公开(公告)号：US08018043B2

公开(公告)日：2011-09-13

申请号：US12261112

申请日：2008-10-30

Applicant: Min Suk Suh ,  Seung Taek Yang ,  Seung Hyun Lee ,  Jong Hoon Kim

Inventor： Min Suk Suh ,  Seung Taek Yang ,  Seung Hyun Lee ,  Jong Hoon Kim

IPC: H01L23/48

CPC classification number: H01L23/4334 ,  H01L21/568 ,  H01L21/6835 ,  H01L23/3114 ,  H01L23/525 ,  H01L24/19 ,  H01L2221/68345 ,  H01L2221/68359 ,  H01L2224/04105 ,  H01L2224/20 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/014 ,  H01L2924/15311

Abstract: A semiconductor package includes a semiconductor chip having an upper surface, side surfaces connected with the upper surface, and bonding pads formed on the upper surface. A first insulation layer pattern is formed to cover the upper surface and the side surfaces of the semiconductor chip and expose the bonding pads. Re-distribution lines are placed on the first insulation layer pattern and include first re-distribution line parts and second re-distribution line parts. The first re-distribution line parts have an end connected with the bonding pads and correspond to the upper surface of the semiconductor chip and the second re-distribution line parts extend from the first re-distribution line parts beyond the side surfaces of the semiconductor chip. A second insulation layer pattern is formed over the semiconductor chip and exposes portions of the first re-distribution line parts and the second re-distribution line parts.

Abstract translation: 半导体封装包括具有上表面的半导体芯片，与上表面连接的侧表面，以及形成在上表面上的焊盘。 形成第一绝缘层图案以覆盖半导体芯片的上表面和侧表面并且暴露接合焊盘。 再分配线路放置在第一绝缘层图案上，并且包括第一再分配线部分和第二再分配线部分。 第一再分配线部分具有与接合焊盘连接的端部并且对应于半导体芯片的上表面，并且第二再分配线部分从第一再分配线部分延伸超过半导体芯片的侧表面 。 在半导体芯片上形成第二绝缘层图案，并且暴露出第一再分配线部分和第二再分配线部分的部分。

公开(公告)号：US20110121433A1

公开(公告)日：2011-05-26

申请号：US12835933

申请日：2010-07-14

Applicant: Jong Hoon KIM

Inventor： Jong Hoon KIM

IPC: H01L25/065 ,  H01L23/48 ,  H01L23/538 ,  H01L23/488

CPC classification number: H01L24/06 ,  H01L24/24 ,  H01L25/0657 ,  H01L2224/0401 ,  H01L2224/05553 ,  H01L2224/0557 ,  H01L2224/18 ,  H01L2225/06541 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/14 ,  H01L2924/15311

Abstract: A semiconductor chip and a stacked semiconductor package are presented. The semiconductor chip includes a semiconductor substrate, circuit patterns, first input/output pads and second input/output pads. The semiconductor substrate is divided into cell and peripheral regions and has first and second surfaces which oppose each other. The circuit patterns are formed on the first surface of the semiconductor substrate and are connected with the cell region and the peripheral region. The first input/output pads are formed in the cell region and are connected to the circuit patterns. The second input/output pads are formed in the peripheral region and connected with the circuit patterns.

Abstract translation: 提出了半导体芯片和堆叠半导体封装。 半导体芯片包括半导体衬底，电路图案，第一输入/输出焊盘和第二输入/输出焊盘。 半导体衬底被分为电池和周边区域，并且具有彼此相对的第一和第二表面。 电路图案形成在半导体衬底的第一表面上并与电池区域和周边区域连接。 第一输入/输出焊盘形成在单元区域中并连接到电路图案。 第二输入/输出焊盘形成在外围区域中并且与电路图案连接。

