公开(公告)号：US20050142299A1

公开(公告)日：2005-06-30

申请号：US10934826

申请日：2004-09-03

申请人： Eok Kim ,  Ho Lee ,  Myung Ryu ,  Jae Park ,  Kyoung Son ,  Jun Lee ,  Se Kwon

发明人： Eok Kim ,  Ho Lee ,  Myung Ryu ,  Jae Park ,  Kyoung Son ,  Jun Lee ,  Se Kwon

IPC分类号： H01L21/20 ,  B05D3/00 ,  C30B13/24 ,  C30B29/06 ,  G02F1/13 ,  H01L21/268 ,  H01L21/324 ,  H01L21/336 ,  H01L29/786

CPC分类号： H01L29/6675 ,  C30B13/24 ,  C30B29/06

摘要： Disclosed is a method for forming a polycrystalline silicon film of a polycrystalline silicon thin film transistor. The method includes a step of crystallizing an amorphous silicon film deposited on a glass substrate by irradiating a laser beam onto the amorphous silicon film using a mask pattern. The glass substrate is horizontally moved by a predetermined distance unit corresponding to a translation distance of the mask pattern when the laser beam is irradiated onto the amorphous silicon film through a mask having the mask pattern, thereby growing grains in a circular shape.

摘要翻译： 公开了一种形成多晶硅薄膜晶体管的多晶硅膜的方法。 该方法包括通过使用掩模图案将激光束照射到非晶硅膜上而使沉积在玻璃基板上的非晶硅膜结晶的步骤。 当通过具有掩模图案的掩模将激光束照射到非晶硅膜上时，玻璃基板水平移动与掩模图案的平移距离对应的预定距离单位，从而生长为圆形的晶粒。

公开(公告)号：US20050140275A1

公开(公告)日：2005-06-30

申请号：US11008825

申请日：2004-12-23

申请人： Jae Park

发明人： Jae Park

IPC分类号： H05B33/14 ,  H01L27/32 ,  H01L51/50 ,  H01L51/52 ,  H05B33/08 ,  H05B33/20 ,  H05B33/22 ,  H05B33/26

CPC分类号： H01L51/5036 ,  H01L27/3209 ,  H01L27/322 ,  H01L27/3246 ,  H01L27/3251 ,  H01L51/5284 ,  H01L2251/5315

摘要： An organic electronluminescence device includes an array element divided into sub-pixels and including thin film transistors formed in the sub-pixels; a color conversion portion disposed below a second substrate and including a red (R), green (G) and blue (B) conversion layer for converting white light into three primary colors of red (R), green (G) and blue (B); a first electrode disposed below the color conversion portion and including a transparent conductive material; an organic EL layer disposed below the first electrode in the sub-pixels and including a plurality of stack units each including a charge generation layer, an electrode transporting layer, a hole transporting layer and an emission layer; a second electrode patterned below the organic EL layer in the sub-pixels; and a conductive spacer electrically connecting the thin film transistors with the second electrode.

摘要翻译： 有机电致发光器件包括被划分成子像素并且包括形成在子像素中的薄膜晶体管的阵列元件; 设置在第二基板的下方并包括红色（R），绿色（G）和蓝色（B）转换层的颜色转换部分，用于将白光转换成红色（R），绿色（G）和蓝色（B ）; 第一电极，设置在所述颜色转换部分的下面，并且包括透明导电材料; 设置在所述子像素中的所述第一电极下方的有机EL层，并且具有包含电荷产生层，电极传输层，空穴传输层和发射层的多个堆叠单元; 在子像素中的有机EL层下方构图的第二电极; 以及将薄膜晶体管与第二电极电连接的导电间隔件。

公开(公告)号：US20050122036A1

公开(公告)日：2005-06-09

申请号：US10964974

申请日：2004-10-15

申请人： Jae Park ,  Nam Yang Lee ,  Kwan Soo Kim

发明人： Jae Park ,  Nam Yang Lee ,  Kwan Soo Kim

IPC分类号： H05B33/04 ,  G09F9/30 ,  H01J1/62 ,  H01J63/04 ,  H01L27/32 ,  H01L51/50 ,  H01L51/52 ,  H05B33/10 ,  H05B33/12 ,  H05B33/14 ,  H05B33/22 ,  H05B33/26

CPC分类号： H01L27/3251 ,  H01L51/5259

摘要： An organic electro luminescence device includes an array device having a thin film transistor formed in each of sub-pixel regions on a first substrate, a first electrode of an organic electro luminescence diode formed on a second substrate, the first electrode including a metallic material having light transmittance, a second electrode and an organic electro luminescence layer of the organic electro luminescence diode formed on the first electrode, and a thin film type absorbent formed on one of the first substrate and the second substrate, the first and second substrates being attached to each other with a predetermined distance therebetween having the array device facing the organic electro luminescence diode, and including a conductive spacer for electrically connecting the thin film transistor and the second electrode.

