公开(公告)号：US06532157B1

公开(公告)日：2003-03-11

申请号：US09714622

申请日：2000-11-16

Applicant: Thomas P. Glenn ,  Roy D. Hollaway ,  Steven Webster

Inventor： Thomas P. Glenn ,  Roy D. Hollaway ,  Steven Webster

IPC: H05K700

CPC classification number: H01L31/0203 ,  H01L2924/0002 ,  H05K1/02 ,  H05K1/189 ,  H01L2924/00

Abstract: A novel semiconductor package comprises a rigid dielectric, e.g., ceramic, substrate having first and second portions joined to one another at respective margins thereof to form an angle, e.g., a right angle, between the portions. Each of the portions has electrically conductive paths connected to one another through the angle. A semiconductor device, e.g., a die, is mounted to the first portion and electrically connected to the conductive paths thereof. An array of electrically conductive lands, balls, or pins are mounted on the second portion for connecting the package to a printed circuit board. In a high-power embodiment, the device is mounted directly on a threaded stud projecting from the first portion to enable intimate thermal coupling of the device to a heat sink. In another embodiment, a connector projects from the first portion to optically couple an optical device directly to an end of a fiber optic cable.

Abstract translation: 新颖的半导体封装包括刚性电介质，例如陶瓷衬底，其具有在其相应边缘处彼此连接的第一和第二部分，以在这些部分之间形成一个角度，例如直角。 每个部分具有通过该角度彼此连接的导电路径。 诸如裸片的半导体器件被安装到第一部分并且电连接到其导电路径。 在第二部分上安装有导电焊盘，滚珠或引脚的阵列，用于将封装连接到印刷电路板。 在大功率实施例中，该装置直接安装在从第一部分突出的螺柱上，以使装置能够与散热器紧密地热耦合。 在另一个实施例中，连接器从第一部分突出以将光学装置直接光耦合到光纤电缆的端部。

公开(公告)号：US06530515B1

公开(公告)日：2003-03-11

申请号：US09670501

申请日：2000-09-26

Applicant: Thomas P. Glenn ,  Steven Webster ,  Roy Dale Hollaway

Inventor： Thomas P. Glenn ,  Steven Webster ,  Roy Dale Hollaway

IPC: B23K3102

CPC classification number: B81B7/0077 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2924/16235 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: To form a micromachine package, bond pads on a front surface of a controller chip are aligned with corresponding traces on a front surface of a micromachine chip. The bond pads are physically connected to the traces thus mounting the controller chip as a flip chip to the micromachine chip. A bead is formed around a periphery of the controller chip. The bead and the controller chip form an enclosure around a micromachine area in the front surface of the micromachine chip. This enclosure protects the micromachine area from the ambient environment.

Abstract translation: 为了形成微机械组件，控制器芯片的前表面上的接合焊盘与微机械芯片前表面上的对应迹线对齐。 接合焊盘物理连接到迹线，从而将控制器芯片作为倒装芯片安装到微机械芯片。 在控制器芯片的周围形成珠。 珠和控制器芯片在微机械芯片的前表面周围形成围绕微机械区域的外壳。 该外壳保护微机械区域免受周围环境的影响。

公开(公告)号：US06522015B1

公开(公告)日：2003-02-18

申请号：US09670499

申请日：2000-09-26

Applicant: Thomas P. Glenn ,  Steven Webster ,  Roy Dale Hollaway

Inventor： Thomas P. Glenn ,  Steven Webster ,  Roy Dale Hollaway

IPC: H01L2940

CPC classification number: B81B7/0077 ,  B81C1/0023 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/05644 ,  H01L2224/16145 ,  H01L2224/48227 ,  H01L2224/94 ,  H01L2924/01079 ,  H01L2924/10253 ,  H01L2924/00 ,  H01L2224/81 ,  H01L2924/00014

Abstract: A micromachine package includes a micromachine chip having a micromachine area in a front surface of the micromachine chip. The package further includes a controller chip having a rear surface and a front surface. Bond pads are on the front surface of the controller chip. A bead secures the rear surface of the controller chip to the front surface of the micromachine chip. By mounting the controller chip directly on the micromachine chip, the size of the package is minimized. Further, the bead and controller chip form an enclosure around the micromachine area. This enclosure protects the micromachine area from the ambient environment.

