公开(公告)号：US08889994B2

公开(公告)日：2014-11-18

申请号：US13018971

申请日：2011-02-01

申请人： Young-Ji Kim ,  Kyung-Ro Yoon ,  Sang-Duck Kim ,  Jung-Hyun Park ,  Nam-Keun Oh ,  Jong-Gyu Choi ,  Ji-Eun Kim

发明人： Young-Ji Kim ,  Kyung-Ro Yoon ,  Sang-Duck Kim ,  Jung-Hyun Park ,  Nam-Keun Oh ,  Jong-Gyu Choi ,  Ji-Eun Kim

IPC分类号： H05K1/16

CPC分类号： H05K1/11 ,  H05K3/06 ,  Y10T29/49144 ,  Y10T29/49156

摘要： A single layered printed circuit board and a method of manufacturing the same are disclosed. In accordance with an embodiment of the present invention, the method can include forming a bonding pad, a circuit pattern and a post on a surface of an insulation film, in which one end part of the post is electrically connected to at least a portion of the circuit pattern, pressing an insulator on the surface of the insulation film, in which the circuit pattern and the post are buried in the insulator, selectively etching the insulator such that the other end part of the post is exposed, and opening a portion of the insulation film such that at least a portion of the bonding pad is exposed.

摘要翻译： 公开了一种单层印刷电路板及其制造方法。 根据本发明的实施例，该方法可以包括在绝缘膜的表面上形成焊盘，电路图案和柱，其中柱的一个端部电连接到绝缘膜的至少一部分 电路图案，将电路图案和柱埋在绝缘体中的绝缘膜表面上的绝缘体按压绝缘体，选择性地蚀刻绝缘体，使得柱的另一端暴露，并且打开一部分 所述绝缘膜使得所述焊盘的至少一部分露出。

公开(公告)号：US08592269B2

公开(公告)日：2013-11-26

申请号：US12942107

申请日：2010-11-09

申请人： Ki-Hyun Hwang ,  Won-Jun Jang ,  Jae-Young Ahn ,  Chang-Sup Mun ,  Jung-Hyun Park

发明人： Ki-Hyun Hwang ,  Won-Jun Jang ,  Jae-Young Ahn ,  Chang-Sup Mun ,  Jung-Hyun Park

IPC分类号： H01L21/8238

CPC分类号： B82Y10/00 ,  H01L21/823425 ,  H01L21/823462 ,  H01L27/115 ,  H01L27/11521

摘要： In a method for manufacturing a semiconductor device, a silicon oxide layer is formed on a substrate. The silicon oxide layer is treated with a solution comprising ozone. Then, a conductive layer is formed on the silicon oxide layer treated with the solution.

摘要翻译： 在半导体装置的制造方法中，在基板上形成氧化硅层。 氧化硅层用包含臭氧的溶液处理。 然后，在用该溶液处理的氧化硅层上形成导电层。

公开(公告)号：US20130302611A1

公开(公告)日：2013-11-14

申请号：US13530270

申请日：2012-06-22

申请人： Sang-Hoon Joo ,  Jae-Yeong Cheon ,  Jae-Deuk Kim ,  Jung-Hyun Park

发明人： Sang-Hoon Joo ,  Jae-Yeong Cheon ,  Jae-Deuk Kim ,  Jung-Hyun Park

IPC分类号： H01B1/04 ,  B82Y40/00 ,  B82Y30/00

CPC分类号： B82Y30/00 ,  B82Y40/00 ,  C01B32/00 ,  C01P2002/72 ,  C01P2006/12 ,  Y10T428/2982

摘要： Disclosed are ordered mesoporous carbon-carbon nanotube nanocomposites and a method for manufacturing the same. The method for manufacturing ordered carbon-carbon nanotube nanocomposites according to the present invention includes: forming a mixture of a carbon precursor and ordered mesoporous silica; carbonizing the mixture to form a ordered mesoporous silica-carbon composite; and removing the mesoporous silica from the ordered mesoporous silica-carbon composite.

