摘要:
An electrical wiring structure capable of improving a wiring delay to thereby achieve both low power consumption and high-speed performances without accompanying any significant changes in circuit layout and wiring structure of prior known CMOS logic circuitry and also alterations of the multilayer configuration of wiring layers is provided. A local wiring 1 and global wirings 2, 3 are stacked over a semiconductor substrate 10 in this order of sequence when looked at from lower part in a lamination direction, with dielectric layers sandwiched between adjacent ones of these layers. A distance between the local wiring 1 and the global wiring 2 is so formed as to be greater than a distance between the global wiring layer 2 and the global wiring 3. Thus provided is a semiconductor device featured in that a drive voltage used to drive the global wirings 2, 3 is potentially lower than a drive voltage for driving inside of the local wiring 1.
摘要:
An electrical circuit for measuring threshold voltages and also a circuit for controlling threshold value variations, while avoiding a need to significantly modify or alter the circuit layout, are provided. A semiconductor device has a plurality of substrate conductor regions commonly shared by multiple metal insulator semiconductor field effect transistors (MISFETs) of the same conductivity type, wherein each of the plurality of substrate conductor regions is electrically separated or isolated from one another.
摘要:
In a field effect transistor, an element isolation trench is formed around the element region on the major surface of a silicon substrate. A gate electrode is formed on the major surface in the element region via a gate insulating film. Source and drain regions are formed on the major surface of the element region to oppose via a channel region under the gate electrode. The channel region has a main portion having an upper surface at a level higher than the upper end portion of a trench side wall, and a side portion having an upper surface tilting downward from the main portion to the upper end portion of the trench side wall. The dopant impurity in the channel region has a concentration peak located at a level lower than the upper end portion of the trench side wall. The distance from the upper surface of the main portion to the concentration peak is larger than that from the upper surface of the side portion to the peak.
摘要:
A semiconductor memory device comprises a semiconductor substrate having a plurality of trenches selectively formed thereon, a plurality of capacitors formed in the trenches, each of the capacitors formed of the substrate, a capacitor insulating film formed on a surface of each of the trenches, and a storage node buried in each of the trenches interposing the capacitor insulating film, a plurality of transistors, formed on the substrate, for forming memory cells in relation to the plurality of capacitors, each of the transistors having a gate electrode formed on the substrate interposing a gate insulating film and source and drain regions formed in the substrate on both sides of the gate electrode, a plurality of element isolation films formed on side surfaces of upper portions of the trenches to surround the circumference thereof, respectively, the element isolation films having adjacent ones of the isolation films selectively coupled to each other such that at least one of the transistors is electrically insulated from another one of the transistors, and a plurality of conductive members, each connecting one of the source and drain regions of each of the transistors to the storage node of a corresponding one of the capacitors.
摘要:
A semiconductor memory device includes a source region, a drain region, a channel region, a charge storage layer, and a control gate electrode. The source region and drain region are formed separately from each other in a surface of a semiconductor substrate. The channel region is formed in the semiconductor substrate and located between the source region and the drain region. The charge storage layer is formed on the channel region with a first insulating film interposed therebetween. The control gate electrode is formed on the charge storage layer with a second insulating film interposed therebetween. The control gate has an upper corner portion rounded with a radius of curvature of 5 nm or more.
摘要:
A memory includes a first word line which is connected to a control gate electrode of a first memory cell, a second word line which is connected to a control gate electrode of a second memory cell, a potential transfer line which is connected to both of the first and second word lines, a first N-channel MOS transistor which is connected between the first word line and the potential transfer line, and a second N-channel MOS transistor which is connected between the second word line and the potential transfer line. A control circuit supplies a first potential with a plus value to a semiconductor substrate, and supplies a second potential with the plus value lower than the first potential to the potential transfer line, to turn the first N-channel MOS transistor on, and to turn the second N-channel MOS transistor off, in erasing data of the first memory cell.
摘要:
According to one embodiment, a nonvolatile semiconductor memory device includes an element region, a gate insulating film, a first gate electrode, an intergate insulating film, a second gate electrode and an element isolation region. The gate insulating film is formed on the element region. The first gate electrode is formed on the gate insulating film. The intergate insulating film is formed on the first gate electrode and has an opening. The second gate electrode is formed on the intergate insulating film and in contact with the first gate electrode via the opening. The element isolation region encloses a laminated structure formed by the element region, the gate insulating film, and the first gate electrode. The air gap is formed between the element isolation region and side surfaces of the element region, the gate insulating film and the first gate electrode.
摘要:
According to one embodiment, a semiconductor device comprises an active area extending in a first direction, a contact plug located on a first portion of the active area, and a transistor located on a second portion adjacent to the first portion of the active area in the first direction. A width of a top surface area of the first portion in a second direction perpendicular to the first direction is smaller than that of a top surface area of the second portion in the second direction.
摘要:
Vertical MISFETs are formed over drive MISFETs and transfer MISFETs. The vertical MISFETs comprise rectangular pillar laminated bodies each formed by laminating a lower semiconductor layer (drain), an intermediate semiconductor layer, and an upper semiconductor layer (source), and gate electrodes formed on corresponding side walls of the laminated bodies with gate insulating films interposed therebetween. In each vertical MISFET, the lower semiconductor layer constitutes a drain, the intermediate semiconductor layer constitutes a substrate (channel region), and the upper semiconductor layer constitutes a source. The lower semiconductor layer, the intermediate semiconductor layer and the upper semiconductor layer are each comprised of a silicon film. The lower semiconductor layer and the upper semiconductor layer are doped with a p type and constituted of a p type silicon film.
摘要:
According to one embodiment, a semiconductor memory device includes a memory array and a peripheral circuit. The memory array has a plurality of memory cells, word lines, and bit lines, in which a first, second, and third blocks are set in the order along the bit line. The peripheral circuit has a transistor group. The transistor group includes a first transfer transistor belonging to the first block, a second transfer transistor belonging to the second block, and a third transfer transistor belonging to the third block. The first, second, and third transfer transistors share the other of a source and a drain of each. With regard to a direction in which either of the source and the drain is connected to the other in each of the first, second, and third transfer transistors, the directions of the adjacent transfer transistors are different from each other by 90° or 180°.