公开(公告)号：US07498477B2

公开(公告)日：2009-03-03

申请号：US10618964

申请日：2003-07-15

申请人： Satoshi Wada ,  Shigeki Numata ,  Hiroshi Yagi

发明人： Satoshi Wada ,  Shigeki Numata ,  Hiroshi Yagi

IPC分类号： A61F5/00 ,  A61F5/28 ,  A61F5/34 ,  A61F13/00 ,  A61L15/00 ,  A61B17/00

CPC分类号： A61B17/135 ,  A61B17/1325 ,  A61B2017/00907 ,  A61B2017/12004 ,  A61B2090/3937

摘要： A hemostatic device includes a flexible band adapted to be wrapped around a patient's limb at a site on the limb where bleeding is to be stopped, a portion for securing the band in a wrapped state to the limb, a curved plate which is made of a material more rigid than the band and at least a portion of which is curved toward the inner peripheral side thereof, a main balloon which is provided on the inner peripheral side of the curved plate and which inflates when a fluid is introduced therein, and a pressing member which is provided between the curved plate and the main balloon so that at least a portion thereof overlaps with the balloon and which is adapted for pressing against the balloon. The device provides an excellent hemostatic effect and prevents numbness and poor circulation in areas peripheral to the site of attachment.

摘要翻译： 止血装置包括柔性带，其适于围绕肢体周围的肢体缠绕，其中出血停止，用于将带固定到包裹状态的部分，弯曲板，其由 所述材料比所述带更刚性，并且其至少一部分向其内周侧弯曲;主气球，设置在所述弯曲板的内周侧，并且当流体被引入时膨胀; 构件，其设置在弯曲板和主气囊之间，使得其至少一部分与气囊重叠，并且适于压靠气球。 该装置提供优异的止血效果，并防止附着部位周围区域的麻木和不良循环。

公开(公告)号：US20080114374A1

公开(公告)日：2008-05-15

申请号：US12003331

申请日：2007-12-21

申请人： Katsuaki Soma ,  Toshiaki Takagi ,  Hiroshi Yagi ,  Takayauki Mori ,  Katsuhiro Shirakawa ,  Hiraku Murayama

发明人： Katsuaki Soma ,  Toshiaki Takagi ,  Hiroshi Yagi ,  Takayauki Mori ,  Katsuhiro Shirakawa ,  Hiraku Murayama

IPC分类号： A61M25/01

CPC分类号： A61M25/0113 ,  A61M25/09 ,  A61M25/09041

摘要： Disclosed herein is a device (such as guidewire inserter) for easily and certainly inserting a medical long item having a curved tip into a tube such as catheter and sheath. The guidewire inserter is a tubular member having therein a bore for passage of a guidewire. The tubular member has a slit cutting across the wall thereof over the total length thereof. The tubular member has at the proximal end thereof an aperture, which results from the slit expanding toward the proximal end. The tubular member has at the proximal end of the aperture an open part and a connecting part adjacent thereto for the holder tube. There are a pair of wing-like protruded pieces projecting in the mutually opposite directions at both sides of the open part. The distal end of the tubular member has on its outer surface a pair of protruded rims, which project in the mutually opposite directions with respect to the central axis of the tubular member. When the distal end of the tubular member is connected by insertion into the bore at the proximal end of the tube, such as sheath, the protruded rims come into contact with the inside of the hub.

公开(公告)号：US07331966B2

公开(公告)日：2008-02-19

申请号：US11067771

申请日：2005-03-01

申请人： Katsuaki Soma ,  Toshiaki Takagi ,  Hiroshi Yagi ,  Takayuki Mori ,  Katsuhiro Shirakawa ,  Hiraku Murayama

发明人： Katsuaki Soma ,  Toshiaki Takagi ,  Hiroshi Yagi ,  Takayuki Mori ,  Katsuhiro Shirakawa ,  Hiraku Murayama

IPC分类号： A61F11/00

CPC分类号： A61M25/0113 ,  A61M25/09 ,  A61M25/09041

摘要： Disclosed herein is a device (such as guidewire inserter) for easily and certainly inserting a medical long item having a curved tip into a tube such as catheter and sheath. The guidewire inserter is a tubular member having therein a bore for passage of a guidewire. The tubular member has a slit cutting across the wall thereof over the total length thereof. The tubular member has at the proximal end thereof an aperture, which results from the slit expanding toward the proximal end. The tubular member has at the proximal end of the aperture an open part and a connecting part adjacent thereto for the holder tube. There are a pair of wing-like protruded pieces projecting in the mutually opposite directions at both sides of the open part. The distal end of the tubular member has on its outer surface a pair of protruded rims, which project in the mutually opposite directions with respect to the central axis of the tubular member. When the distal end of the tubular member is connected by insertion into the bore at the proximal end of the tube, such as sheath, the protruded rims come into contact with the inside of the hub.