摘要翻译： 公开了有序介孔碳 - 碳纳米管纳米复合材料及其制造方法。 根据本发明的制备有序碳 - 碳纳米管纳米复合材料的方法包括：形成碳前体和有序介孔二氧化硅的混合物; 将混合物碳化以形成有序介孔二氧化硅 - 碳复合材料; 并从有序介孔二氧化硅 - 碳复合材料中除去介孔二氧化硅。

公开(公告)号：US20130243133A1

公开(公告)日：2013-09-19

申请号：US13891347

申请日：2013-05-10

申请人： Hyun Ho CHOI ,  Yong Ho CHO ,  Jung Hyun PARK ,  Dong Jo PARK

发明人： Hyun Ho CHOI ,  Yong Ho CHO ,  Jung Hyun PARK ,  Dong Jo PARK

IPC分类号： H04L27/26

CPC分类号： H04L27/2649 ,  H04W16/14 ,  H04W72/02

摘要： A cognitive radio (CR) communication apparatus and method is provided. A cognitive radio (CR) communication apparatus includes a signal receiving unit which receives signals from a primary user of a primary system and a secondary transmitter of a secondary system, the received signals including an element associated with at least one known signal of the secondary transmitter, and a determination unit which determines whether a signal of the primary user exists from among the received signals based on the element associated with the at least one known signal.

公开(公告)号：US08431462B2

公开(公告)日：2013-04-30

申请号：US13183630

申请日：2011-07-15

申请人： Kwan-Heum Lee ,  Soon-Wook Jung ,  Jung-Hyun Park ,  Wook-Je Kim ,  Jong-Sang Ban

发明人： Kwan-Heum Lee ,  Soon-Wook Jung ,  Jung-Hyun Park ,  Wook-Je Kim ,  Jong-Sang Ban

IPC分类号： H01L21/337 ,  H01L21/8238 ,  H01L21/336 ,  H01L27/12

CPC分类号： H01L21/823814 ,  H01L21/823864 ,  H01L29/7848

摘要： A method of manufacturing a semiconductor device includes forming a gate structure on a substrate; forming a sacrificial spacer may be formed on a sidewall of the gate substrate; implanting first impurities into portions of the substrate by a first ion implantation process using the gate structure and the sacrificial spacer as ion implantation masks to form source and drain regions; removing the sacrificial spacer; and implanting second impurities and carbon atoms into portions of the substrate by a second ion implantation process using the gate structure as an ion implantation mask to form source and drain extension regions and carbon doping regions, respectively.

摘要翻译： 一种制造半导体器件的方法包括在衬底上形成栅极结构; 形成牺牲隔离物可以形成在栅极衬底的侧壁上; 通过使用栅极结构和牺牲隔离物作为离子注入掩模的第一离子注入工艺将第一杂质注入到衬底的部分中以形成源区和漏区; 去除牺牲隔离物; 以及通过使用所述栅极结构作为离子注入掩模的第二离子注入工艺将第二杂质和碳原子注入到所述衬底的部分中，以分别形成源极和漏极延伸区域和碳掺杂区域。

公开(公告)号：US08418355B2

公开(公告)日：2013-04-16

申请号：US11976071

申请日：2007-10-19

申请人： Sang-Duck Kim ,  Jung-Hyun Park ,  Hoe-Ku Jung ,  Jong-Gyu Choi ,  Ji-Eun Kim ,  Jeong-Woo Park

发明人： Sang-Duck Kim ,  Jung-Hyun Park ,  Hoe-Ku Jung ,  Jong-Gyu Choi ,  Ji-Eun Kim ,  Jeong-Woo Park

IPC分类号： H05K3/20

CPC分类号： H05K3/20 ,  H05K3/205 ,  H05K3/207 ,  H05K3/386 ,  H05K2203/0113 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49155 ,  Y10T29/49158 ,  Y10T29/49163

摘要： A method for forming transcriptional circuits and a method for manufacturing a circuit board are disclosed. A method of forming a transcriptional circuit, which includes forming an intaglio pattern corresponding to a circuit pattern by selectively forming a resist on a mold board, filling conductive material in the intaglio pattern, and transferring the conductive material onto a carrier by pressing the carrier onto the mold board such that the carrier faces the surface of the mold board having the conductive material filled in, makes it possible to form transcriptional circuits that can be transcribed into an insulation board using existing equipment, whereby costs can be reduced.

