公开(公告)号：US20040262583A1

公开(公告)日：2004-12-30

申请号：US10893059

申请日：2004-07-16

发明人： Howard Wing Hoon Lee

IPC分类号： H01B001/00

CPC分类号： B82Y20/00 ,  B82Y10/00 ,  G02B6/122 ,  G02B6/1225 ,  G02B2006/12097 ,  G02B2006/12145 ,  G02B2006/12147 ,  G02B2006/12159 ,  G02B2006/12195 ,  G02F1/3515 ,  G02F1/3517 ,  G02F1/3521 ,  G02F1/3556 ,  G02F1/365 ,  G02F2001/01791 ,  G02F2001/217 ,  G02F2002/006 ,  G02F2202/32 ,  G02F2202/36 ,  H01L29/127 ,  H01L29/16 ,  H01L29/1602 ,  H01L33/20 ,  H01L33/34 ,  Y10S977/814

摘要： The invention relates to a quantum dot. The quantum dot comprises a core including a semiconductor material Y selected from the group consisting of Si and Ge. The quantum dot also comprises a shell surrounding the core. The quantum dot is substantially defect free such that the quantum dot exhibits photoluminescence with a quantum efficiency that is greater than 10 percent.

摘要翻译： 本发明涉及量子点。 量子点包括包含选自Si和Ge的半导体材料Y的芯。 量子点还包括围绕芯的外壳。 量子点基本上是无缺陷的，使得量子点显示出具有大于10％的量子效率的光致发光。

公开(公告)号：US20040256601A1

公开(公告)日：2004-12-23

申请号：US10671774

申请日：2003-09-29

申请人： FUJI PHOTO FILM CO., LTD.

发明人： Milan Hubacek ,  Kenji Takahashi

IPC分类号： H01B001/00

CPC分类号： C09C3/063 ,  C01P2002/52 ,  C01P2004/03 ,  C01P2004/20 ,  C01P2004/38 ,  C01P2004/50 ,  C01P2004/51 ,  C01P2004/61 ,  C01P2004/84 ,  C01P2006/40 ,  C01P2006/60

摘要： A method for coating inorganic particles with a metal compound is performed by the steps of: preparing a dispersion which comprises a metal salt and inorganic particles in a molten organic material which takes a solid form at 25null C., is converted into a polar liquid by heating and decomposes by further heating; and heating the dispersion, whereby coating the inorganic particles with a metal compound which is converted from the metal salt.

摘要翻译： 通过以下步骤进行用金属化合物涂覆无机颗粒的方法：在25℃下将固体形式的熔融有机材料中的金属盐和无机颗粒制成分散液，转化为极性液体 通过进一步加热进行加热分解; 并加热分散体，由此用金属盐转化的金属化合物涂覆无机颗粒。

公开(公告)号：US20040256136A1

公开(公告)日：2004-12-23

申请号：US10765161

申请日：2004-01-28

申请人： LABINAL

发明人： Michel Dunand ,  Sebastien Guerrero

IPC分类号： H01B001/00

CPC分类号： H02G3/0468

摘要： A modification system for modifying a tightly-braided electrical harness comprising at least one conductor cable bundle surrounded by a tight braid. The modification system comprising: at least one modification conductor element constituted by at least one conductor cable surrounded by a shielding braid; and at least one spare sheath portion comprising a flexible tube portion mounted in part inside the braid of said harness in such a manner that a first end of said tube extends beyond the end of said harness braid and that the second end of the tube is external to said harness braid, passing through it, at least said portion of the tube that is external to the harness braid being surrounded by a tight braid.

摘要翻译： 一种用于修改紧密编织的电线束的修改系统，包括由紧密编织物包围的至少一个导体电缆束。 该修改系统包括：由屏蔽编织物围绕的至少一个导体电缆构成的至少一个修改导体元件; 以及至少一个备用护套部分，其包括柔性管部分，其部分安装在所述线束的编织物内，使得所述管的第一端延伸超过所述线束编织物的端部，并且所述管的第二端是外部的 到达所述线束编织物，穿过其中，线束编织物外部的管的至少所述部分被紧密的编织物包围。

公开(公告)号：US20040245509A1

公开(公告)日：2004-12-09

申请号：US10751784

申请日：2004-01-05

申请人： INPAQ TECHNOLOGY CO., LTD.

发明人： Wen-Lung Liu ,  Kun-Huang Chang

IPC分类号： H01B001/00

CPC分类号： H01B1/12 ,  H05H2001/466

摘要： A method for processing polymeric positive temperature coefficient conductive material comprising the steps of placing a polymer material inside a plasma processor and then evacuating air therein to form a vacuum state, supplying a reactive gas to the plasma processor; and utilizing a radio frequency power generator for generating a plasma state inside the plasma processor, wherein the reactive gas is being excited to a high-level energy state, and the excited gas will attack the surface of the material to generate active sites. After that, the plasma-treated polymer material is exposed to air, and the radicals resided on the surface of the material will absorb moisture to form peroxide. The material is ground into powder before being placed inside the plasma processor, so that the contact surface can be increased to generate more radicals.