Abstract translation: 微机械组件包括在微机械芯片的前表面中具有微机械区域的微机械芯片。 该封装还包括具有后表面和前表面的控制器芯片。 焊盘位于控制器芯片的前表面。 一个珠将控制器芯片的后表面固定到微机械芯片的前表面。 通过将控制器芯片直接安装在微机械芯片上，封装的尺寸最小化。 此外，珠和控制器芯片形成围绕微机械区域的外壳。 该外壳保护微机械区域免受周围环境的影响。

公开(公告)号：US06509560B1

公开(公告)日：2003-01-21

申请号：US09711993

申请日：2000-11-13

Applicant: Thomas P. Glenn ,  Steven Webster ,  Markus K. Liebhard

Inventor： Thomas P. Glenn ,  Steven Webster ,  Markus K. Liebhard

IPC: H01J4014

CPC classification number: H01L27/14618 ,  H01L27/14683 ,  H01L31/02005 ,  H01L31/0203 ,  H01L2224/94 ,  H01L2924/15151 ,  H01L2224/85 ,  H01L2224/81

Abstract: An image sensor package includes an image sensor having an upper surface. The image sensor further includes an active area and bond pads on the upper surface. A window is supported above the active area by a window support. A step up ring is mounted above a noncritical region of the upper surface of the image sensor between the active area and the bond pads. Electrically conductive traces on the step up ring are electrically connected to the bond pads by bond wires. An inner package body is formed between the step up ring and the window support and mechanically locks the window in place. An outer package body is formed to enclose the bond wires, the bond pads, and outer sides of the step up ring. The outer package body has outer sides coplanar with sides of the image sensor such that the image sensor assembly is chip size.

Abstract translation: 图像传感器封装包括具有上表面的图像传感器。 图像传感器还包括有效区域和上表面上的接合焊盘。 通过窗口支持在活动区域​​上方支持一个窗口。 升压环安装在图像传感器的上表面的非临界区域之间的有源区域和接合焊盘之间。 升压环上的导电迹线通过接合线电连接到接合焊盘。 内包装体形成在升压环和窗户支架之间，并将窗户机械地锁定在适当的位置。 外包装体形成为包围接合线，接合垫和升压环的外侧。 外包装体具有与图像传感器的侧面共面的外侧，使得图像传感器组件的芯片尺寸。

公开(公告)号：US06420776B1

公开(公告)日：2002-07-16

申请号：US09797759

申请日：2001-03-01

Applicant: Thomas P. Glenn ,  Steven Webster ,  Roy Dale Hollaway

Inventor： Thomas P. Glenn ,  Steven Webster ,  Roy Dale Hollaway

IPC: H01L21304

CPC classification number: H01L21/3043 ,  B23K26/382 ,  B23K26/40 ,  B23K2103/50 ,  H01L21/78

Abstract: A structure comprises a substrate with electronic components formed on a first surface of the substrate. The structure includes a scribe line on a first surface of the substrate. The structure includes a trench formed by a laser on the second or back-side surface of the substrate, thus protecting the front-side surface of the substrate and, more particularly, the electronic component such as an integrated circuit and/or functional unit on the front-side surface of the substrate during singulation. Since, according to the invention, no saw blade is used, the width of the scribe line does not need to be any larger than the width of the beam from the laser plus some minimal tolerance for alignment. As a result, using the invention, the width of scribe line is on the order of twenty-four times smaller than the width of scribe lines required by the prior art methods.

Abstract translation: 结构包括具有形成在基板的第一表面上的电子部件的基板。 该结构包括在基板的第一表面上的划线。 该结构包括在基板的第二或背面表面上由激光形成的沟槽，从而保护基板的前侧表面，更具体地，保护诸如集成电路和/或功能单元之类的电子部件 在分割期间衬底的前侧表面。 由于根据本发明，没有使用锯片，划线的宽度不需要大于来自激光器的光束的宽度加上对准的一些最小公差。 结果，使用本发明，划线的宽度比现有技术方法所需的划线宽度小24倍。

