60

CPC分类号： H01L25/18 ,  H01L24/48 ,  H01L24/49 ,  H01L25/072 ,  H01L2224/48095 ,  H01L2224/48227 ,  H01L2224/49171 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/13055 ,  H01L2924/14 ,  H01L2924/15747 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599

摘要： A 3D smart power module for power control, such as a three phase power control module, includes a two sided printed circuit (PC) board with power semiconductor devices attached to one side and control semiconductor devices attached to the other side. The power semiconductor devices are die bonded to a direct bonded copper substrate which has a bottom surface exposed in the molded package. In one embodiment the module has 27 external connectors attached to one side of the PC board and arranged in the form of a ball grid array.

摘要翻译： 用于功率控制的3D智能功率模块，例如三相电源控制模块，包括一个双面印刷电路（PC）板，其功率半导体器件连接到一侧并控制连接到另一侧的半导体器件。 功率半导体器件被封装在直接接合的铜基底上，该基底具有在模制封装中暴露的底部表面。 在一个实施例中，该模块具有连接到PC板一侧的27个外部连接器，并以球栅阵列的形式布置。

公开(公告)号：US07791084B2

公开(公告)日：2010-09-07

申请号：US11971512

申请日：2008-01-09

申请人： Yong Liu ,  Yumin Liu

发明人： Yong Liu ,  Yumin Liu

IPC分类号： H01L31/16

CPC分类号： H01L25/167 ,  H01L2224/48091 ,  H01L2924/13091 ,  H01L2924/00014 ,  H01L2924/00

摘要： A die package is disclosed. The die package includes a substrate, a first device attached to the substrate, and a leadframe structure attached to the substrate. The leadframe structure includes a portion disposed over the first device, and a second device is attached to the first portion of the leadframe structure.

摘要翻译： 公开了一种模具包装。 模具封装包括基板，附接到基板的第一装置和附接到基板的引线框架结构。 引线框架结构包括设置在第一设备上的部分，并且第二设备附接到引线框架结构的第一部分。

公开(公告)号：US20090200657A1

公开(公告)日：2009-08-13

申请号：US12028051

申请日：2008-02-08

申请人： Yong Liu ,  Yumin Liu ,  Hua Yang ,  Tiburcio A. Maldo ,  Margie T. Rios

发明人： Yong Liu ,  Yumin Liu ,  Hua Yang ,  Tiburcio A. Maldo ,  Margie T. Rios

IPC分类号： H01L23/488 ,  H01L21/60

CPC分类号： H01L25/18 ,  H01L24/48 ,  H01L24/49 ,  H01L25/072 ,  H01L2224/48095 ,  H01L2224/48227 ,  H01L2224/49171 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/13055 ,  H01L2924/14 ,  H01L2924/15747 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599

摘要： A 3D smart power module for power control, such as a three phase power control module, includes a two sided printed circuit (PC) board with power semiconductor devices attached to one side and control semiconductor devices attached to the other side. The power semiconductor devices are die bonded to a direct bonded copper substrate which has a bottom surface exposed in the molded package. In one embodiment the module has 27 external connectors attached to one side of the PC board and arranged in the form of a ball grid array.

摘要翻译： 用于功率控制的3D智能功率模块，例如三相电源控制模块，包括一个双面印刷电路（PC）板，其功率半导体器件连接到一侧并控制连接到另一侧的半导体器件。 功率半导体器件被封装在直接接合的铜基底上，该基底具有在模制封装中暴露的底部表面。 在一个实施例中，该模块具有连接到PC板一侧的27个外部连接器，并以球栅阵列的形式布置。

公开(公告)号：US20090174046A1

公开(公告)日：2009-07-09

申请号：US11970087

申请日：2008-01-07

申请人： Yong Liu ,  Margie T. Rios ,  Hua Yang ,  Yumin Liu ,  Tiburcio A. Maldo

发明人： Yong Liu ,  Margie T. Rios ,  Hua Yang ,  Yumin Liu ,  Tiburcio A. Maldo

IPC分类号： H01L23/495 ,  H01L21/60

CPC分类号： H01L23/49537 ,  H01L23/3107 ,  H01L23/4951 ,  H01L23/4952 ,  H01L23/49551 ,  H01L23/49575 ,  H01L24/27 ,  H01L24/48 ,  H01L24/49 ,  H01L24/83 ,  H01L25/16 ,  H01L2224/27436 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/48472 ,  H01L2224/4903 ,  H01L2224/49051 ,  H01L2224/49111 ,  H01L2224/49171 ,  H01L2224/83101 ,  H01L2224/83191 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/05599