摘要翻译： 一种有机电致发光器件包括阵列器件，其具有形成在第一衬底上的每个子像素区域中的薄膜晶体管，形成在第二衬底上的有机电致发光二极管的第一电极，所述第一电极包括金属材料， 光透射率，第二电极和形成在第一电极上的有机电致发光二极管的有机电致发光层，以及形成在第一基板和第二基板之一上的薄膜型吸收体，第一和第二基板附接到 彼此之间具有预定距离，其间具有面向有机电致发光二极管的阵列器件，并且包括用于电连接薄膜晶体管和第二电极的导电间隔物。

公开(公告)号：US20050093445A1

公开(公告)日：2005-05-05

申请号：US10933464

申请日：2004-09-03

申请人： Woong Min ,  Jung Kang ,  Jae Park

发明人： Woong Min ,  Jung Kang ,  Jae Park

IPC分类号： H01J11/12 ,  H01J11/14 ,  H01J11/22 ,  H01J11/24 ,  H01J11/26 ,  H01J11/34 ,  H01J11/36 ,  H01J11/38 ,  H01J11/40 ,  H01J11/42 ,  H01J11/50 ,  H01J17/49

CPC分类号： H01J11/32 ,  H01J11/12 ,  H01J11/24 ,  H01J11/28 ,  H01J2211/245 ,  H01J2211/323

摘要： The present invention relates to a plasma display panel, and more particularly, to an electrode structure of a plasma display panel capable of improving brightness and efficiency. According to the present invention, in the plasma display, assuming that a distance from the center of a discharge region between a pair of transparent electrodes to the center of metal electrodes is “d” and a distance between both ends of the pair of the transparent electrodes is “h”, a location on the transparent electrodes of metal electrodes satisfies d

摘要翻译： 等离子体显示面板技术领域本发明涉及等离子体显示面板，更具体地，涉及能够提高亮度和效率的等离子体显示面板的电极结构。 根据本发明，在等离子体显示器中，假设从一对透明电极之间的放电区域的中心到金属电极的中心的距离为“d”，并且该对透明电极的两端之间的距离 电极为“h”，金属电极的透明电极上的位置满足d

公开(公告)号：US20050083474A1

公开(公告)日：2005-04-21

申请号：US10876604

申请日：2004-06-28

申请人： Jae Park

发明人： Jae Park

IPC分类号： G09G3/36 ,  G02F1/13 ,  G02F1/1345

CPC分类号： G02F1/13452

摘要： A line on glass (LOG) type liquid crystal display includes a liquid crystal display panel having a liquid crystal cell matrix, at least two integrated circuits for driving the liquid crystal display panel, and signal lines formed directly on a substrate of the liquid crystal display panel such that resistance values of the signal lines at an input terminal of each integrated circuit are different.

摘要翻译： 玻璃线（LOG）型液晶显示器包括具有液晶单元矩阵的液晶显示面板，用于驱动液晶显示面板的至少两个集成电路和直接形成在液晶显示器的基板上的信号线 使得每个集成电路的输入端子处的信号线的电阻值不同。

公开(公告)号：US20050045470A1

公开(公告)日：2005-03-03

申请号：US10965833

申请日：2004-10-18

申请人： Jae Park

发明人： Jae Park

IPC分类号： G02F1/13 ,  C23C14/34 ,  H01J37/34 ,  C23C14/32

CPC分类号： H01J37/3435 ,  C23C14/3407 ,  Y10T428/10

摘要： A sputtering target assembly includes a backing plate of which both surfaces are evenly formed and a target having one surface that is evenly formed and attached to one surface of the backing plate and the other surface that is formed with different thicknesses according to a location thereof.

摘要翻译： 溅射靶组件包括其两个表面均匀形成的背板和具有均匀形成并附接到背板的一个表面的一个表面的目标，以及根据其位置形成有不同厚度的另一表面。

公开(公告)号：US20050040540A1

公开(公告)日：2005-02-24

申请号：US10901407

申请日：2004-07-28

申请人： Belgacem Haba ,  Jae Park ,  Teck-Gyu Kang ,  Nicholas Colella

发明人： Belgacem Haba ,  Jae Park ,  Teck-Gyu Kang ,  Nicholas Colella

IPC分类号： H01L21/60 ,  H01L23/48

CPC分类号： H01L24/16 ,  H01L24/11 ,  H01L24/12 ,  H01L24/81 ,  H01L2224/1134 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13655 ,  H01L2224/81143 ,  H01L2224/81801 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/19043 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/3011 ,  Y10T29/4913 ,  H01L2924/00015 ,  H01L2924/00014 ,  H01L2224/13099

摘要： A microelectronic element such as a semiconductor chip has springs such as coil springs bonded to contacts so that the springs serve as electrical connections to a circuit panel. The unit can be tested readily and can be surface-mounted to a circuit panel by bonding the distal ends of the springs, remote from the microelectronic element, to the panel. The springs can also serve as antennas so as to provide a miniaturized phased array.

