Hot-Melt Sealing Glass Compositions And Devices Using The Same
    98.
    发明申请
    Hot-Melt Sealing Glass Compositions And Devices Using The Same 有权
    热熔胶封玻璃组合物和使用它的设备

    公开(公告)号:US20130062712A1

    公开(公告)日:2013-03-14

    申请号:US13608022

    申请日:2012-09-10

    Abstract: Hot-melt sealing glass compositions that include one or more glass frits dispersed in a polymeric binder system. The polymeric binder system is a solid at room temperature, but melts at a temperature of from about 35° C. to about 90° C., thereby forming a flowable liquid dispersion that can be applied to a substrate (e.g., a cap wafer and/or a device wafer of a MEMS device) by screen printing. Hot-melt sealing glass compositions according to the invention rapidly re-solidify and adhere to the substrate after being deposited by screen printing. Thus, they do not tend to spread out as much as conventional solvent-based glass frit bonding pastes after screen printing. And, because hot-melt sealing glass compositions according to the invention are not solvent-based systems, they do not need to be force dried after deposition.

    Abstract translation: 包括分散在聚合物粘合剂体系中的一种或多种玻璃料的热熔密封玻璃组合物。 聚合物粘合剂体系在室温下为固体,但在约35℃至约90℃的温度下熔融,由此形成可流动的液体分散体,其可施加到基底(例如盖片和 /或MEMS器件的器件晶片)。 根据本发明的热熔密封玻璃组合物在通过丝网印刷沉积之后快速再固化并附着到基底上。 因此,它们在丝网印刷后不会像常规的溶剂型玻璃料粘合膏一样扩散。 而且,由于根据本发明的热熔密封玻璃组合物不是溶剂型体系,它们在沉积后不需要强力干燥。

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