公开(公告)号：US20060276097A1

公开(公告)日：2006-12-07

申请号：US10565902

申请日：2004-11-18

申请人： Akira Suzuki ,  Tomoaki Kato ,  Kazuyoshi Torii ,  Akikazu Taido

发明人： Akira Suzuki ,  Tomoaki Kato ,  Kazuyoshi Torii ,  Akikazu Taido

IPC分类号： H01T13/20

CPC分类号： H01T21/02 ,  H01T13/20 ,  H01T13/39

摘要： There is provided a method for producing a spark plug in which welding strength between a noble metal tip and an electrode joined by laser welding can be restrained from becoming weak. A noble metal tip (90) to be joined to a center electrode (2) or ground electrode of a spark plug to form a spark discharge gap is resistance-welded to each electrode containing no noble metal and then laser-welded. In the noble metal tip (90) exposed under a severe environment involving spark discharge, a molten portion (80) formed in such a manner that a portion of the noble metal tip (90) and a portion of the electrode are melted by laser welding and a non-molten portion (95) on the noble metal tip (90) side are apt to be peeled from each other in a boundary surface (83) between the molten portion (80) and the non-molten portion (95). The noble metal content in the molten portion (80) however becomes higher because a flange portion is formed in a bottom portion by pressing force applied on the noble metal tip (90) at the time of resistance welding and then irradiated with a laser beam. Accordingly, peeling can be prevented from occurring in the boundary surface (83).

摘要翻译： 提供一种用于制造火花塞的方法，其中可以抑制贵金属电极头和通过激光焊接接合的电极之间的焊接强度变弱。 要连接到火花塞的中心电极（2）或接地电极以形成火花放电间隙的贵金属端头（90）被电阻焊接到不含贵金属的每个电极上，然后被激光焊接。 在涉及火花放电的恶劣环境下露出的贵金属电极头（90）中，以使得贵金属电极头（90）的一部分和电极的一部分通过激光焊接而熔化的方式形成的熔融部（80） 并且在熔融部分（80）和非熔融部分（95）之间的边界表面（83）中，在贵金属端头（90）侧上的非熔融部分（95）易于彼此剥离。 然而，熔融部分（80）中的贵金属含量变高，因为通过在电阻焊接时施加在贵金属电极头（90）上的压力而在底部形成凸缘部分，然后用激光束照射。 因此，能够防止在边界面（83）发生剥离。

公开(公告)号：US20060250050A1

公开(公告)日：2006-11-09

申请号：US11397952

申请日：2006-04-04

申请人： Tomohisa Azuma ,  Masakazu Hirose ,  Akira Suzuki ,  Kouji Taniwaki

发明人： Tomohisa Azuma ,  Masakazu Hirose ,  Akira Suzuki ,  Kouji Taniwaki

IPC分类号： H01L41/187

CPC分类号： H03H3/02 ,  H03H9/02031 ,  H03H9/1014 ,  H03H9/1035 ,  H03H9/177

摘要： There is provided a resonator having a piezoelectric ceramic resonator which has excellent free-fall resistance. The resonator comprises a piezoelectric ceramic resonator 2 with a vibrating electrode formed, and a substrate 3 which supports the piezoelectric ceramic resonator 2, wherein the piezoelectric ceramic resonator 2 satisfies the condition of U≧0.88×H+20.28, wherein U=maximum elastic energy (kJ/m3) per unit volume, and H=drop height (m) (H>1). The present invention can be applied to a resonator 1, wherein the substrate 3 has terminal electrodes 31, 32, and the piezoelectric ceramic resonator 2 is in electrical continuity with the vibrating electrode and is supported on the substrate 3 at both ends via a conductive stator 4.

