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公开(公告)号：US07965521B2
公开(公告)日：2011-06-21
申请号：US12010558
申请日：2008-01-25
申请人： Mi-Ja Han , Han Kim , Dae-Hyun Park , Jae-Joon Lee
发明人： Mi-Ja Han , Han Kim , Dae-Hyun Park , Jae-Joon Lee
IPC分类号： H05K9/00
CPC分类号： H01P1/2005 , H05K1/0236 , H05K2201/09309 , H05K2201/09663 , H05K2201/0969
摘要： An electromagnetic bandgap structure and a printed circuit board that can solve a mixed signal problem between an analog circuit and a digital circuit are disclosed. In accordance with an embodiment of the present invention, the electromagnetic bandgap structure can include a first metal layer; a first dielectric layer, stacked in the first metal layer; a metal plate, stacked in the first dielectric layer; a via, connecting the first metal layer to the metal plate; a second dielectric layer, stacked in the metal plate and the first dielectric layer; and a second metal layer, stacked in the second dielectric layer. Here, a hole can be formed on the metal plate. With the present invention, the electromagnetic bandgap structure can lower a noise level more within the same frequency band as compared with other structures having the same size.
摘要翻译： 公开了可解决模拟电路和数字电路之间的混合信号问题的电磁带隙结构和印刷电路板。 根据本发明的实施例，电磁带隙结构可以包括第一金属层; 第一介电层，堆叠在第一金属层中; 金属板，堆叠在第一介电层中; 通孔，将所述第一金属层连接到所述金属板; 第二电介质层，堆叠在所述金属板和所述第一介电层中; 和第二金属层，堆叠在第二介电层中。 这里，可以在金属板上形成孔。 利用本发明，与具有相同尺寸的其他结构相比，电磁带隙结构可以在相同频带内更低噪声水平。
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92.发明授权Electromagnetic bandgap structure and printed circuit board including multi-via 有权电磁带隙结构和印刷电路板，包括多通孔公开(公告)号：US07944320B2
公开(公告)日：2011-05-17
申请号：US12076650
申请日：2008-03-20
CPC分类号： H05K1/0236 , H05K2201/09309 , H05K2201/09627 , H05K2201/09663
摘要： An electromagnetic bandgap structure and a printed circuit board that intercepts to transfer a signal having a predetermined frequency band are disclosed. In particularly, the electromagnetic bandgap structure includes a first metal layer and a second metal layer; a metal plate, placed between the first metal layer and a second metal layer; a multi-via, penetrating the first metal layer, passing through the same planar surface as an outer metal layer and turning toward the first metal layer to connect the metal plate and the first metal layer; and a dielectric layer, stacked in between the first metal layer and the metal plate, between the metal plate and the second metal layer and between the first metal layer and the outer metal layer. With the present invention, a bandgap frequency can be decreased without increasing the size of the metal plate.
摘要翻译： 公开了一种电磁带隙结构和用于传送具有预定频带的信号的印刷电路板。 特别地，电磁带隙结构包括第一金属层和第二金属层; 金属板，放置在第一金属层和第二金属层之间; 穿过第一金属层的多通孔，穿过与外部金属层相同的平面，并朝着第一金属层转动以连接金属板和第一金属层; 以及电介质层，层叠在所述第一金属层和所述金属板之间，所述金属板与所述第二金属层之间以及所述第一金属层与所述外部金属层之间。 通过本发明，可以在不增加金属板的尺寸的情况下降低带隙频率。
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94.发明申请公开(公告)号：US20110069470A1
公开(公告)日：2011-03-24
申请号：US12654371
申请日：2009-12-17
申请人： Kang-Wook Bong , Han Kim , Mi-Ja Han
发明人： Kang-Wook Bong , Han Kim , Mi-Ja Han
IPC分类号： H05K9/00
CPC分类号： H05K1/0236 , H05K2201/09309 , H05K2201/09627
摘要： An EMI noise reduction board is disclosed. The electromagnetic interference (EMI) noise reduction board having an electromagnetic bandgap structure for shielding a noise includes a first area having a ground layer and a power layer, a second area placed in a side portion of the first area having an electromagnetic bandgap structure therein. The electromagnetic bandgap structure includes a plurality of first conductive plates placed along the side portion of the first area, a plurality of second conductive plates placed on a planar surface that is different from the first conductive plates so as to overlap with the first conductive plates, and a via configured to connect the first conductive plate and the second conductive plate.
