-
公开(公告)号:US20240170530A1
公开(公告)日:2024-05-23
申请号:US18387702
申请日:2023-11-07
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Ingyu BAEK , Changyong UM , Kwansik KIM , Jungsan KIM , Taemin KIM
IPC: H01G15/00 , H01L23/522 , H01L23/528 , H01L27/06
CPC classification number: H01L28/75 , H01L23/5226 , H01L23/5283 , H01L27/0629 , H01L28/90
Abstract: An integrated circuit device, including a substrate; a lower insulating film; and a capacitor structure including: a plurality of first conductive patterns sequentially stacked on the lower insulating film; a plurality of second conductive patterns on the plurality of first conductive patterns; a first via at a first side of the capacitor structure, wherein the first via physically contacts and is electrically connected to the plurality of first conductive patterns, and is not electrically connected to the plurality of second conductive patterns; and a second via at a second side of the capacitor structure, wherein the second via physically contacts and is electrically connected to the plurality of second conductive patterns, and is not electrically connected to the plurality of first conductive patterns.
-
公开(公告)号:US20210074629A1
公开(公告)日:2021-03-11
申请号:US16561593
申请日:2019-09-05
Applicant: TEXAS INSTRUMENTS INCORPORATED
Inventor: Poornika FERNANDES , Ye SHAO , Guruvayurappan S. MATHUR , John K. ARCH , Paul STULIK
IPC: H01L23/522 , H01G15/00
Abstract: An integrated circuit (IC) includes a substrate and a first capacitor on the substrate. The first capacitor has a first width. A first dielectric layer is provided on a side of the first capacitor opposite the substrate. Further, a second capacitor is present on a side of the first dielectric layer opposite the first capacitor. The second capacitor has a second width that is smaller than the first width. The IC also has a second dielectric layer and a first metal layer. The second dielectric layer is on a side of the second capacitor opposite the first dielectric layer. The first metal layer is on a side of the second dielectric layer opposite the second capacitor.
-
公开(公告)号:US08149565B2
公开(公告)日:2012-04-03
申请号:US12421953
申请日:2009-04-10
Applicant: Byoung Hwa Lee , Sung Kwon Wi , Hong Yeon Cho , Dong Seok Park , Sang Soo Park , Min Cheol Park
Inventor: Byoung Hwa Lee , Sung Kwon Wi , Hong Yeon Cho , Dong Seok Park , Sang Soo Park , Min Cheol Park
IPC: H01G15/00
CPC classification number: H05K1/0231 , H01G2/065 , H01G4/35 , H05K2201/09318 , H05K2201/09481 , H05K2201/10636 , H05K2201/10969 , Y02P70/611
Abstract: A circuit board device includes a circuit board comprising a mounting area, and first and second power lines and a ground pad formed on the mounting area, and a vertical multilayer chip capacitor (MLCC) comprising a capacitor body, a plurality of first and second polarity inner electrodes, first and second outer electrodes, and a third outer electrode, wherein the first and second power lines are separately disposed on the mounting area, connected to the first and second outer electrodes, and electrically connected to each other only by the vertical MLCC, and the ground pad is disposed between the first and second power lines and connected to the third outer electrode.
Abstract translation: 一种电路板装置,包括:电路板,包括安装区域;以及第一和第二电力线以及形成在所述安装区域上的接地焊盘;以及垂直多层片状电容器(MLCC),其包括电容器本体,多个第一和第二极性 内部电极,第一外部电极和第二外部电极以及第三外部电极,其中第一和第二电力线分别设置在安装区域上,连接到第一和第二外部电极,并且仅通过垂直MLCC 并且接地焊盘设置在第一和第二电源线之间并且连接到第三外部电极。
-
公开(公告)号:US20050122660A1
公开(公告)日:2005-06-09
申请号:US10990321
申请日:2004-11-16
Applicant: Yukihiko Yashima
Inventor: Yukihiko Yashima
CPC classification number: H01G7/06
Abstract: A variable capacitor is provided such that it is possible to make nonlinear distortion small and use at high power handling capability, and such that a variable rate of capacitace is not influenced by a high-frequency voltage substantially. A variable capacitor is used by changing capacitance through application across electrodes of direct current voltage and high-frequency voltage. When an effective voltage value of high-frequency voltage is within a rage of voltage values of direct current voltage, there is substantially no fluctuation caused by application of high-frequency voltage with respect to a change of capacitance caused by application of direct current. Since it is possible to decrease susceptibility to the high-frequency voltage of the variable capacitor, it is possible to obtain a variable capacitor such that nonlinear distortion is small and power handling capability is high.