公开(公告)号：US20110031600A1

公开(公告)日：2011-02-10

申请号：US12647640

申请日：2009-12-28

Applicant: Jong Hoon KIM

Inventor： Jong Hoon KIM

IPC: H01L25/065 ,  H01L23/52

CPC classification number: H01L23/13 ,  H01L23/3128 ,  H01L23/481 ,  H01L23/49816 ,  H01L24/45 ,  H01L24/48 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/32225 ,  H01L2224/451 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/06541 ,  H01L2225/06555 ,  H01L2225/06562 ,  H01L2225/06596 ,  H01L2924/00014 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00015 ,  H01L2224/05599 ,  H01L2924/00012 ,  H01L2924/00

Abstract: A semiconductor package comprises a substrate having bond fingers on an upper surface thereof and ball lands on a lower surface thereof; at least two chip modules stacked on the upper surface of the substrate, each of the at least two chip modules including a plurality of semiconductor chips having first connection members and stacked in a manner such that the first connection members of the semiconductor chips are connected to one another, the chip modules being stacked in a zigzag pattern such that connection parts of the chip modules project sideward; and second connection members electrically connecting the connection parts of the respective chip modules to the bond fingers of the substrate.

Abstract translation: 半导体封装包括在其上表面上具有键合指状物的衬底，并且在其下表面上具有焊盘; 至少两个芯片模块堆叠在所述基板的上表面上，所述至少两个芯片模块中的每一个包括多个半导体芯片，所述多个半导体芯片具有第一连接构件，并且以使得所述半导体芯片的所述第一连接构件连接到 另一方面，芯片模块以锯齿形图案堆叠，使得芯片模块的连接部分向​​侧面投射; 以及第二连接构件，其将各个芯片模块的连接部分电连接到基板的键​​合指状物。

公开(公告)号：US07834836B2

公开(公告)日：2010-11-16

申请号：US11477386

申请日：2006-06-30

Applicant: In Jae Chung ,  Chul Sang Jang ,  Sung Hak Jo ,  Deuk Su Lee ,  Jong Hoon Kim ,  Jong Hee Hwang

Inventor： In Jae Chung ,  Chul Sang Jang ,  Sung Hak Jo ,  Deuk Su Lee ,  Jong Hoon Kim ,  Jong Hee Hwang

IPC: G09G3/36

CPC classification number: G09G3/20 ,  G09G3/2011 ,  G09G3/3648 ,  G09G2300/0452 ,  G09G2320/0285 ,  G09G2330/10 ,  G09G2370/047

Abstract: A flat panel display device includes a display panel, a memory storing a compensation value that corresponds to a panel defect location, the panel defect location being where any one of a brightness and a color difference exists compared to other part of the display panel, a compensating unit to adjust image data to be displayed in the panel defect location using the compensation value, and a driver to apply the adjusted image data from the compensating unit to the display panel.

Abstract translation: 平板显示装置包括显示面板，存储对应于面板缺陷位置的补偿值的存储器，面板缺陷位置与显示面板的其他部分相比存在亮度和色差中的任何一个，其中， 补偿单元，用于使用补偿值来调整要在面板缺陷位置显示的图像数据;以及驱动器，用于将来自补偿单元的经调整的图像数据应用于显示面板。

公开(公告)号：US20100207061A1

公开(公告)日：2010-08-19

申请号：US12668834

申请日：2008-07-11

Applicant: Jong-Hoon Kim

Inventor： Jong-Hoon Kim

IPC: C01G49/06 ,  C01F7/02 ,  C09K3/00

CPC classification number: C01B13/32 ,  B82Y30/00 ,  C01F7/02 ,  C01G49/04 ,  C01G49/06 ,  C01P2002/72 ,  C01P2002/85 ,  C01P2004/04 ,  C01P2004/64

Abstract: The present invention relates to a preparation method of metal oxide, and more specifically to a preparation method of metal oxide comprising the steps of: a) dissolving metal halide in a solvent; b) adding and reacting water or metal hydroxide having strong basicity; c) adding base to the reaction solution and then raising a temperature thereof to form the metal oxide-carbon complex; d) stopping the reaction by inputting a large amount of water or metal hydroxide and raising the temperature thereof; and e) obtaining the metal oxide-carbon complex by a separation and a cleaning.