摘要翻译： 提供了具有优异的自由落体电阻的压电陶瓷谐振器的谐振器。 谐振器包括：形成有振动电极的压电陶瓷谐振器2和支撑压电陶瓷谐振器2的基板3，其中压电陶瓷谐振器2满足U> = 0.88×H + 20.28的条件，其中U =最大弹性能 （kJ / m 3）/ H =滴高（m）（H> 1）。 本发明可以应用于谐振器1，其中基片3具有端子电极31,32，并且压电陶瓷谐振器2与振动电极电连通，并且通过导电定子在两端支撑在基板3上 4。

公开(公告)号：US20060202348A1

公开(公告)日：2006-09-14

申请号：US11362503

申请日：2006-02-27

申请人： Kojiro Kameyama ,  Akira Suzuki ,  Yoshio Okayama ,  Mitsuo Umemoto

发明人： Kojiro Kameyama ,  Akira Suzuki ,  Yoshio Okayama ,  Mitsuo Umemoto

IPC分类号： H01L23/48 ,  H01L21/4763

CPC分类号： H01L24/11 ,  H01L21/76898 ,  H01L23/3114 ,  H01L23/481 ,  H01L24/12 ,  H01L2224/05001 ,  H01L2224/05008 ,  H01L2224/05024 ,  H01L2224/05124 ,  H01L2224/05147 ,  H01L2224/05166 ,  H01L2224/05181 ,  H01L2224/05184 ,  H01L2224/05186 ,  H01L2224/05548 ,  H01L2224/05569 ,  H01L2224/05624 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/13099 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01022 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/04941 ,  H01L2924/04953 ,  H01L2924/12042 ,  H01L2924/15788 ,  H01L2924/351 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/013

摘要： A semiconductor device with improved reliability and its manufacturing method is offered. The semiconductor device of this invention includes a pad electrode formed on a semiconductor substrate through a first insulation layer, and a via hole formed in the semiconductor substrate and extending from a back surface of the semiconductor substrate to the pad electrode, wherein the via hole includes a first opening of which a diameter in a portion close to the pad electrode is larger than a diameter in a portion close to the back surface of the semiconductor substrate, and a second opening formed in the first insulation layer and continuing from the first opening, of which a diameter in a portion close to the pad electrode is smaller than a diameter in a portion close to the front surface of the semiconductor substrate.

摘要翻译： 提供了可靠性提高的半导体器件及其制造方法。 本发明的半导体器件包括通过第一绝缘层形成在半导体衬底上的焊盘电极和形成在半导体衬底中并从半导体衬底的背表面延伸到焊盘电极的通孔，其中通孔包括 第一开口部，其靠近焊盘电极的部分的直径大于靠近半导体基板的背面的部分的直径;以及第二开口，形成在第一绝缘层中并与第一开口连续， 其中靠近焊盘电极的部分的直径小于靠近半导体衬底的前表面的部分的直径。

公开(公告)号：US07102238B2

公开(公告)日：2006-09-05

申请号：US10828556

申请日：2004-04-21

申请人： Takashi Noma ,  Akira Suzuki ,  Hiroyuki Shinogi

发明人： Takashi Noma ,  Akira Suzuki ,  Hiroyuki Shinogi

IPC分类号： H01L23/48 ,  H01L23/52 ,  H01L29/40

CPC分类号： H01L24/02 ,  H01L21/76898 ,  H01L23/3114 ,  H01L25/0657 ,  H01L27/14806 ,  H01L2224/0401 ,  H01L2224/16 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06527 ,  H01L2225/06565 ,  H01L2924/01005 ,  H01L2924/01014 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/00

摘要： A stacked MCM is manufactured at reduced cost without using expensive apparatus. A first wiring and a second wiring are formed on a surface of a semiconductor chip of a first semiconductor device through an insulation film. A glass substrate having an opening to expose the second wiring is bonded to the surface of the semiconductor chip on which the first wiring and the second wiring are formed. A third wiring is disposed on a back surface and a side surface of the semiconductor chip through an insulation film and connected to the first wiring. And a conductive terminal of another semiconductor device is connected to the second wiring through the opening.