摘要翻译： 诸如半导体芯片的微电子元件具有弹簧，例如键合到触点的螺旋弹簧，使得弹簧用作与电路板的电连接。 该单元可以容易地测试，并且可以通过将远离微电子元件的弹簧的远端粘合到面板上而被表面安装到电路板。 弹簧也可以用作天线，以便提供小型化的相控阵列。

公开(公告)号：US20050025565A1

公开(公告)日：2005-02-03

申请号：US10627623

申请日：2003-07-28

申请人： Reuven Unger ,  Seon Kim ,  Jae Park ,  Sung Kim

发明人： Reuven Unger ,  Seon Kim ,  Jae Park ,  Sung Kim

IPC分类号： F16B2/00 ,  F16F1/32

CPC分类号： F16F1/32 ,  Y10T403/7062

摘要： A securing device for a spring is provided, the device having a generally hollow spring support having a spring mount having a projection on an inner side of the spring support and configured to support the spring, the device further having a generally annular coupling ring configured to connect to the spring support to secure the spring to the spring support.

摘要翻译： 提供了一种用于弹簧的固定装置，该装置具有大致中空的弹簧支架，该弹簧支架具有弹簧座，弹簧座在弹簧支撑件的内侧上具有突出部，并构造成支撑弹簧，该装置还具有大致环形的联接环， 连接到弹簧支撑件以将弹簧固定到弹簧支撑件。

公开(公告)号：US5232548A

公开(公告)日：1993-08-03

申请号：US784345

申请日：1991-10-29

申请人： Scott G. Ehrenberg ,  L. Wynn Herron ,  Ekkehard F. Miersch ,  Jae Park ,  Janet L. Poetzinger

发明人： Scott G. Ehrenberg ,  L. Wynn Herron ,  Ekkehard F. Miersch ,  Jae Park ,  Janet L. Poetzinger

IPC分类号： H05K1/05 ,  H05K3/28 ,  H05K3/46

CPC分类号： H05K3/462 ,  H05K1/05 ,  H05K2201/068 ,  H05K2201/09509 ,  H05K2201/09536 ,  H05K2201/096 ,  H05K2203/0338 ,  H05K2203/066 ,  H05K2203/1572 ,  H05K3/281 ,  H05K3/4641 ,  Y10S428/901 ,  Y10T29/49165 ,  Y10T428/24917

摘要： A multilayer, three-dimensional wiring matrix is fabricated from a plurality of individually testable plane pair sub-units (30). Each of the plane pair sub-units (30) includes a compensator (20) with capping layers (32) laminated on either side. The compensator (20) has a dielectric (14) encapsulated foil (10) which has been patterned with holes (12). Metallization patterns on the surfaces of the compensator (20) provide orthogonal wiring (22), electrical connections (24) to the foil (10), and electrical connections (26) between the top and bottom surfaces. The capping layer (32) includes joining metallurgy (38) at selected locations within a dielectric layer (36) that is in registry with the metallization in the vias (16). The joining metallurgy (38) may be a metal loaded thermoplastic and provides a seal for the vias (16) as well as planarizes the structure. The capping layers (32) may be formed in-situ on the compensator or separately.

摘要翻译： 由多个可单独测试的平面对子单元（30）制造多层三维布线矩阵。 每个平面对子单元（30）包括具有层叠在任一侧的封盖层（32）的补偿器（20）。 补偿器（20）具有已经用孔（12）构图的电介质（14）封装箔（10）。 补偿器（20）的表面上的金属化图案提供正交布线（22），到箔片（10）的电连接（24）以及顶表面和底表面之间的电连接（26）。 封盖层（32）包括在与通孔（16）中的金属化对准的电介质层（36）内的选定位置处的接合冶金（38）。 接合冶金（38）可以是金属负载的热塑性材料，并为通孔（16）提供密封以及平坦化结构。 封盖层（32）可以在补偿器上原位形成或分开形成。

公开(公告)号：US20080008473A1

公开(公告)日：2008-01-10

申请号：US11824297

申请日：2007-06-29

申请人： Byoung Kim ,  Jae Park ,  Hyeong Lee ,  Jae Yang

发明人： Byoung Kim ,  Jae Park ,  Hyeong Lee ,  Jae Yang

IPC分类号： H04J14/00

CPC分类号： H04J14/02 ,  G02B6/12004 ,  G02B6/12007 ,  G02B6/1228 ,  G02B6/124 ,  G02B6/29322 ,  G02B6/29395 ,  G02B6/29398 ,  G02B6/305 ,  G02B2006/12135 ,  H04J14/0227 ,  H04J14/0246 ,  H04J14/025 ,  H04J14/0282

摘要： A PLC-based wavelength-tunable WDM-PON system with an optical wavelength alignment function, the WDM-PON system comprises: a PLC platform formed on a silicon substrate; a semiconductor chip comprising an active region generating light and a passive region located in front of the active region for vertically coupling the light generated in the active region; a planar lightwave circuit (PLC) waveguide; one portion of a PLC platform where the semiconductor chip is surface mounted; waveguide Bragg grating (WBG) formed at a predetermined location of the PLC waveguide; a directional coupler transferring an optical power by permitting the passive region to approach the PLC waveguide; a heater terminal, which is formed on the WBG; and a V-groove for attaching an optical fiber to another end of the PLC waveguide. Accordingly, a WDM-PON system having a function of realizing a cost-effective optical wavelength alignment can be provided.