公开(公告)号：US07741131B2

公开(公告)日：2010-06-22

申请号：US11754214

申请日：2007-05-25

Applicant: Yunlong Sun ,  Steve Harris

Inventor： Yunlong Sun ,  Steve Harris

IPC: H01L21/00

CPC classification number: H01L21/268 ,  H01L22/12

Abstract: A solution to an interference effect problem associated with laser processing of target structures entails adjusting laser pulse energy or other laser beam parameter, such as laser pulse temporal shape, based on light reflection information of the target structure and passivation layers stacked across a wafer surface or among multiple wafers in a group of wafers. Laser beam reflection measurements on a target link measurement structure and in a neighboring passivation layer area unoccupied by a link enable calculation of the laser pulse energy adjustment for a more consistent processing result without causing damage to the wafer. For thin film trimming on a wafer, similar reflection measurement information of the laser beam incident on the thin film structure and the passivation layer structure with no thin film present can also deliver the needed information for laser parameter selection to ensure better processing quality.

Abstract translation: 与目标结构的激光处理相关的干扰效应问题的解决方案需要基于目标结构的光反射信息和层叠在晶片表面上的钝化层来调整激光脉冲能量或其他激光束参数，例如激光脉冲时间形状，或者 在一组晶片中的多个晶片之间。 在目标链路测量结构上的激光束反射测量以及由链路未占据的相邻钝化层区域中的激光束反射测量使得能够计算激光脉冲能量调节以获得更一致的处理结果而不会损坏晶片。 对于晶片上的薄膜修整，入射到薄膜结构上的激光束的类似反射测量信息和不存在薄膜的钝化层结构也可以提供激光参数选择所需的信息，以确保更好的处理质量。

公开(公告)号：US20090245302A1

公开(公告)日：2009-10-01

申请号：US12060076

申请日：2008-03-31

Applicant: Brian W. Baird ,  Clint R. Vandergiessen ,  Steve Swaringen ,  Robert Hainsey ,  Yunlong Sun ,  Kelly J. Bruland ,  Andrew Hooper

Inventor： Brian W. Baird ,  Clint R. Vandergiessen ,  Steve Swaringen ,  Robert Hainsey ,  Yunlong Sun ,  Kelly J. Bruland ,  Andrew Hooper

IPC: H01S3/10

CPC classification number: H01S3/1305 ,  B23K26/0622 ,  H01S3/0057 ,  H01S3/102

Abstract: Processing workpieces such as semiconductor wafers or other materials with a laser includes selecting a target to process that corresponds to a target class associated with a predefined temporal pulse profile. The temporal pulse profile includes a first portion that defines a first time duration, and a second portion that defines a second time duration. A method includes generating a laser pulse based on laser system input parameters configured to shape the laser pulse according to the temporal pulse profile, detecting the generated laser pulse, comparing the generated laser pulse to the temporal pulse profile, and adjusting the laser system input parameters based on the comparison.

Abstract translation: 使用激光加工诸如半导体晶片或其他材料的工件包括选择对应于与预定义的时间脉冲轮廓相关联的目标类别的目标。 时间脉冲分布包括限定第一持续时间的第一部分和限定第二持续时间的第二部分。 一种方法包括：基于激光系统输入参数产生激光脉冲，所述激光系统输入参数被配置为根据时间脉冲分布来形成激光脉冲，检测所产生的激光脉冲，将所产生的激光脉冲与时间脉冲分布进行比较，以及调整激光系统输入参数 基于比较。

公开(公告)号：US07482551B2

公开(公告)日：2009-01-27

申请号：US11286132

申请日：2005-11-23

Applicant: Yunlong Sun ,  Edward J. Swenson ,  Richard S. Harris

Inventor： Yunlong Sun ,  Edward J. Swenson ,  Richard S. Harris

IPC: B23K26/02 ,  B23K26/08 ,  H01L21/77

CPC classification number: B23K26/04 ,  B23K26/0604 ,  B23K26/0613 ,  B23K26/0622 ,  B23K26/0624 ,  B23K26/067 ,  B23K26/361 ,  G03F7/70041 ,  G03F7/70725 ,  H01L21/76894 ,  H01L23/5258 ,  H01L2924/0002 ,  H01S3/005 ,  H01S3/0057 ,  H01S3/0085 ,  H01S3/0092 ,  H01S3/1118 ,  H01S3/2383 ,  H01S5/4012 ,  Y10S438/94 ,  H01L2924/00

Abstract: A set (50) of laser pulses (52) is employed to sever a conductive link (22) in a memory or other IC chip. The duration of the set (50) is preferably shorter than 1,000 ns; and the pulse width of each laser pulse (52) within the set (50) is preferably within a range of about 0.1 ps to 30 ns. The set (50) can be treated as a single “pulse” by conventional laser positioning systems (62) to perform on-the-fly link removal without stopping whenever the laser system (60) fires a set (50) of laser pulses (52) at each link (22). Conventional IR wavelengths or their harmonics can be employed.