摘要翻译： 在不使用昂贵的设备的情况下，以低成本制造堆叠MCM。 通过绝缘膜在第一半导体器件的半导体芯片的表面上形成第一布线和第二布线。 具有露出第二布线的开口的玻璃基板被接合到形成有第一布线和第二布线的半导体芯片的表面上。 第三布线通过绝缘膜设置在半导体芯片的背面和侧面上并连接到第一布线。 并且另一半导体器件的导电端子通过开口连接到第二布线。

公开(公告)号：US07087010B2

公开(公告)日：2006-08-08

申请号：US10017743

申请日：2001-12-14

申请人： Takashi Ootawara ,  Akira Suzuki ,  Hiroaki Kubokawa ,  Hidenobu Kimura ,  Osamu Tamada ,  Mamoru Nakada ,  Masayuki Iwasaka

发明人： Takashi Ootawara ,  Akira Suzuki ,  Hiroaki Kubokawa ,  Hidenobu Kimura ,  Osamu Tamada ,  Mamoru Nakada ,  Masayuki Iwasaka

IPC分类号： A61B1/00

CPC分类号： A61B1/00098 ,  A61B1/0052 ,  A61B1/01 ,  A61B2017/22038 ,  A61B2017/22045

摘要： Guide wire fixing means is provided for an insertion portion of an endoscope, and a guide wire is releasably engaged when inserting/removing a therapeutic instrument running on the guide wire with a distal end portion of the guide wire inserted into a therapeutic instrument insertion channel of the endoscope being led out from a distal end opening portion of the channel.

公开(公告)号：US20060120754A1

公开(公告)日：2006-06-08

申请号：US11329038

申请日：2006-01-11

申请人： Akira Suzuki ,  Osamu Anan

发明人： Akira Suzuki ,  Osamu Anan

IPC分类号： G03G21/16

CPC分类号： G03G15/757 ,  B29C65/4815 ,  B29C65/4895 ,  B29C65/542 ,  B29C65/548 ,  B29C66/112 ,  B29C66/114 ,  B29C66/1222 ,  B29C66/1224 ,  B29C66/5344 ,  B29C66/71 ,  B29C66/73161 ,  B29C66/73921 ,  B29K2995/0072 ,  G03G15/00 ,  G03G21/1619 ,  Y10S222/01 ,  B29K2025/06 ,  B29K2023/16 ,  B29K2009/06 ,  B29K2009/00 ,  B29K2007/00

摘要： A first component part formed of a first styrene resin composition and a second component part formed of a second styrene resin composition are fastened by solvent welding by means of a terpene type solvent, to provide a cartridge which is almost free of deformation at the peripheries of joints, has a high positioning precision for component parts and has a high rigidity.

公开(公告)号：US20060096715A1

公开(公告)日：2006-05-11

申请号：US11302217

申请日：2005-12-14

申请人： Takehiko Suzuki ,  Yasuhisa Matsukawa ,  Akira Suzuki

发明人： Takehiko Suzuki ,  Yasuhisa Matsukawa ,  Akira Suzuki

IPC分类号： B01D1/00

CPC分类号： A61K9/1647 ,  A61K9/1635 ,  A61K9/1694 ,  B01D61/362 ,  B01D63/02 ,  B01D71/70 ,  B01D2311/06 ,  B01D2315/06 ,  B01J13/12 ,  C08J3/16 ,  Y10T428/2985 ,  B01D2311/106 ,  B01D2311/2626

摘要： It is to provide an improved method for preparation of microsphere from an emulsion wherein an organic phase containing an organic solvent having a boiling point lower than that of water and a hardly-water-soluble polymer is emulsified in an aqueous phase by an in-water drying method, which comprises: (1) using an apparatus equipped with a gas separation membrane; (2) supplying the emulsion to be subjected to in-water drying to one side of said gas separation membrane; (3) evaporating off the organic solvent contained in said emulsion to the other side of said gas separation membrane, which can remove the organic solvent with high efficiency and can be carried out in a closed system and hence is favorable from the environmental viewpoint.