公开(公告)号：US06406934B1

公开(公告)日：2002-06-18

申请号：US09654978

申请日：2000-09-05

Applicant: Thomas P. Glenn ,  Steven Webster ,  Vincent DiCaprio

Inventor： Thomas P. Glenn ,  Steven Webster ,  Vincent DiCaprio

IPC: H01L2148

CPC classification number: H01L21/76898 ,  H01L23/481 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/05553 ,  H01L2224/32225 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48227 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01028 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/10162 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: The invention provides a manufacturing process for making chip-size semi-conductor packages (“CSPs”) at the wafer-level without the added size, cost, and complexity of substrates in the packages or the need to overmold them with plastic. One embodiment of the method includes the provision of a semiconductor wafer with opposite top and bottom surfaces and a plurality of dies integrally defined therein. Each die has an electronic device formed in a top surface thereof, and one or more electrically conductive vias extending therethrough that electrically connect the electronic device to the bottom surface of the die. The openings for the vias are formed ablatively with a laser and plated through with a conductive material. In a BGA form of the CSP, the vias connects the electronic device to lands on the bottom surface of the die. The lands may each have a bump of a conductive metal, e.g., solder, attached to it that functions as an input-output terminal of the CSP. When fabrication of the wafer is complete, the finished packages are singulated from the wafer using conventional wafer cutting techniques.

Abstract translation: 本发明提供了一种用于在晶片级制造芯片尺寸的半导体封装（“CSP”）的制造工艺，而不会增加封装中的基板的附加尺寸，成本和复杂性，或者需要用塑料覆盖它们。 该方法的一个实施例包括提供具有相对的顶表面和底表面的半导体晶片和在其中整体限定的多个模具。 每个管芯具有形成在其顶表面中的电子器件，以及一个或多个延伸穿过其中的导电通孔，其将电子器件电连接到管芯的底表面。 用于通孔的开口用激光器形成并通过导电材料电镀。 在CSP的BGA形式中，通孔将电子器件连接到管芯的底表面上的焊盘。 焊盘可以各自具有连接到其上的导电金属（例如焊料）的凸起，其用作CSP的输入 - 输出端子。 当晶片的制造完成时，使用常规的晶片切割技术从晶片上分离成品封装。

公开(公告)号：US06342406B1

公开(公告)日：2002-01-29

申请号：US09714682

申请日：2000-11-15

Applicant: Thomas P. Glenn ,  Steven Webster ,  Roy Dale Hollaway

Inventor： Thomas P. Glenn ,  Steven Webster ,  Roy Dale Hollaway

IPC: H01L2100

CPC classification number: H01L27/14636 ,  H01L27/14618 ,  H01L2224/05001 ,  H01L2224/05009 ,  H01L2224/05023 ,  H01L2224/05025 ,  H01L2224/05568 ,  H01L2224/05569 ,  H01L2224/16225 ,  H01L2924/00014 ,  H01L2224/05599 ,  H01L2224/05099

Abstract: Electrically conductive interior traces and exterior traces are formed on interior and exterior surfaces, respectively, of a window. The interior traces are electrically connected to the exterior traces by electrically conductive vias extending through the window. To mount the window to an image sensor, the interior traces are aligned with bond pads on a front surface of the image sensor. Flip chip bumps are formed between the interior traces and the bond pads thus mounting the window to the image sensor. A sealer is applied to form a seal between the window and the image sensor and to protect an active area of the image sensor.

Abstract translation: 导电内部痕迹和外部痕迹分别形成在窗户的内表面和外表面上。 内部迹线通过延伸穿过窗口的导电通孔电连接到外部迹线。 为了将窗口安装到图像传感器上，内部迹线与图像传感器前表面上的接合垫对齐。 在内部迹线和接合焊盘之间形成翻转芯片凸块，从而将窗口安装到图像传感器。 施加密封器以在窗口和图像传感器之间形成密封并且保护图像传感器的有效区域。

公开(公告)号：US20160060552A1

公开(公告)日：2016-03-03

申请号：US14939361

申请日：2015-11-12

Applicant: Man Kit Ng ,  Glen Barry Brons ,  Steven Webster Levine ,  Kevin Mallory ,  Hong Cheng ,  Patrick Brant ,  Donna J. Crowther

Inventor： Man Kit Ng ,  Glen Barry Brons ,  Steven Webster Levine ,  Kevin Mallory ,  Hong Cheng ,  Patrick Brant ,  Donna J. Crowther

IPC: C10G75/04 ,  C07D307/60 ,  C09K15/30

CPC classification number: C10G75/04 ,  C07D307/60 ,  C09K15/30 ,  C10G9/00 ,  C10G2300/1033 ,  C10G2300/4075 ,  C10G2300/80 ,  C10L1/2383

Abstract: The present invention provides a method for reducing fouling, including particulate-induced fouling, in a hydrocarbon refining process including the steps of providing a crude hydrocarbon for a refining process; adding at least one polyalkyl succinic anhydride derivative additive disclosed herein. The additive can be complexed with a boronating agent, such as boric acid, to yield a boron-containing polyalkyl succinic anhydride derivative.