Abstract translation: 使用一组（50）激光脉冲（52）来切断存储器或其它IC芯片中的导电链路（22）。 组（50）的持续时间优选短于1,000ns; 并且组（50）内的每个激光脉冲（52）的脉冲宽度优选在约0.1ps至30ns的范围内。 传统的激光定位系统（62）可将组（50）视为单个“脉冲”，以便在激光系统（60）激发一组（50）激光脉冲（50） 52）。 可以使用传统的IR波长或它们的谐波。

公开(公告)号：US20080296273A1

公开(公告)日：2008-12-04

申请号：US11757253

申请日：2007-06-01

Applicant: Weisheng Lei ,  Hisashi Matsumoto ,  Gregg Hardy ,  Yunlong Sun

Inventor： Weisheng Lei ,  Hisashi Matsumoto ,  Gregg Hardy ,  Yunlong Sun

IPC: B23K26/38

CPC classification number: B23K26/384 ,  B23K26/389 ,  B23K2101/36 ,  H05K3/0035 ,  H05K2201/09827

Abstract: A method of and an apparatus for drilling blind vias with selectable tapers in multilayer electronic circuits permit forming electrical connections between layers while maintaining quality and throughput. The method relies on recognizing that the top diameter of the via and the bottom diameter of the via, which define the taper, are functions of two separate sets of equations. Simultaneous solution of these equations yields a solution space that enables optimization of throughput while maintaining selected taper and quality using temporally unmodified Q-switched CO2 laser pulses with identical pulse parameters. Real time pulse tailoring is not required; therefore, system complexity and cost may be reduced.

Abstract translation: 用于在多层电子电路中钻出具有可选锥度的盲孔的方法和装置允许在层之间形成电连接，同时保持质量和生产量。 该方法依赖于识别定义锥度的通孔的顶部直径和通孔的底部直径是两个单独的方程组的函数。 这些方程的同时解决方案产生一个解空间，可以优化吞吐量，同时使用具有相同脉冲参数的临时未修改的Q开关CO2激光脉冲保持选定的锥度和质量。 不需要实时脉冲裁剪; 因此，系统复杂性和成本可能会降低。

公开(公告)号：US07241669B2

公开(公告)日：2007-07-10

申请号：US10887662

申请日：2004-07-09

Applicant: Edward J. Swenson ,  Yunlong Sun ,  Manoj Kumar Sammi ,  Jay Christopher Johnson ,  Doug Garcia ,  Rupendra M. Anklekar

Inventor： Edward J. Swenson ,  Yunlong Sun ,  Manoj Kumar Sammi ,  Jay Christopher Johnson ,  Doug Garcia ,  Rupendra M. Anklekar

IPC: H01L21/00

CPC classification number: B23K26/0622 ,  B23K26/364 ,  B23K26/40 ,  B23K2101/40 ,  B23K2103/52 ,  B28D5/0011 ,  H01L2224/16 ,  H01L2924/0102 ,  H01L2924/01067 ,  H01L2924/01068 ,  H01L2924/01077 ,  H01L2924/09701 ,  Y10S438/94

Abstract: A method of forming a scribe line having a sharp snap line entails directing a UV laser beam along a ceramic or ceramic-like substrate such that a portion of the thickness of the substrate is removed. The UV laser beam forms a scribe line in the substrate without appreciable substrate melting so that a clearly defined snap line forms a region of high stress concentration extending into the thickness of the substrate. Consequently, multiple depthwise cracks propagate into the thickness of the substrate in the region of high stress concentration in response to a breakage force applied to either side of the scribe line to effect clean fracture of the substrate into separate circuit components. The formation of this region facilitates higher precision fracture of the substrate while maintaining the integrity of the interior structure of each component during and after application of the breakage force.

Abstract translation: 形成具有尖锐捕捉线的划线的方法需要沿着陶瓷或陶瓷状衬底引导UV激光束，使得去除衬底厚度的一部分。 UV激光束在衬底中形成划线，而没有明显的衬底熔化，使得明确限定的捕捉线形成延伸到衬底厚度的高应力集中区域。 因此，响应于施加到划线的任一侧的断裂力，多个深度裂纹在高应力集中区域中传播到基板的厚度中，以使基板清洁断裂成单独的电路部件。 该区域的形成促进了基板的高精度断裂，同时在施加破损力的同时保持了每个部件的内部结构的完整性。