摘要翻译： 一种用于处理聚合物正温度系数导电材料的方法，包括以下步骤：将聚合物材料放置在等离子体处理器内，然后在其中排空空气以形成真空状态;向等离子体处理器提供反应气体; 并且利用射频发电机在等离子体处理器内部产生等离子体状态，其中反应气体被激发到高能量状态，并且所激发的气体将攻击材料的表面以产生活性位点。 之后，将等离子体处理的聚合物材料暴露于空气中，并且残留在材料表面上的基团将吸收水分以形成过氧化物。 在将材料置于等离子体处理器之前，将该材料粉碎成粉末，从而可以增加接触表面以产生更多的自由基。

公开(公告)号：US20040238798A1

公开(公告)日：2004-12-02

申请号：US10883915

申请日：2004-07-01

申请人： Integral Technologies, Inc.

发明人： Thomas Aisenbrey

IPC分类号： H01B001/00

CPC分类号： B29C45/0005 ,  B29C45/0001 ,  B29C45/0013 ,  B29C70/025 ,  B29C70/882 ,  B29K2105/0023 ,  B29K2995/0005 ,  B29L2031/3456 ,  G06K19/07749 ,  H01Q1/1271 ,  H01Q1/36 ,  H01Q1/38 ,  H01Q1/40 ,  H01Q9/0407 ,  H01Q9/16 ,  H01Q9/30 ,  H01Q17/00 ,  H05K1/095 ,  H05K3/101 ,  H05K3/107 ,  H05K2201/0281 ,  H05K2201/09118 ,  H05K2203/0113 ,  Y10T428/2904 ,  Y10T428/2907 ,  Y10T428/2918 ,  Y10T428/2927 ,  Y10T428/2929 ,  Y10T428/2933 ,  Y10T428/2936 ,  Y10T428/294 ,  Y10T428/2944 ,  Y10T428/2947 ,  Y10T428/2958

摘要： Moldable capsules of a conductive loaded resin-based material are created. The moldable capsules comprise a conductive element core radially surrounded by a resin-based material. The conductive loaded resin-based material comprises micron conductive powder(s), conductive fiber(s), or a combination of conductive powder and conductive fibers in a base resin host. The conductive element core comprises between about 20% and about 50% of the total weight of the moldable capsule in one embodiment, between about 20% and about 40% in another embodiment, between about 25% and about 35% in another embodiment, and about 30% in another embodiment. The micron conductive powders are formed from non-metals, that may also be metallic plated, or from metals, that may also be metallic plated, or from a combination of non-metal, plated, or in combination with, metal powders. The micron conductor fibers preferably are of nickel plated carbon fiber, stainless steel fiber, copper fiber, silver fiber, or the like.

摘要翻译： 产生导电负载的树脂基材料的可成形胶囊。 可成型胶囊包括由树脂基材料径向包围的导电元件芯。 导电负载树脂基材料在基础树脂主体中包括微米导电粉末，导电纤维或导电粉末和导电纤维的组合。 在另一个实施方案中，导电元件芯包括可塑胶囊的总重量的约20％至约50％，在另一个实施方案中为约20％至约40％，在另一实施方案中为约25％至约35％，以及 约30％。 微米导电粉末由非金属形成，其也可以是金属镀层，也可以是金属，也可以是金属镀层，或者由非金属，电镀或与金属粉末组合的组合形成。 微米导体纤维优选为镀镍碳纤维，不锈钢纤维，铜纤维，银纤维等。

公开(公告)号：US20040224851A1

公开(公告)日：2004-11-11

申请号：US10832563

申请日：2004-04-26

发明人： Kazuomi Kakimoto ,  Natsuro Hobara ,  Teruo Izumi ,  Yuh Shiohara ,  Yuichi Nakamura ,  Kazuya Ohmatsu ,  Koso Fujino

IPC分类号： B32B015/04 ,  H01B001/00

CPC分类号： C30B19/00 ,  C30B19/02 ,  C30B19/04 ,  C30B29/22 ,  C30B29/225 ,  H01L39/2425 ,  H01L39/2454

摘要： An oxide superconductor of the present invention characterized in that it comprises: a substrate 1 made of metals having a high melting temperature; at least one oxide intermediate layer 2 and 3 which is formed on at least one surface of the substrate 1; and a thick film oxide superconductor layer 5 which is formed on the oxide intermediate layer 2 and 3 by the liquid phase epitaxial method in which the substrate 1 provided with the oxide intermediate layer 2 and 3 is put into a solution 7 containing the elements comprising an oxide superconductor layer, and is then pulled out from the solution 7.