摘要翻译： 公开了一种EMI降噪板。 具有用于屏蔽噪声的电磁带隙结构的电磁干扰（EMI）降噪板包括具有接地层和功率层的第一区域，放置在其中具有电磁带隙结构的第一区域的侧部中的第二区域。 电磁带隙结构包括沿着第一区域的侧面部分放置的多个第一导电板，多个第二导电板，放置在与第一导电板不同的平面上，以与第一导电板重叠， 以及经配置以连接第一导电板和第二导电板的通孔。
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95.发明申请公开(公告)号：US20100212951A1
公开(公告)日：2010-08-26
申请号：US12654766
申请日：2009-12-31
申请人： Han Kim , Je-Gwang Yoo , Chang-Sup Ryu
发明人： Han Kim , Je-Gwang Yoo , Chang-Sup Ryu
IPC分类号： H05K9/00
CPC分类号： H05K9/0071 , H01L2224/0554 , H01L2224/05568 , H01L2224/05573 , H01L2224/16225 , H01L2224/16227 , H01L2224/16235 , H01L2224/48091 , H01L2224/48227 , H01L2224/48228 , H01L2924/00014 , H01L2924/30107 , H01L2924/3011 , H01L2924/3025 , H05K1/0236 , H05K9/002 , H05K9/0064 , H05K2201/09309 , H05K2201/09627 , H01L2924/00 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： An EMI noise reduction board using an electromagnetic bandgap structure is disclosed. In the EMI noise reduction board according to an embodiment of the present invention, an electromagnetic bandgap structure having band stop frequency properties can be inserted into an inner portion of the board so as to shield an EMI noise, in which the portion corresponds to an edge of the board and in which the EMI noise is conducted from the inside to the edge of the board and radiates to the outside of the board.
摘要翻译： 公开了一种使用电磁带隙结构的EMI降噪板。 在根据本发明实施例的EMI噪声抑制板中，具有带阻频率特性的电磁带隙结构可以插入到板的内部，以屏蔽EMI噪声，其中该部分对应于边缘 并且其EMI噪声从板的内部传导到边缘并辐射到板的外部。
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公开(公告)号：US20100134200A1
公开(公告)日：2010-06-03
申请号：US12478965
申请日：2009-06-05
CPC分类号： H05K1/0236 , H05K2201/09309 , H05K2201/09627 , H05K2201/09681
摘要： An electromagnetic bandgap structure is disclosed. In accordance with an embodiment of the present invention, the electromagnetic bandgap structure can include a dielectric layer, a plurality of conductive plates, placed on a planar surface which is different from that of the dielectric layer, vias, of which each is connected to each of the conductive plates, respectively, and penetrates through the dielectric layer from one end part that is connected to the conductive plates, and a conductive trace, which connects the other end parts of the vias with each other such that all of the conductive plates are electrically connected.
摘要翻译： 公开了电磁带隙结构。 根据本发明的实施例，电磁带隙结构可以包括介电层，多个导电板，放置在与电介质层不同的平面表面上，每个导电板各自与每个导电板连接 的导电板，并且从连接到导电板的一个端部穿过电介质层，以及导电迹线，其将通孔的另一个端部彼此连接，使得所有的导电板是 电连接。
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97.发明申请Printed circuit board including outmost fine circuit pattern and method of manufacturing the same 审中-公开印刷电路板包括极细电路图案及其制造方法公开(公告)号：US20090288872A1
公开(公告)日：2009-11-26
申请号：US12219078
申请日：2008-07-15
申请人： Han Kim , Mi Sun Hwang , Suk Won Lee , Chang Gun Oh
发明人： Han Kim , Mi Sun Hwang , Suk Won Lee , Chang Gun Oh
CPC分类号： H05K3/462 , H05K1/0265 , H05K1/0366 , H05K3/025 , H05K3/108 , H05K3/4623 , H05K2201/0352 , H05K2201/0394 , H05K2201/09527 , H05K2201/09545 , H05K2201/09563 , H05K2201/096 , H05K2201/09736 , Y10T29/49126 , Y10T29/49165
摘要： Disclosed herein is a printed circuit board including an outmost fine circuit pattern. In the board, an end of a via, which has the minimum diameter, is connected to the outmost circuit layer of a substrate. The end surface, having the minimum diameter, is positioned at the outmost layer, so that the outmost circuit layer of the substrate, which needs to have a relatively high density in order to mount chips, compared to other circuit layers, can be more finely formed.