Abstract translation: 提供了一种可变电容器,使得可以使非线性失真小并且以高功率处理能力使用,并且使得可变速率的电容不受基本上的高频电压的影响。 通过在直流电压和高频电压的电极上施加电容来改变电容,可以使用可变电容器。 当高频电压的有效电压值在直流电压的电压值范围内时,由施加直流电流引起的电容变化引起的高频电压基本上不产生波动。 由于可以降低对可变电容器的高频电压的敏感性,因此可以获得非线性失真小且功率处理能力高的可变电容器。
-
公开(公告)号:US5973907A
公开(公告)日:1999-10-26
申请号:US923929
申请日:1997-09-05
Applicant: Erik K. Reed
Inventor: Erik K. Reed
Abstract: Multielement capacitors have at least one metal capacitor and at least one ceramic capacitor with common terminals in a common case. The preferred metal capacitance elements have an effective series capacitance of at least 1 microfarad at frequencies of up to 100 kHz. The individual metallic capacitance elements exhibit an ESR of less than 100 milliohms at 100 kHz and a dissipation factor (DF) of less than about 6% at 120 Hz. The ceramic capacitance elements useful in the invention have an equivalent series capacitance of at least about 0.1 microfarads at frequencies of up to about 100 MHz. The individual ceramic capacitance elements have an ESR of less than 20 milliohms at 1 MHz and a dissipation factor of less than 10% at 1 kHz.
Abstract translation: 多元电容器在通常情况下具有至少一个金属电容器和至少一个具有公共端子的陶瓷电容器。 优选的金属电容元件在高达100kHz的频率下具有至少1微法的有效串联电容。 各个金属电容元件在100kHz下表现出小于100毫欧的ESR,在120Hz时的损耗因数(DF)小于约6%。 在本发明中有用的陶瓷电容元件在高达约100MHz的频率下具有至少约0.1微法的等效串联电容。 单个陶瓷电容元件在1 MHz时的ESR小于20毫欧,1 kHz时的耗散因数小于10%。
-
6.
公开(公告)号:US10516404B2
公开(公告)日:2019-12-24
申请号:US15923620
申请日:2018-03-16
Applicant: Samsung Electronics Co., Ltd.
Inventor: Jong-Woo Lee
Abstract: A variable capacitor is provided. The variable capacitor includes a plurality of capacitor segments. The plurality of capacitor segments are connected in parallel within the variable capacitor. When a plurality of candidate capacitances allowable to the variable capacitor according to a connection state of the plurality of capacitor segments connected in parallel are sorted in a magnitude sequence, the plurality of candidate capacitances form a geometric series. The variable capacitor is used for a Voltage Controlled Oscillator (VCO), and the VCO is used for a Phase Locked Loop (PLL).
-
公开(公告)号:US10270238B2
公开(公告)日:2019-04-23
申请号:US16114782
申请日:2018-08-28
Applicant: CommScope Technologies LLC
Inventor: Ronald A. Vaccaro
Abstract: A sealing boot for protecting an electrical interconnection includes: a main body having a cavity configured to house an interconnection of two electrical connectors; and a neck merging with one end of the main body and having a cylindrical inner surface that defines a bore that is continuous with the cavity of the main body, the inner surface having an inner diameter that is less than an inner diameter of the cavity of the main body. The inner surface of the neck includes a helical projection comprising a main artery and two tributaries, the tributaries each intersecting a section of the main artery at one end and merging with an end of the main artery at an opposite end.