摘要翻译： 这里公开了一种用于容易且肯定地将具有弯曲尖端的医疗长项目插入诸如导管和鞘的管中的装置（例如导丝插入器）。 导丝插入器是其中具有用于导丝通过的孔的管状构件。 管状构件在其总长度上具有穿过其壁的狭缝切割。 管状构件在其近端处具有孔，其由狭缝朝向近端扩展而产生。 管状构件在孔的近端处具有敞开部分和与其相邻的用于保持管的连接部分。 在开口部的两侧，在相反的方向上突出有一对翼状突起片。 管状构件的远端在其外表面上具有一对突出的边缘，该突出的边缘相对于管状构件的中心轴线在相互相反的方向上突出。 当管状构件的远端通过插入到管的近端（例如护套）中的孔中而连接时，突出的轮缘与轮毂的内部接触。

公开(公告)号：US07307347B2

公开(公告)日：2007-12-11

申请号：US11362784

申请日：2006-02-28

申请人： Hiroshi Yagi

发明人： Hiroshi Yagi

IPC分类号： H01L23/48 ,  H01L23/52 ,  H01L29/40

CPC分类号： H01L23/4951 ,  H01L23/3107 ,  H01L23/3114 ,  H01L23/49548 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2224/16245 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/1433 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2224/05599 ,  H01L2924/00012

摘要： A resin-encapsulated package includes a semiconductor IC chip, wherein the ratio of the size of the semiconductor IC chip to the package size of the resin-encapsulated package including the semiconductor IC chip is large to miniaturize the resin-encapsulated package. The resin-encapsulated package includes a semiconductor IC chip sealed in a resin molding, and a lead member having an arrangement of a plurality of discrete terminal sections. Each terminal section has inner terminal parts to be electrically connected to terminals of the semiconductor IC chip, outer terminal parts to be connected to external circuits, and connecting parts interconnecting the inner and the outer terminal parts. The contact surfaces of the inner terminal parts and the outer terminal parts face toward opposite directions, respectively. The contact surfaces of the inner terminal parts of the terminal sections are flush with each other.

摘要翻译： 树脂封装的封装包括半导体IC芯片，其中半导体IC芯片的尺寸与包括半导体IC芯片的树脂封装封装的封装尺寸的比例大，以使树脂封装的封装小型化。 树脂封装的封装包括密封在树脂模制品中的半导体IC芯片和具有多个分立端子部分的布置的引线部件。 每个端子部具有与半导体IC芯片的端子电连接的内部端子部分，要连接到外部电路的外部端子部分和互连内部和外部端子部分的连接部件。 内端子部分和外端子部分的接触表面分别朝向相反方向。 端子部的内部端子部的接触面相互齐平。

公开(公告)号：US20070190302A1

公开(公告)日：2007-08-16

申请号：US10589970

申请日：2005-10-18

申请人： Takanori Maeda ,  Hiroshi Yagi ,  Asako Harayama

发明人： Takanori Maeda ,  Hiroshi Yagi ,  Asako Harayama

IPC分类号： F16J1/06 ,  B32B3/26

CPC分类号： B01D69/02 ,  B01D53/228 ,  B01D67/0062 ,  B01D71/022 ,  B01D2325/021 ,  C01B3/505 ,  C01B2203/041 ,  C01B2203/047 ,  C23F1/02 ,  C23F1/28 ,  C25D7/00 ,  Y10S55/05 ,  Y10T428/12951 ,  Y10T428/249953

摘要： A hydrogen-purification membrane comprises a Pd alloy film joined to one surface of a porous support substrate. Each pore in the porous support substrate is such that between the thickness T of the porous support substrate, the opening diameter D1 of the pore on the side joined to the Pd alloy film and the opening diameter D2 of the pore on the opposite side, there are relations represented by 1.0≦D1/T≦5.0 and 1.0≦D2/T≦5.0, and between the opening diameter D1 of the pore on the side joined to the Pd alloy film, the opening diameter D2 of the pore on the opposite side and the opening diameter D3 of the narrowest portion of the pore there are relations represented by D3/D1