公开(公告)号：US20060141680A1

公开(公告)日：2006-06-29

申请号：US11359216

申请日：2006-02-21

Applicant: Yunlong Sun ,  Edward Swenson ,  Richard Harris

Inventor： Yunlong Sun ,  Edward Swenson ,  Richard Harris

IPC: H01L21/82

CPC classification number: B23K26/04 ,  B23K26/0604 ,  B23K26/0613 ,  B23K26/0622 ,  B23K26/0624 ,  B23K26/067 ,  B23K26/361 ,  G03F7/70041 ,  G03F7/70725 ,  H01L21/76894 ,  H01L23/5258 ,  H01L2924/0002 ,  H01S3/005 ,  H01S3/0057 ,  H01S3/0085 ,  H01S3/0092 ,  H01S3/1118 ,  H01S3/2383 ,  H01S5/4012 ,  Y10S438/94 ,  H01L2924/00

Abstract: A set (50) of laser pulses (52) is employed to sever a conductive link (22) in a memory or other IC chip. The duration of the set (50) is preferably shorter than 1,000 ns; and the pulse width of each laser pulse (52) within the set (50) is preferably within a range of about 0.1 ps to 30 ns. The set (50) can be treated as a single “pulse” by conventional laser positioning systems (62) to perform on-the-fly link removal without stopping whenever the laser system (60) fires a set (50) of laser pulses (52) at each link (22). Conventional IR wavelengths or their harmonics can be employed.

Abstract translation: 使用一组（50）激光脉冲（52）来切断存储器或其它IC芯片中的导电链路（22）。 组（50）的持续时间优选短于1,000ns; 并且组（50）内的每个激光脉冲（52）的脉冲宽度优选在约0.1ps至30ns的范围内。 传统的激光定位系统（62）可将组（50）视为单个“脉冲”，以便在激光系统（60）激发一组（50）激光脉冲（50） 52）。 可以使用传统的IR波长或它们的谐波。

公开(公告)号：US20060138107A1

公开(公告)日：2006-06-29

申请号：US11360094

申请日：2006-02-22

Applicant: Yunlong Sun ,  Edward Swenson ,  Richard Harris

Inventor： Yunlong Sun ,  Edward Swenson ,  Richard Harris

IPC: B23K26/16

CPC classification number: B23K26/04 ,  B23K26/0604 ,  B23K26/0613 ,  B23K26/0622 ,  B23K26/0624 ,  B23K26/067 ,  B23K26/361 ,  G03F7/70041 ,  G03F7/70725 ,  H01L21/76894 ,  H01L23/5258 ,  H01L2924/0002 ,  H01S3/005 ,  H01S3/0057 ,  H01S3/0085 ,  H01S3/0092 ,  H01S3/1118 ,  H01S3/2383 ,  H01S5/4012 ,  Y10S438/94 ,  H01L2924/00

Abstract: A set (50) of laser pulses (52) is employed to sever a conductive link (22) in a memory or other IC chip. The duration of the set (50) is preferably shorter than 1,000 ns; and the pulse width of each laser pulse (52) within the set (50) is preferably within a range of about 0.1 ps to 30 ns. The set (50) can be treated as a single “pulse” by conventional laser positioning systems (62) to perform on-the-fly link removal without stopping whenever the laser system (60) fires a set (50) of laser pulses (52) at each link (22). Conventional IR wavelengths or their harmonics can be employed.

公开(公告)号：US20060131284A1

公开(公告)日：2006-06-22

申请号：US11286131

申请日：2005-11-23

Applicant: Yunlong Sun ,  Edward Swenson ,  Richard Harris

Inventor： Yunlong Sun ,  Edward Swenson ,  Richard Harris

IPC: B23K26/16

CPC classification number: B23K26/04 ,  B23K26/0604 ,  B23K26/0613 ,  B23K26/0622 ,  B23K26/0624 ,  B23K26/067 ,  B23K26/361 ,  G03F7/70041 ,  G03F7/70725 ,  H01L21/76894 ,  H01L23/5258 ,  H01L2924/0002 ,  H01S3/005 ,  H01S3/0057 ,  H01S3/0085 ,  H01S3/0092 ,  H01S3/1118 ,  H01S3/2383 ,  H01S5/4012 ,  Y10S438/94 ,  H01L2924/00

Abstract: A set (50) of laser pulses (52) is employed to sever a conductive link (22) in a memory or other IC chip. The duration of the set (50) is preferably shorter than 1,000 ns; and the pulse width of each laser pulse (52) within the set (50) is preferably within a range of about 0.1 ps to 30 ns. The set (50) can be treated as a single “pulse” by conventional laser positioning systems (62) to perform on-the-fly link removal without stopping whenever the laser system (60) fires a set (50) of laser pulses (52) at each link (22). Conventional IR wavelengths or their harmonics can be employed.