摘要翻译： 这里公开了包括最外部的精细电路图案的印刷电路板。 在板中，具有最小直径的通孔的端部连接到基板的最外层电路层。 具有最小直径的端面位于最外层，使得与其它电路层相比，为了安装芯片而需要具有相对较高密度的衬底的最外层电路层可以更细 形成。
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98.发明申请Printed circuit board with embedded chip capacitor and chip capacitor embedment method 审中-公开印刷电路板采用嵌入式芯片电容和片式电容器嵌入法公开(公告)号：US20090085691A1
公开(公告)日：2009-04-02
申请号：US12007793
申请日：2008-01-15
申请人： Han Kim , Je-Gwang Yoo , Mi-Ja Han , Dae-Hyun Park
发明人： Han Kim , Je-Gwang Yoo , Mi-Ja Han , Dae-Hyun Park
CPC分类号： H05K1/0231 , H01L2224/16225 , H05K1/0236 , H05K1/165 , H05K1/185 , H05K2201/093 , H05K2201/09309 , H05K2201/09509 , H05K2201/09663 , H05K2201/10636 , H05K2201/10643 , Y02P70/611 , Y10T29/4913 , Y10T29/49146
摘要： A printed circuit board having an embedded chip capacitor is disclosed. According to an embodiment of the present invention, a printed circuit board having an embedded chip capacitor can include a first conductive layer; a second conductive layer, placed away from the first conductive layer; a chip capacitor, placed between the first conductive layer and the second conductive layer and having a second electrode, connected to the second conductive layer; and a via, connecting the first conductive layer to a first electrode of the chip capacitor. With the present invention, a problem mixed signals can be solved in the printed circuit board including an analog circuit and a digital circuit board by using the chip capacitor embedded in the printed circuit board as an electromagnetic bandgap structure. Here, various electrical devices or elements are mounted in the printed circuit board.
摘要翻译： 公开了一种具有嵌入式芯片电容器的印刷电路板。 根据本发明的实施例，具有嵌入式芯片电容器的印刷电路板可以包括第一导电层; 远离所述第一导电层放置的第二导电层; 芯片电容器，放置在第一导电层和第二导电层之间，并具有连接到第二导电层的第二电极; 以及将所述第一导电层连接到所述芯片电容器的第一电极的通孔。 利用本发明，通过使用嵌入在印刷电路板中的片状电容器作为电磁带隙结构，可以在包括模拟电路和数字电路板的印刷电路板中解决问题混合信号。 这里，各种电气设备或元件安装在印刷电路板中。
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公开(公告)号：US20080266026A1
公开(公告)日：2008-10-30
申请号：US12010558
申请日：2008-01-25
申请人： Mi-Ja Han , Han Kim , Dae-Hyun Park , Jae-Joon Lee
发明人： Mi-Ja Han , Han Kim , Dae-Hyun Park , Jae-Joon Lee
IPC分类号： H03H7/00
CPC分类号： H01P1/2005 , H05K1/0236 , H05K2201/09309 , H05K2201/09663 , H05K2201/0969
摘要： An electromagnetic bandgap structure and a printed circuit board that can solve a mixed signal problem between an analog circuit and a digital circuit are disclosed. In accordance with an embodiment of the present invention, the electromagnetic bandgap structure can include a first metal layer; a first dielectric layer, stacked in the first metal layer; a metal plate, stacked in the first dielectric layer; a via, connecting the first metal layer to the metal plate; a second dielectric layer, stacked in the metal plate and the first dielectric layer; and a second metal layer, stacked in the second dielectric layer. Here, a hole can be formed on the metal plate. With the present invention, the electromagnetic bandgap structure can lower a noise level more within the same frequency band as compared with other structures having the same size.
摘要翻译： 公开了可解决模拟电路和数字电路之间的混合信号问题的电磁带隙结构和印刷电路板。 根据本发明的实施例，电磁带隙结构可以包括第一金属层; 第一介电层，堆叠在第一金属层中; 金属板，堆叠在第一介电层中; 通孔，将所述第一金属层连接到所述金属板; 第二电介质层，堆叠在所述金属板和所述第一介电层中; 和第二金属层，堆叠在第二介电层中。 这里，可以在金属板上形成孔。 利用本发明，与具有相同尺寸的其他结构相比，电磁带隙结构可以在相同频带内更低噪声水平。
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100.发明授权Printed circuit board including embedded capacitor and method of fabricating same 有权包括嵌入式电容器的印刷电路板及其制造方法公开(公告)号：US07435911B2
公开(公告)日：2008-10-14
申请号：US11096411
申请日：2005-03-31
申请人： Young Woo Kim , Byoung Youl Min , Chang Myung Ryu , Woo Lim Chae , Han Kim
发明人： Young Woo Kim , Byoung Youl Min , Chang Myung Ryu , Woo Lim Chae , Han Kim
IPC分类号： H05K1/16
CPC分类号： H05K1/162 , H05K3/0047 , H05K3/427 , H05K2201/0187 , H05K2201/09645 , H05K2201/09836 , H05K2201/09981 , H05K2203/1476 , Y10T29/49155 , Y10T29/49156
摘要： Disclosed is a PCB including an embedded capacitor and a method of fabricating the same. The long embedded capacitor is formed through an insulating layer, making a high capacitance and various capacitance designs possible.
摘要翻译： 公开了一种包括嵌入式电容器的PCB及其制造方法。 长的嵌入式电容器通过绝缘层形成，使得高电容和各种电容设计成为可能。
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