公开(公告)号：US20050269704A1

公开(公告)日：2005-12-08

申请号：US11054603

申请日：2005-02-10

申请人： Koujiro Kameyama ,  Akira Suzuki ,  Yoshio Okayama

发明人： Koujiro Kameyama ,  Akira Suzuki ,  Yoshio Okayama

IPC分类号： H01L23/52 ,  H01L21/3205 ,  H01L21/60 ,  H01L21/768 ,  H01L23/12 ,  H01L23/48 ,  H01L29/74 ,  H01L21/4763

CPC分类号： H01L21/76898 ,  H01L23/481 ,  H01L27/14683 ,  H01L2224/05001 ,  H01L2224/05008 ,  H01L2224/05022 ,  H01L2224/05024 ,  H01L2224/05026 ,  H01L2224/05124 ,  H01L2224/05181 ,  H01L2224/05548 ,  H01L2224/05569 ,  H01L2224/05624 ,  H01L2224/05647 ,  H01L2224/16 ,  H01L2924/01078 ,  H01L2924/04941 ,  H01L2924/3025 ,  H01L2924/00014

摘要： This invention provides a semiconductor device and a manufacturing method thereof which can minimize deterioration of electric characteristics of the semiconductor device without increasing an etching process. In the semiconductor device of the invention, a pad electrode layer formed of a first barrier layer and an aluminum layer laminated thereon is formed on a top surface of a semiconductor substrate. A supporting substrate is further attached on the top surface of the semiconductor substrate. A second barrier layer is formed on a back surface of the semiconductor substrate and in a via hole formed from the back surface of the semiconductor substrate to the first barrier layer. Furthermore, a re-distribution layer is formed in the via hole so as to completely fill the via hole or so as not to completely fill the via hole. A ball-shaped terminal is formed on the re-distribution layer.

摘要翻译： 本发明提供一种半导体器件及其制造方法，其可以在不增加蚀刻工艺的情况下最小化半导体器件的电特性的劣化。 在本发明的半导体器件中，在半导体衬底的顶表面上形成由第一阻挡层和层叠在其上的铝层形成的焊盘电极层。 支撑衬底进一步附着在半导体衬底的顶表面上。 第二阻挡层形成在半导体衬底的背面和从半导体衬底的背面形成到第一阻挡层的通孔中。 此外，在通孔中形成再分布层，以便完全填充通孔或不完全填充通孔。 在再分配层上形成有球状的端子。

公开(公告)号：US20050264848A1

公开(公告)日：2005-12-01

申请号：US11139298

申请日：2005-05-27

申请人： Akira Suzuki

发明人： Akira Suzuki

IPC分类号： G06F15/00 ,  G06K15/02

CPC分类号： G06K15/02 ,  G06K15/1811 ,  G06K15/1849 ,  G06T11/60

摘要： To select an element block from an element tree obtained by analyzing a structured document and arrange the element block into a page in a simple and appropriate manner. First, a pointer for referring to a next previous element block is provided. Secondly, page-break processing corresponding to the type of contents of the element block is performed.

摘要翻译： 从通过分析结构化文档获得的元素树中选择元素块，并以简单和适当的方式将元素块布置到页面中。 首先，提供用于引用下一个前一个元素块的指针。 其次，执行与元素块的内容的类型对应的分页处理。

公开(公告)号：US20050235810A1

公开(公告)日：2005-10-27

申请号：US11159524

申请日：2005-06-22

申请人： Norihisa Aoki ,  Noriyuki Torimura ,  Akira Suzuki

发明人： Norihisa Aoki ,  Noriyuki Torimura ,  Akira Suzuki

IPC分类号： A63H5/00 ,  G04B13/00 ,  G10H1/00 ,  G10H1/36 ,  G10H7/00

CPC分类号： G10H1/0066 ,  G10H1/0058 ,  G10H2240/026 ,  G10H2240/056 ,  G10H2240/305 ,  G10H2240/311

摘要： An electronic organ 1 and a personal computer 2 are connected with a MIDI cable. The personal computer 2 is connected to a server 4 via a communication network 3. The personal computer 2 downloads a controlling program from the server 4. The electronic organ 1 is set to be a listening trial mode by an operation of the personal computer 2. In the listening trial mode, an output of a data in a temporally storage area is prohibited. The server 4 provides a first encoded performance data to the personal computer 2, and the personal computer 2 decodes the received first encoded performance data. The electronic organ 1 generates a key, and the personal computer 2 secondary encodes the performance data with the key and transmits it to the electronic organ 1. The electronic organ 1 deletes the data stored in the temporally storage area after the listening trial.