摘要： A two tier power module has, in one form thereof, a PC board having upper and lower traces with an opening in the insulating material that contains a power device which has upward extending solder bump connections. An upper leadframe is mounted on the solder bumps and the upper tracks of the PC board. Vias in the PC board connect selected upper and lower traces. A control device is mounted atop the leadframe and wire bonded to the leadframe, and the assembly is encapsulated leaving exposed the bottom surfaces of the lower traces of the PC board as external connections. In another form the PC board is replaced by a planar leadframe and the upper leadframe has stepped sections which make connections with the planar leadframe, the bottom surfaces of the planar leadframe forming external connections of the module.

摘要翻译： 两层电源模块的一种形式是具有上和下迹线的PC板，绝缘材料中具有开口，该开口包含具有向上延伸的焊料凸点连接的功率器件。 上引线框架安装在焊盘和PC板的上轨道上。 PC板上的通孔连接选定的上下轨迹。 控制装置安装在引线框架顶部，引线框架连接在一起，组件被封装，从而将PC板的下部走线的底面暴露为外部连接。 在另一种形式中，PC板由平面引线框架代替，并且上引线框架具有与平面引线框架连接的阶梯部分，平面引线框架的底表面形成模块的外部连接。

公开(公告)号：US20080287289A1

公开(公告)日：2008-11-20

申请号：US12183244

申请日：2008-07-31

申请人： Tao Wang ,  Les Wade ,  Ioan Nicolau ,  Barbara Kimmich ,  Victor Wong ,  Yumin Liu ,  Jun Han ,  Valery Sokolovskii ,  Alfred Hagemeyer ,  David M. Lowe ,  Anthony Volpe ,  Karin Yaccato

发明人： Tao Wang ,  Les Wade ,  Ioan Nicolau ,  Barbara Kimmich ,  Victor Wong ,  Yumin Liu ,  Jun Han ,  Valery Sokolovskii ,  Alfred Hagemeyer ,  David M. Lowe ,  Anthony Volpe ,  Karin Yaccato

IPC分类号： B01J23/56 ,  B01J31/04

CPC分类号： B01J23/58 ,  B01J23/464 ,  B01J23/52 ,  B01J33/00 ,  B01J35/002 ,  B01J35/0026 ,  B01J35/008 ,  B01J35/0086 ,  B01J35/026 ,  B01J35/1014 ,  B01J35/1019 ,  B01J35/1042 ,  B01J37/0201 ,  B01J37/0244 ,  B01J37/16 ,  C07C67/055 ,  C07C69/15

摘要： The present invention addresses at least four different aspects relating to catalyst structure, methods of making those catalysts and methods of using those catalysts for making alkenyl alkanoates. Separately or together in combination, the various aspects of the invention are directed at improving the production of alkenyl alkanoates and VA in particular, including reduction of by-products and improved production efficiency. A first aspect of the present invention pertains to a unique palladium/gold catalyst or pre-catalyst (optionally calcined) that includes rhodium or another metal. A second aspect pertains to a palladium/gold catalyst or pre-catalyst that is based on a layered support material where one layer of the support material is substantially free of catalytic components. A third aspect pertains to a palladium/gold catalyst or pre-catalyst on a zirconia containing support material. A fourth aspect pertains to a palladium/gold catalyst or pre-catalyst that is produced from substantially chloride free catalytic components.

摘要翻译： 本发明涉及与催化剂结构有关的至少四个不同方面，制备这些催化剂的方法和使用这些催化剂制备烯基链烷酸酯的方法。 本发明的单独或一起组合地涉及改进烯基链烷酸酯和VA的生产，特别是包括副产物的还原和提高的生产效率。 本发明的第一方面涉及包含铑或其它金属的独特的钯/金催化剂或预催化剂（任选煅烧的）。 第二方面涉及基于层状载体材料的钯/金催化剂或预催化剂，其中一层载体材料基本上不含催化组分。 第三方面涉及在含氧化锆载体材料上的钯/金催化剂或预催化剂。 第四方面涉及由基本上不含氯的催化组分制备的钯/金催化剂或预催化剂。