摘要翻译： 本发明的氧化物超导体的特征在于，它包括：由具有高熔点的金属制成的基片1; 形成在基板1的至少一个表面上的至少一个氧化物中间层2和3; 以及通过液相外延法在氧化物中间层2和3上形成的厚膜氧化物超导体层5，其中将设置有氧化物中间层2和3的基板1放入含有元素的溶液7中， 氧化物超导体层，然后从溶液7中拉出。

公开(公告)号：US20040222413A1

公开(公告)日：2004-11-11

申请号：US10803113

申请日：2004-03-17

发明人： Che-Hsiung Hsu ,  Frank P. Uckert

IPC分类号： H01B001/00

CPC分类号： C08L79/02 ,  B82Y10/00 ,  B82Y30/00 ,  C08L33/02 ,  G11C13/0014 ,  G11C13/0016 ,  G11C17/16 ,  G11C17/165 ,  G11C2213/51 ,  H01B1/128 ,  H01G11/48 ,  H01G11/56 ,  H01L51/0003 ,  H01L51/0021 ,  H01L51/0035 ,  H01L51/0541 ,  H01L51/50 ,  H01L51/5048 ,  H01L51/52 ,  Y02E10/549 ,  Y02E60/13 ,  Y10S428/917 ,  C08L2666/20 ,  C08L2666/06 ,  C08L2666/02

摘要： Compositions are provided comprising aqueous dispersions of at least one polyaniline and at least one colloid-forming polymeric acids. New compositions are useful in electronically conductive and semi-conductive layers in electronic devices and other applications. Also provided are methods of making the compositions.

摘要翻译： 提供了包含至少一种聚苯胺和至少一种形成胶体的聚合酸的水性分散体的组合物。 新的组合物可用于电子设备和其它应用中的电子导电和半导体层。 还提供了制备组合物的方法。

公开(公告)号：US20040217331A1

公开(公告)日：2004-11-04

申请号：US10479745

申请日：2003-12-05

发明人： David Lussey ,  David Bloor ,  Paul Jonathan Laughlin ,  Philip James Walton Hands

IPC分类号： H01B001/00

CPC分类号： G01N27/126 ,  H01C7/027 ,  H01C10/106

摘要： A sensor for chemical species or biological species or radiation presenting to test fluid a polymer composition comprises polymer and conductive filler metal, alloy or reduced metal oxide and having a first level of electrical conductance when quiescent and being convertible to a second level of conductance by change of stress applied by stretching or compression or electric field, in which the polymer composition is characterised by at least one of the features in the form of particles at least 90% w/w held on a 100 mesh sieve; and/or comprising a permeable body extending across a channel of fluid flow; and/or affording in-and-out diffusion of test fluid and/or mechanically coupled to a workpiece of polymer swellable by a constituent of test fluid.

公开(公告)号：US20040195551A1

公开(公告)日：2004-10-07

申请号：US10830069

申请日：2004-04-23

申请人： SEIKO EPSON CORPORATION

发明人： Ayae Endo ,  Shunichi Seki ,  Katsuyuki Morii

IPC分类号： H01B001/00

CPC分类号： H01L51/0004 ,  H01L51/0005 ,  H01L51/0007 ,  H01L51/0034 ,  H01L51/0035 ,  H01L51/0036 ,  H01L51/0039 ,  H01L51/0043 ,  H01L51/0053 ,  H01L51/0059 ,  H01L51/5012

摘要： In accordance with the invention, a composition including a solvent and a functional material is prepared. The solvent includes at least one heterocyclic compound having one or more substituents and containing an oxygen atom as a constituent atom. The functional material is selected from a group including organic EL materials, conductive materials, insulative materials and semiconductive materials. Functional films and functional elements are prepared by using the composition.

摘要翻译： 根据本发明，制备包含溶剂和功能材料的组合物。 溶剂包括至少一种具有一个或多个取代基且含有氧原子作为构成原子的杂环化合物。 功能材料选自包括有机EL材料，导电材料，绝缘材料和半导体材料的组。 通过使用组合物制备功能膜和功能元件。

公开(公告)号：US20040178391A1

公开(公告)日：2004-09-16

申请号：US10766288

申请日：2004-01-26

发明人： Brian F. Conaghan ,  Paul H. Kydd ,  David L. Richard

IPC分类号： H01B001/00

CPC分类号： H05K1/097 ,  C09D11/30 ,  C09D11/52 ,  H01B1/22 ,  H05K1/095

摘要： Conductive ink compositions which can be cured to highly conductive metal traces by means of nullchemical weldingnull include additives which reduce the curing temperatures for use with low-temperature substrates. Conductive ink compositions can be deposited on a substrate coated with a cure temperature reducing agent to reduce the curing temperatures.