摘要翻译： 公开了一种形成转录电路的方法及其制造方法。 一种形成转录电路的方法，其包括通过在模板上选择性地形成抗蚀剂来形成对应于电路图案的凹版图案，将导电材料填充到凹版图案中，以及通过将载体压载到载体上而将载体转移到 使得载体面向具有填充有导电材料的模板的表面的模板，使得可以形成可以使用现有设备转录成绝缘板的转录电路，由此可以降低成本。

公开(公告)号：US08281206B2

公开(公告)日：2012-10-02

申请号：US12268534

申请日：2008-11-11

申请人： Hyun Ho Choi ,  Kyung Hun Jang ,  Jung Hyun Park ,  Yong Ho Cho ,  Dong Jo Park

发明人： Hyun Ho Choi ,  Kyung Hun Jang ,  Jung Hyun Park ,  Yong Ho Cho ,  Dong Jo Park

IPC分类号： H03M13/00

CPC分类号： H03M13/356 ,  H03M13/1102 ,  H03M13/1148 ,  H03M13/353 ,  H04L1/0009 ,  H04L1/04

摘要： A low density parity code (LDPC) encoding and decoding devices and encoding and decoding methods thereof are provided. An LDPC encoding device includes an information obtaining unit which obtains status information of at least two frequency bands, a matrix generation unit which generates a parity check matrix based on the status information, the parity check matrix including sub matrices which correspond to the at least two frequency bands, and an encoder which generates data bits and parity bits using an LDPC with the generated parity check matrix.

摘要翻译： 提供了一种低密度奇偶校验码（LDPC）编码和解码装置及其编码和解码方法。 LDPC编码装置包括获取至少两个频带的状态信息的信息获取单元，基于状态信息生成奇偶校验矩阵的矩阵生成单元，所述奇偶校验矩阵包括对应于所述至少两个频带的子矩阵 频带，以及使用具有所生成的奇偶校验矩阵的LDPC生成数据位和奇偶校验位的编码器。

公开(公告)号：US08003439B2

公开(公告)日：2011-08-23

申请号：US12385316

申请日：2009-04-03

申请人： Myung-Sam Kang ,  Chang-Sup Ryu ,  Jung-Hyun Park ,  Hoe-Ku Jung ,  Ji-Eun Kim

发明人： Myung-Sam Kang ,  Chang-Sup Ryu ,  Jung-Hyun Park ,  Hoe-Ku Jung ,  Ji-Eun Kim

IPC分类号： H01L21/00

CPC分类号： H01L23/3128 ,  H01L21/568 ,  H01L21/6835 ,  H01L23/13 ,  H01L24/16 ,  H01L24/48 ,  H01L24/81 ,  H01L2221/68345 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/4824 ,  H01L2224/73215 ,  H01L2224/81801 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12044 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/30105 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A method of manufacturing a board on chip package including laminating a dry film on a carrier film, one side of which is laminated by a thin metal film; patterning the dry film in accordance with a circuit wire through light exposure and developing process, and forming a solder ball pad and a circuit wire; removing the dry film; laminating an upper photo solder resist excluding a portion where the solder ball pad is formed; etching the thin metal film formed on a portion where the upper photo solder resist is not laminated; mounting a semiconductor chip on the solder ball pad by a flip chip bonding; molding the semiconductor chip with a passivation material; removing the carrier film and the thin metal film; and laminating a lower photo solder resist under the solder ball pad. The board on chip package provides a high density circuit since a circuit pattern is formed using a seed layer.