公开(公告)号：US06947454B2

公开(公告)日：2005-09-20

申请号：US10611798

申请日：2003-06-30

Applicant: Yunlong Sun ,  Brady E. Nilsen ,  David M. Hemenway ,  Lei Sun

Inventor： Yunlong Sun ,  Brady E. Nilsen ,  David M. Hemenway ,  Lei Sun

IPC: B23K26/06 ,  H01S3/10

CPC classification number: B23K26/06

Abstract: A laser (126) and an AOM (10) are pulsed at substantially regular and substantially similar constant high repetition rates to provide working laser outputs (40) with variable nonimpingement intervals (50) without sacrificing laser pulse-to-pulse energy stability. When a working laser output (40) is demanded, an RF pulse (38) is applied to the AOM (10) in coincidence with the laser output (24) to transmit it to a target. When no working laser output (40) is demanded, an RF pulse (38) is applied to the AOM (10) in noncoincidence with the laser output (24) so it gets blocked. So the average thermal loading on the AOM (10) remains substantially constant regardless of how randomly the working laser outputs (40) are demanded. The AOM (10) can also be used to control the energy of the working laser output (40) by controlling the power of the RF pulse (38) applied. When the RF power is changed, the RF duration (44) of the RF pulse (38) is modified to maintain the constant average RF power. Consistent loading on the AOM (10) eliminates deterioration of laser beam quality and laser beam pointing accuracy associated with thermal loading variation on the AOM (10) and is advantageous for applications such as IC chip link processing where stable working laser outputs (40) with variable output intervals (50) are needed.

Abstract translation: 激光器（126）和AOM（10）以基本上规则和基本类似的恒定高重复率脉冲，以提供具有可变非限制间隔（50）的工作激光输出（40），而不牺牲激光脉冲到脉冲能量稳定性。 当要求工作的激光输出（40）时，与激光输出（24）一致地向AOM（10）施加RF脉冲（38）以将其发射到目标。 当不需要工作的激光输出（40）时，RF激光（38）以与激光输出（24）不一致的方式施加到AOM（10），使其被阻塞。 因此，无论工作激光输出（40）如何随机地要求，AOM（10）上的平均热负载保持基本恒定。 AOM（10）也可用于通过控制所施加的RF脉冲（38）的功率来控制工作激光器输出（40）的能量。 当RF功率改变时，RF脉冲（38）的RF持续时间（44）被修改以保持恒定的平均RF功率。 AOM（10）上的一致负载消除了与AOM（10）上的热负载变化相关的激光束质量和激光束指向精度的劣化，并且对于诸如IC芯片链接处理的应用是有利的，其中稳定的工作激光输出（40）与 需要可变输出间隔（50）。

公开(公告)号：US06919532B2

公开(公告)日：2005-07-19

申请号：US10678951

申请日：2003-10-03

Applicant: Edward J. Swenson ,  John D. Stackpole ,  Yunlong Sun ,  Manoj Sammi

Inventor： Edward J. Swenson ,  John D. Stackpole ,  Yunlong Sun ,  Manoj Sammi

IPC: B23K26/18 ,  B23K26/38 ,  H05K13/00 ,  B23K26/00

CPC classification number: H05K13/0084 ,  B23K26/0006 ,  B23K26/18 ,  B23K26/361 ,  B23K26/384 ,  B23K2103/50

Abstract: A laser beam (102) cuts through a component carrier mask (96) made of thin elastomeric material such as silicone rubber to form slots (98) having slot openings of a desired shape. In a preferred embodiment, a light absorptivity enhancement material such as iron oxide introduced into the silicone rubber causes formation of a flexible support blank that operationally adequately absorbs light within a light absorption wavelength range. A beam positioner (106) receiving commands from a programmed controller causes a UV laser beam of a wavelength that is within the light absorption wavelength range to cut into the mask multiple slots with repeatable, precise dimensions. Each of the slots cut has opposed side margins that define between them a slot opening of suitable shape to receive a miniature component (10) and to exert on it optimal holding and release forces.

Abstract translation: 激光束（102）切穿由诸如硅橡胶的薄弹性体材料制成的部件载体掩模（96），以形成具有所需形状的槽口的槽（98）。 在优选的实施方案中，引入到硅橡胶中的诸如氧化铁的光吸收增强材料引起形成柔性支撑坯料，其可操作地充分吸收光吸收波长范围内的光。 从编程的控制器接收命令的光束定位器（106）使得在光吸收波长范围内的波长的UV激光束可以重复精确的尺寸切割成多个槽。 切割的每个切口具有相对的侧边缘，其在它们之间限定适当形状的狭槽开口，以接收微型部件（10）并且施加最佳的保持和释放力。