MEMORY DEVICE HAVING VARIABLE IMPEDANCE MEMORY CELLS AND TIME-TO-TRANSITION SENSING OF DATA STORED THEREIN

    公开(公告)号:US20240420759A1

    公开(公告)日:2024-12-19

    申请号:US18815007

    申请日:2024-08-26

    Applicant: R&D 3 LLC

    Abstract: The present disclosure relates to circuits, systems, and methods of operation for a memory device. In an example, a memory device includes a plurality of memory cells, each memory cell having a data node, a first transistor, a second transistor, a third transistor, a write port for writing data to be stored in the memory cell, and a read port having a variable impedance that varies in accordance with a respective data value stored therein. The data value is one of at least three different data values that the memory cell is capable of storing. The second transistor and third transistor are coupled in series between the read port and a fixed reference. The first transistor is coupled between the write port and the data node.

    High-density memory cells and layouts thereof

    公开(公告)号:US12051457B2

    公开(公告)日:2024-07-30

    申请号:US17664465

    申请日:2022-05-23

    CPC classification number: G11C11/405

    Abstract: A device includes a write bit line and a read bit line extending in a first direction, and a write word line and a read word line extending in a second direction perpendicular to the first direction. The device further includes a memory cell including a write transistor and a read transistor. The write transistor includes a first gate connected to the write word line, a first source/drain connected to the write bit line, and a second source/drain connected to a data storage node. The read transistor includes a second gate connected to the data storage node, a third source/drain connected to the read bit line, and a fourth source/drain connected to the read word line.

    SEMICONDUCTOR DEVICE AND WIRELESS COMMUNICATION DEVICE

    公开(公告)号:US20220310148A1

    公开(公告)日:2022-09-29

    申请号:US17615867

    申请日:2020-06-30

    Abstract: To provide a semiconductor device with a novel structure. The semiconductor device includes a plurality of constant current circuits each given a digital signal. The constant current circuits each include a first transistor to a third transistor. The first transistor has a function of making a first current corresponding to set analog potential flow therethrough. The second transistor has a function of controlling the first current flowing between a source and a drain of the first transistor, in response to the digital signal. The third transistor has a function of holding the analog potential supplied to a gate of the first transistor, by being turned off. The first transistor to the third transistor each include a semiconductor layer including an oxide semiconductor in a channel formation region.

    MEMORY DEVICE, SEMICONDUCTOR DEVICE, AND ELECTRONIC DEVICE

    公开(公告)号:US20220209016A1

    公开(公告)日:2022-06-30

    申请号:US17694787

    申请日:2022-03-15

    Abstract: A memory device which includes a gain-cell memory cell formed using an n-channel transistor and in which a potential lower than a potential applied to a bit line is not necessary is provided. Memory cells included in the memory device are arranged in a matrix, and each of the memory cells is connected to a write word line, a write bit line, a read word line, and a read bit line. The write word line is arranged in parallel to one of directions of a row and a column of memory cells arranged in a matrix, and the write bit line is arranged in parallel to the other of the directions of the row and the column. The read word line is arranged in parallel to the one of the directions of the row and the column of the memory cells arranged in a matrix, and the read bit line is arranged in parallel to the other of the directions of the row and the column.

    SEMICONDUCTOR DEVICE AND OPERATION METHOD OF SEMICONDUCTOR DEVICE

    公开(公告)号:US20220172766A1

    公开(公告)日:2022-06-02

    申请号:US17602431

    申请日:2020-04-15

    Abstract: A semiconductor device storing data as a multilevel potential is provided. The semiconductor device includes a memory cell, first and second reference cells, first and second sense amplifiers, and first to third circuits. The first circuit has a function of outputting, to a first wiring and a third wiring, a first potential corresponding to a first signal output from the memory cell. The second circuit has a function of outputting, to a second wiring, a first reference potential corresponding to a second signal output from the first reference cell. The third circuit has a function of outputting, to the fourth wiring, a second reference potential corresponding to a third signal output from the second reference cell when a second switch is in an off state. The first sense amplifier refers to the first potential and the first reference potential and changes potentials of the first wiring and the second wiring. The second sense amplifier refers to the first potential and the second reference potential and changes potentials of the third wiring and the fourth wiring.

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