摘要翻译： 一种制造片上封装的方法，包括在载体膜上层叠干膜，其一面由薄金属膜层压; 通过曝光和显影工艺根据电路线图案化干膜，并形成焊球焊盘和电路线; 去除干膜; 层压除了形成焊球垫的部分之外的上光阻焊剂; 蚀刻形成在上层光阻焊层未层叠的部分上的金属薄膜; 通过倒装芯片焊接将半导体芯片安装在焊球垫上; 用钝化材料成型半导体芯片; 去除载体膜和金属薄膜; 并在焊球下方层叠下光阻焊剂。 由于使用种子层形成电路图案，片上封装芯片提供了高密度电路。

公开(公告)号：US20110186342A1

公开(公告)日：2011-08-04

申请号：US13018971

申请日：2011-02-01

申请人： Young-Ji KIM ,  Kyung-Ro Yoon ,  Sang-Duck Kim ,  Jung-Hyun Park ,  Nam-Keun Oh ,  Jong-Gyu Choi ,  Ji-Eun Kim

发明人： Young-Ji KIM ,  Kyung-Ro Yoon ,  Sang-Duck Kim ,  Jung-Hyun Park ,  Nam-Keun Oh ,  Jong-Gyu Choi ,  Ji-Eun Kim

IPC分类号： H05K1/11 ,  H05K3/06

CPC分类号： H05K1/11 ,  H05K3/06 ,  Y10T29/49144 ,  Y10T29/49156

摘要： A single layered printed circuit board and a method of manufacturing the same are disclosed. In accordance with an embodiment of the present invention, the method can include forming a bonding pad, a circuit pattern and a post on a surface of an insulation film, in which one end part of the post is electrically connected to at least a portion of the circuit pattern, pressing an insulator on the surface of the insulation film, in which the circuit pattern and the post are buried in the insulator, selectively etching the insulator such that the other end part of the post is exposed, and opening a portion of the insulation film such that at least a portion of the bonding pad is exposed.

摘要翻译： 公开了一种单层印刷电路板及其制造方法。 根据本发明的实施例，该方法可以包括在绝缘膜的表面上形成焊盘，电路图案和柱，其中柱的一个端部电连接到绝缘膜的至少一部分 电路图案，将电路图案和柱埋在绝缘体中的绝缘膜表面上的绝缘体按压绝缘体，选择性地蚀刻绝缘体，使得柱的另一端暴露，并且打开一部分 所述绝缘膜使得所述焊盘的至少一部分露出。

公开(公告)号：US07972923B2

公开(公告)日：2011-07-05

申请号：US11605317

申请日：2006-11-29

申请人： Jung-Hyun Park ,  Jung-Geun Jee ,  Hyoeng-Ki Kim ,  Yong-Woo Hyung ,  Won-Jun Jang

发明人： Jung-Hyun Park ,  Jung-Geun Jee ,  Hyoeng-Ki Kim ,  Yong-Woo Hyung ,  Won-Jun Jang

IPC分类号： H01L21/336

CPC分类号： H01L29/7881 ,  H01L29/66825

摘要： A semiconductor device may include a tunnel insulating layer disposed on an active region of a substrate, field insulating patterns disposed in surface portions of the substrate to define the active region, each of the field insulating patterns having an upper recess formed at an upper surface portion thereof, a stacked structure disposed on the tunnel insulating layer, and impurity diffusion regions disposed at surface portions of the active region adjacent to the stacked structure.

摘要翻译： 半导体器件可以包括设置在衬底的有源区上的隧道绝缘层，设置在衬底的表面部分中以限定有源区的场绝缘图案，每个场绝缘图案具有形成在上表面部分的上凹部 设置在隧道绝缘层上的堆叠结构，以及设置在与堆叠结构相邻的有源区的表面部分处的杂质扩散区。