公开(公告)号：US20070197847A1

公开(公告)日：2007-08-23

申请号：US11786573

申请日：2007-04-11

申请人： Yumin Liu

发明人： Yumin Liu

IPC分类号： C07C17/00 ,  C07C5/333

CPC分类号： C07C45/34 ,  B01J23/76 ,  B01J23/80 ,  B01J23/83 ,  B01J23/8474 ,  B01J23/8476 ,  C07C5/48 ,  C07C45/33 ,  C07C45/35 ,  C07C51/25 ,  C07C2521/04 ,  C07C2521/06 ,  C07C2523/06 ,  C07C2523/10 ,  C07C2523/20 ,  C07C2523/30 ,  C07C2523/75 ,  C07C2523/755 ,  C07C11/02 ,  C07C47/22 ,  C07C49/08 ,  C07C49/10 ,  C07C47/21 ,  C07C49/205 ,  C07C53/08

摘要： Catalysts and methods for alkane oxydehydrogenation are disclosed. The catalysts of the invention generally comprise (i) nickel or a nickel-containing compound and (ii) at least one or more of titanium (Ti), tantalum (Ta), niobium (Nb), hafnium (Hf), tungsten (W), yttrium (Y), zinc (Zn), zirconium (Zr), or aluminum (Al), or a compound containing one or more of such element(s). In preferred embodiments, the catalyst is a supported catalyst, the alkane is selected from the group consisting of ethane, propane, isobutane, n-butane and ethyl chloride, molecular oxygen is co-fed with the alkane to a reaction zone maintained at a temperature ranging from about 250° C. to about 350° C., and the ethane is oxidatively dehydrogenated to form the corresponding alkene with an alkane conversion of at least about 10% and an alkene selectivity of at least about 70%.

摘要翻译： 公开了烷烃氧化脱氢的催化剂和方法。 本发明的催化剂通常包括（i）镍或含镍化合物和（ii）钛（Ti），钽（Ta），铌（Nb），铪（Hf），钨（W）中的至少一种或多种 ），钇（Y），锌（Zn），锆（Zr）或铝（Al），或含有这些元素中的一种或多种的化合物。 在优选的实施方案中，催化剂是负载催化剂，烷烃选自乙烷，丙烷，异丁烷，正丁烷和乙基氯，分子氧与烷烃共同进料至维持在温度 范围为约250℃至约350℃，并且乙烷被氧化脱氢以形成相应的烯烃，烷烃转化率为至少约10％，烯烃选择性为至少约70％。

公开(公告)号：US20070191665A1

公开(公告)日：2007-08-16

申请号：US11786489

申请日：2007-04-11

申请人： Yumin Liu

发明人： Yumin Liu

IPC分类号： C07C5/333

CPC分类号： C07C45/34 ,  B01J23/76 ,  B01J23/80 ,  B01J23/83 ,  B01J23/8474 ,  B01J23/8476 ,  C07C5/48 ,  C07C45/33 ,  C07C45/35 ,  C07C51/25 ,  C07C2521/04 ,  C07C2521/06 ,  C07C2523/06 ,  C07C2523/10 ,  C07C2523/20 ,  C07C2523/30 ,  C07C2523/75 ,  C07C2523/755 ,  C07C11/02 ,  C07C47/22 ,  C07C49/08 ,  C07C49/10 ,  C07C47/21 ,  C07C49/205 ,  C07C53/08

摘要： Catalysts and methods for alkane oxydehydrogenation are disclosed. The catalysts of the invention generally comprise (i) nickel or a nickel-containing compound and (ii) at least one or more of titanium (Ti), tantalum (Ta), niobium (Nb), hafnium (Hf), tungsten (W), yttrium (Y), zinc (Zn), zirconium (Zr), or aluminum (Al), or a compound containing one or more of such element(s). In preferred embodiments, the catalyst is a supported catalyst, the alkane is selected from the group consisting of ethane, propane, isobutane, n-butane and ethyl chloride, molecular oxygen is co-fed with the alkane to a reaction zone maintained at a temperature ranging from about 250° C. to about 350° C., and the ethane is oxidatively dehydrogenated to form the corresponding alkene with an alkane conversion of at least about 10% and an alkene selectivity of at least about 70%.