Abstract translation: 本发明涉及金属氧化物的制备方法，更具体地涉及金属氧化物的制备方法，包括以下步骤：a）将金属卤化物溶解在溶剂中; b）加入和反应具有强碱性的水或金属氢氧化物; c）向反应溶液中加入碱，然后升高其温度以形成金属氧化物 - 碳络合物; d）通过输入大量的水或金属氢氧化物并提高其温度来停止反应; 和e）通过分离和清洁获得金属氧化物 - 碳络合物。

公开(公告)号：US20100197903A1

公开(公告)日：2010-08-05

申请号：US12448134

申请日：2007-12-11

Applicant: Jong-Hoon Kim ,  Min Kim ,  Hae-Joon Park ,  Han Oh Park

Inventor： Jong-Hoon Kim ,  Min Kim ,  Hae-Joon Park ,  Han Oh Park

IPC: C07H21/00 ,  B01J20/26 ,  C09K3/00

CPC classification number: C07H21/00 ,  C12N15/1003

Abstract: Disclosed are a method for isolating a nucleic acid using particulate matter and a composition therefor. The method comprises essentially the steps of adding a lysis buffer and a neutralization buffer to a biological sample sequentially, and centrifuging cell lysates for at least 10 minutes to separate a solution comprising the nucleic acid and insoluble aggregate comprising denatured protein aggregate and cell debris. The particulate matter is added to and participates in co-aggregation and co-precipitation of denatured protein aggregate and cell debris, and co-aggregates and co-precipitates denatured protein aggregate and cell debris within a much shortened time, thereby to shorten the time and to increase the yield for the isolation of a nucleic acid, compared with conventional methods.

Abstract translation: 公开了使用颗粒物质及其组合物分离核酸的方法。 该方法基本上包括以下步骤：依次向生物样品中加入裂解缓冲液和中和缓冲液，并离心细胞裂解物至少10分钟以分离包含核酸的溶液和包含变性蛋白质聚集体和细胞碎片的不溶性骨架。 添加颗粒物并参与变性蛋白质聚集体和细胞碎片的共聚和共沉淀，并在更短的时间内共同聚集和共沉淀变性蛋白质聚集体和细胞碎片，从而缩短时间和 以提高分离核酸的产量，与常规方法相比。

公开(公告)号：US07763498B2

公开(公告)日：2010-07-27

申请号：US12545945

申请日：2009-08-24

Applicant: Jong Hoon Kim

Inventor： Jong Hoon Kim

IPC: H01L21/56

CPC classification number: H01L23/3135 ,  H01L21/561 ,  H01L23/3121 ,  H01L24/48 ,  H01L24/73 ,  H01L24/96 ,  H01L25/0657 ,  H01L25/105 ,  H01L25/50 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/16 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/451 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/92 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06524 ,  H01L2225/06527 ,  H01L2225/06548 ,  H01L2225/06565 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/18162 ,  H01L2224/96 ,  H01L2224/82 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/00015 ,  H01L2224/05599 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A stack package includes at least two stacked package units. Each package unit comprises semiconductor chips having bonding pads on upper surfaces thereof; a molding part formed to surround side surfaces of the semiconductor chips; through-electrodes formed in the molding part; and re-distribution lines formed to connect the through-electrodes and adjacent bonding pads with each other.

Abstract translation: 堆叠包装包括至少两个堆叠的包装单元。 每个封装单元包括其上表面上具有接合焊盘的半导体芯片; 形成为围绕半导体芯片的侧表面的模制部件; 在模制部件中形成的通孔; 以及形成为将贯通电极和相邻接合焊盘彼此连接的再分配线。