-
公开(公告)号:US09953769B2
公开(公告)日:2018-04-24
申请号:US14811463
申请日:2015-07-28
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor: Young Ghyu Ahn , Sang Soo Park , Byoung Hwa Lee , Kyo Kwang Lee
IPC: H01G15/00 , H01G2/06 , H01G4/12 , H01G9/012 , H01G4/224 , H01G4/30 , H01G4/012 , H01G4/228 , H01G4/38 , H01G9/08 , H01G9/28 , H05K3/34 , H05K1/18
CPC classification number: H01G15/00 , H01G2/06 , H01G4/012 , H01G4/12 , H01G4/224 , H01G4/228 , H01G4/30 , H01G4/38 , H01G9/012 , H01G9/08 , H01G9/28 , H05K1/181 , H05K3/3442 , H05K2201/10015 , H05K2201/2045 , Y02P70/613
Abstract: A composite electronic component includes an insulation sheet, a tantalum capacitor including a body part containing a sintered tantalum powder and a tantalum wire, a portion of which is embedded in the body part, and disposed on the insulation sheet, a multilayer ceramic capacitor including a ceramic body including a plurality of dielectric layers, first and second internal electrodes, and first and second external electrodes, and disposed on the insulation sheet, and a molded portion enclosing the tantalum capacitor and the multilayer ceramic capacitor. The first internal electrode includes a first lead portion led out to upper and lower surfaces and a first end surface of the ceramic body in a length direction, and the second internal electrode includes a second lead portion led out to the upper and lower surfaces and a second end surface of the ceramic body in the length direction.
-
公开(公告)号:US09837218B2
公开(公告)日:2017-12-05
申请号:US14875373
申请日:2015-10-05
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor: Hong Kyu Shin , Wan Suk Yang , Hyun Sub Oh , Hyoung Sun Ham , Jae Hyuk Choi
Abstract: A composite electronic component includes: a tantalum capacitor, a multilayer ceramic capacitor, a sealing part, an anode lead frame, and a cathode lead frame, wherein the anode lead frame includes a step portion that does not contact a first external electrode of the multilayer ceramic capacitor, and the cathode lead frame includes a step portion that does not contact a second external electrode of the multilayer ceramic capacitor.
-
10.
公开(公告)号:US20160027594A1
公开(公告)日:2016-01-28
申请号:US14811463
申请日:2015-07-28
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor: Young Ghyu AHN , Sang Soo PARK , Byoung Hwa LEE , Kyo Kwang LEE
IPC: H01G15/00 , H01G4/012 , H01G4/12 , H01G9/042 , H01G4/224 , H05K1/18 , H01G9/012 , H01G9/025 , H01G4/30 , H01G4/228
CPC classification number: H01G15/00 , H01G2/06 , H01G4/012 , H01G4/12 , H01G4/224 , H01G4/228 , H01G4/30 , H01G4/38 , H01G9/012 , H01G9/08 , H01G9/28 , H05K1/181 , H05K3/3442 , H05K2201/10015 , H05K2201/2045 , Y02P70/613
Abstract: A composite electronic component includes an insulation sheet, a tantalum capacitor including a body part containing a sintered tantalum powder and a tantalum wire, a portion of which is embedded in the body part, and disposed on the insulation sheet, a multilayer ceramic capacitor including a ceramic body including a plurality of dielectric layers, first and second internal electrodes, and first and second external electrodes, and disposed on the insulation sheet, and a molded portion enclosing the tantalum capacitor and the multilayer ceramic capacitor. The first internal electrode includes a first lead portion led out to upper and lower surfaces and a first end surface of the ceramic body in a length direction, and the second internal electrode includes a second lead portion led out to the upper and lower surfaces and a second end surface of the ceramic body in the length direction.
Abstract translation: 复合电子部件包括绝缘片,钽电容器,其包括包含烧结钽粉末的主体部分和钽线,其一部分嵌入在主体部分中,并且设置在绝缘片上,多层陶瓷电容器包括: 包括多个电介质层的陶瓷体,第一和第二内部电极以及第一和第二外部电极,并且设置在绝缘片上,以及封装钽电容器和多层陶瓷电容器的模制部分。 第一内部电极包括从长度方向引出到上表面和下表面的第一引线部分和陶瓷体的第一端面,并且第二内部电极包括引导到上表面和下表面的第二引线部分和 陶瓷体的长度方向的第二端面。
-
-
-
-
-
-
-
-
-