公开(公告)号：US20070007372A1

公开(公告)日：2007-01-11

申请号：US11519358

申请日：2006-09-11

申请人： Claus Lugmair ,  Alfred Hagemeyer ,  Lynn Van Erden ,  Anthony Volpe ,  David Lowe ,  Yumin Liu

发明人： Claus Lugmair ,  Alfred Hagemeyer ,  Lynn Van Erden ,  Anthony Volpe ,  David Lowe ,  Yumin Liu

IPC分类号： B02C1/00

CPC分类号： B07B1/00 ,  B01J19/0046 ,  B01J35/10 ,  B01J37/0036 ,  B01J37/009 ,  B01J2219/00313 ,  B01J2219/00319 ,  B01J2219/00351 ,  B01J2219/00481 ,  B01J2219/00484 ,  B01J2219/00495 ,  B01J2219/00585 ,  B01J2219/007 ,  B01J2219/00704 ,  B01J2219/00745 ,  B01J2219/00747 ,  B01J2219/00756 ,  B01L3/5025 ,  B22F2998/00 ,  C40B30/08 ,  C40B40/18 ,  G01N31/10 ,  B22F9/04

摘要： Methods and apparatus for combinatorial (i.e., high-throughput) materials research, such as catalysis research, that involves parallel apparatus for simultaneously effecting mechanical treatments such as grinding, mixing, pressing, crushing, sieving, and/or fractionating of such materials are disclosed. The methods and apparatus are useful for mechanically treating catalysis materials and other solid materials, including without limitation, electronic materials such as phosphors, colorants such as pigments, and pharmaceuticals such as crystalline drugs or drug candidates. The simultaneous protocols and parallel apparatus offer substantial improvements in overall throughput for preparing arrays of materials, such as catalysis materials.

摘要翻译： 公开了用于组合（即，高通量）材料研究的方法和装置，例如催化研究，涉及用于同时进行诸如研磨，混合，压制，粉碎，筛分和/或分级的机械处理的并行装置。 。 所述方法和装置可用于机械处理催化材料和其它固体材料，包括但不限于电子材料如磷光体，着色剂如颜料，以及药物如结晶药物或药物候选物。 同时协议和并行设备在制备材料阵列（例如催化材料）方面提供总体通量的显着改进。

公开(公告)号：US06677497B2

公开(公告)日：2004-01-13

申请号：US10002339

申请日：2001-10-25

申请人： Yumin Liu

发明人： Yumin Liu

IPC分类号： C07C5327

CPC分类号： C07C5/3332 ,  B01J23/002 ,  B01J23/83 ,  B01J23/847 ,  B01J2523/00 ,  C07C2523/755 ,  Y02P20/52 ,  C07C11/04 ,  B01J2523/54 ,  B01J2523/56 ,  B01J2523/847 ,  B01J2523/3775 ,  B01J2523/57 ,  B01J2523/3787 ,  B01J2523/47 ,  B01J2523/53 ,  B01J2523/3762 ,  B01J2523/23 ,  B01J2523/3737 ,  B01J2523/375 ,  B01J2523/22 ,  B01J2523/48 ,  B01J2523/24 ,  B01J2523/3725 ,  B01J2523/64 ,  B01J2523/43 ,  B01J2523/55 ,  B01J2523/3712 ,  B01J2523/15 ,  B01J2523/845 ,  B01J2523/17 ,  B01J2523/67

摘要： Processes for oxidative dehydrogenation of alkane to one or more olefins, exemplified by ethane to ethylene, are disclosed using novel catalysts. The catalysts comprise a mixture of metal oxides having as an important component nickel oxide (NiO), which give high conversion and selectivity in the process. For example, the catalyst can be used to make ethylene by contacting it with a gas mixture containing ethane and oxygen. The gas mixture may optionally contain ethylene, an inert diluent such as nitrogen, or both ethylene and an inert diluent.

摘要翻译： 使用新型催化剂公开了将烷烃氧化脱氢成一种或多种烯烃的方法，例如乙烷至乙烯。 催化剂包含具有作为重要组分的氧化镍（NiO）的金属氧化物的混合物，其在该过程中具有高的转化率和选择性。 例如，催化剂可用于通过使乙烯与含有乙烷和氧气的气体混合物接触来制备乙烯。 气体混合物可任选地含有乙烯，惰性稀释剂如氮气，或乙烯和惰性稀释剂。