Abstract translation: 本发明提供了一种在烃精炼方法中减少包括颗粒引起的结垢的结垢的方法，包括以下步骤：提供用于精制方法的粗烃; 加入本文公开的至少一种聚烷基琥珀酸酐衍生物添加剂。 添加剂可与硼化剂如硼酸络合，得到含硼聚烷基琥珀酸酐衍生物。

公开(公告)号：US09060111B2

公开(公告)日：2015-06-16

申请号：US13605000

申请日：2012-09-06

Applicant: Ashutosh Y. Shukla ,  Kenta K. Williams ,  Steven Webster

Inventor： Ashutosh Y. Shukla ,  Kenta K. Williams ,  Steven Webster

IPC: H04N5/335 ,  H01L31/0232 ,  H01R13/648 ,  H04N5/225

CPC classification number: H04N5/2254 ,  H04N5/2257

Abstract: A compact electronic device may include a camera module having an image sensor. The image sensor may be controlled by storage and processing circuitry to capture image data from received light. The camera module may include a substrate having front and rear surfaces. The image sensor may be mounted to the rear surface of the substrate. The substrate may include optical focusing structures on the front surface of the substrate that focus light through an opening in the substrate to the image sensor. A flex circuit may be used to convey signals between the camera module and other electronic device components. The flex circuit may be mounted to the front surface of the camera module substrate to help reduce total height of the camera module. The flex circuit may be mounted to an extended portion of the substrate or may be mounted to surround the periphery of the image sensor.

Abstract translation: 小型电子设备可以包括具有图像传感器的相机模块。 图像传感器可以由存储和处理电路控制以从接收的光捕获图像数据。 相机模块可以包括具有前表面和后表面的基底。 图像传感器可以安装到基板的后表面。 衬底可以包括在衬底的前表面上的光聚焦结构，其将光通过衬底中的开口聚焦到图像传感器。 柔性电路可以用于在相机模块和其它电子设备部件之间传送信号。 柔性电路可以安装到相机模块基板的前表面，以帮助降低相机模块的总高度。 柔性电路可以安装到基板的延伸部分，或者可以安装成围绕图像传感器的周边。

公开(公告)号：US20140063302A1

公开(公告)日：2014-03-06

申请号：US13605000

申请日：2012-09-06

Applicant: Ashutosh Y. Shukla ,  Kenta K. Williams ,  Steven Webster

Inventor： Ashutosh Y. Shukla ,  Kenta K. Williams ,  Steven Webster

IPC: H04N5/225 ,  H04N5/232 ,  H04N5/335

CPC classification number: H04N5/2254 ,  H04N5/2257

Abstract: A compact electronic device may include a camera module having an image sensor. The image sensor may be controlled by storage and processing circuitry to capture image data from received light. The camera module may include a substrate having front and rear surfaces. The image sensor may be mounted to the rear surface of the substrate. The substrate may include optical focusing structures on the front surface of the substrate that focus light through an opening in the substrate to the image sensor. A flex circuit may be used to convey signals between the camera module and other electronic device components. The flex circuit may be mounted to the front surface of the camera module substrate to help reduce total height of the camera module. The flex circuit may be mounted to an extended portion of the substrate or may be mounted to surround the periphery of the image sensor.

Abstract translation: 小型电子设备可以包括具有图像传感器的相机模块。 图像传感器可以由存储和处理电路控制以从接收的光捕获图像数据。 相机模块可以包括具有前表面和后表面的基底。 图像传感器可以安装到基板的后表面。 衬底可以包括在衬底的前表面上的光聚焦结构，其将光通过衬底中的开口聚焦到图像传感器。 柔性电路可用于在相机模块和其它电子设备部件之间传送信号。 柔性电路可以安装到相机模块基板的前表面，以帮助降低相机模块的总高度。 柔性电路可以安装到基板的延伸部分，或者可以安装成围绕图像传感器的周边。