公开(公告)号：US07687698B2

公开(公告)日：2010-03-30

申请号：US12365555

申请日：2009-02-04

Applicant: Jong Hoon Kim

Inventor： Jong Hoon Kim

IPC: G10D3/00

CPC classification number: G10D3/06

Abstract: Disclosed is an apparatus for adjusting a neck angle of a guitar. The apparatus comprises a support block having a receiving groove into which the neck is inserted. The support block is installed inside a lateral plate. A reinforcing plate is installed at bottom of the receiving groove of the support block. The reinforcing plate includes a central plate, a fixed plate fixed to a front face of the support block, and a guide plate guiding rotating of the neck. An adjustment device includes an adjustment bolt inserted into an adjustment hole and a thread portion formed in the adjustment hole of the central plate of the reinforcing plate so as to be thread-fastened with the adjustment bolt. A fixing device includes a fixing bolt inserted into a fixing hole and a fixing nut fixed inside the neck body and thread-fastened with the fixing bolt.

Abstract translation: 公开了一种用于调节吉他颈部角度的装置。 该装置包括具有容纳槽的支撑块，颈部插入其中。 支撑块安装在侧板内。 加强板安装在支撑块的接收槽的底部。 加强板包括中心板，固定在支撑块的前表面上的固定板和引导颈部旋转的引导板。 调节装置包括插入到调节孔中的调节螺栓和形成在加强板的中心板的调节孔中的螺纹部分，以便与调节螺栓螺纹紧固。 定影装置包括插入到固定孔中的固定螺栓和固定在颈部主体内并与固定螺栓螺纹紧固的固定螺母。

公开(公告)号：US20100037748A1

公开(公告)日：2010-02-18

申请号：US12365581

申请日：2009-02-04

Applicant: Jong Hoon Kim

Inventor： Jong Hoon Kim

IPC: G10D3/18

CPC classification number: G10D3/02

Abstract: Disclosed herein is a guitar, which includes a chest rest formed on a back plate of a main body so that the guitar can be gripped in a stable manner and can be played with a comfort of chest. The guitar further includes an arm rest formed on a top plate of the main body so that so that the guitar can be gripped in a stable manner and can be played with a comfort of chest and arm. A method of manufacturing the chest and arm rest is also disclosed.

Abstract translation: 这里公开了一种吉他，其包括形成在主体的背板上的胸部休息台，使得吉他可以以稳定的方式被夹持并且可以舒适的胸部玩。 吉他还包括形成在主体的顶板上的扶手，使得能够以稳定的方式夹持吉他并且可以舒适的胸部和手臂进行演奏。 还公开了制造胸部和扶手的方法。

公开(公告)号：US20100024623A1

公开(公告)日：2010-02-04

申请号：US12365555

申请日：2009-02-04

Applicant: Jong Hoon Kim

Inventor： Jong Hoon Kim

IPC: G10D3/00 ,  G10G7/02

CPC classification number: G10D3/06

Abstract: Disclosed is an apparatus for adjusting a neck angle of a guitar. The apparatus comprises a support block having a receiving groove into which the neck is inserted. The support block is installed inside a lateral plate. A reinforcing plate is installed at bottom of the receiving groove of the support block. The reinforcing plate includes a central plate, a fixed plate fixed to a front face of the support block, and a guide plate guiding rotating of the neck. An adjustment device includes an adjustment bolt inserted into an adjustment hole and a thread portion formed in the adjustment hole of the central plate of the reinforcing plate so as to be thread-fastened with the adjustment bolt. A fixing device includes a fixing bolt inserted into a fixing hole and a fixing nut fixed inside the neck body and thread-fastened with the fixing bolt.

Abstract translation: 公开了一种用于调节吉他颈部角度的装置。 该装置包括具有容纳槽的支撑块，颈部插入其中。 支撑块安装在侧板内。 加强板安装在支撑块的接收槽的底部。 加强板包括中心板，固定在支撑块的前表面上的固定板和引导颈部旋转的引导板。 调节装置包括插入到调节孔中的调节螺栓和形成在加强板的中心板的调节孔中的螺纹部分，以便与调节螺栓螺纹紧固。 定影装置包括插入到固定孔中的固定螺栓和固定在颈部主体内并与固定螺栓螺纹紧固的固定螺母。