摘要翻译： 氢气净化膜包括与多孔载体基材的一个表面连接的Pd合金膜。 多孔支撑基板中的每个孔在多孔支撑基板的厚度T之间，与Pd合金膜连接的一侧的孔的开口直径D 1和相对侧的孔的开口直径D 2 存在由1.0 <= D 1 /T<=5.0和1.0 <= D 2 /T<=5.0表示的关系，并且在与Pd合金膜接合的一侧的孔的开口直径D 1之间， 相对侧的孔的直径D 2和孔的最窄部分的开口直径D 3存在由D 3 / D 1 <0.8，D 3 / D 2 <0.9和D 3 <250μm表示的关系。 此外，与Pd合金膜接合的一侧的孔的总开口面积占多孔质支持体的面积的20〜80％。

公开(公告)号：US20070188073A1

公开(公告)日：2007-08-16

申请号：US10597658

申请日：2005-06-22

申请人： Hiroshi Yagi ,  Yoshio Manabe ,  Tsuyoshi Terada

发明人： Hiroshi Yagi ,  Yoshio Manabe ,  Tsuyoshi Terada

IPC分类号： H01J1/62

CPC分类号： H01J61/72 ,  H01J9/247 ,  H01J9/395 ,  H01J61/28

摘要： A fluorescent lamp is configured so that a glass bulb has a phosphor film formed on its internal face, and a rare gas and an amalgam pellet are enclosed therein. The amalgam pellet contains zinc, tin, and mercury as principal components, one amalgam pellet is enclosed in the glass bulb, and the amalgam pellet has a weight of not more than 20 mg. The fluorescent lamp satisfies the relationship expressed as: 45×(1−A)≦x≦55x(1−A), 75A≦y≦85A, 45−30A≦z≦55−30A, and x+y+z≦100, where x represents a content of zinc contained in the amalgam pellet in percent by weight, y represents a content of tin therein in percent by weight, and z represents a content of mercury therein in percent by weight. This configuration allows the fluorescent lamp to be characterized in that an amount of released mercury that is necessary for the first lighting of the fluorescent lamp is secured, and that the phosphor film is less prone to being peeled due to the amalgam.

摘要翻译： 荧光灯被配置为使得玻璃灯泡在其内表面上形成有荧光膜，并且在其中封入稀有气体和汞齐颗粒。 汞齐颗粒含有锌，锡和汞作为主要成分，一个汞齐颗粒被封闭在玻璃泡中，汞齐颗粒的重量不超过20毫克。 荧光灯满足表示为：45x（1-A）<= x <= 55x（1-A），75A <= y <= 85A，45-30A <= z <= 55-30A，x + y + z <= 100，其中x表示汞齐颗粒中含有的锌含量，重量百分比，y表示锡的含量，重量百分比，z表示其中的汞含量。 这种结构允许荧光灯的特征在于，确保荧光灯的第一次点亮所需的释放汞量，并且荧光膜不太可能由于汞齐而被剥离。

公开(公告)号：US07252189B2

公开(公告)日：2007-08-07

申请号：US11015666

申请日：2004-12-20

申请人： Hiroshi Yagi

发明人： Hiroshi Yagi

IPC分类号： B65G47/24 ,  H01G4/12

CPC分类号： H01G4/012 ,  B65G27/02 ,  B65G47/1421 ,  B65G2201/02 ,  H01G4/12 ,  H01G4/30

摘要： A method and device for aligning orientation of laminated planer electrodes in laminated electronic parts when the parts are conveyed on a transport passage of a parts feeder. A magnetic field generation unit is disposed beside and outside of the parts feeder for applying magnetic field lines extending in horizontal or vertical direction. Orientation of the electrodes is in conformance with the direction of the magnetic field lines.

摘要翻译： 一种方法和装置，用于当部件在部件进给器的传送通道上传送时，将叠层电子部件中的层压平面电极的取向对准。 磁场产生单元设置在零件供给器的旁边和外侧，用于施加沿水平或垂直方向延伸的磁场线。 电极的方向与磁场线的方向一致。

公开(公告)号：US07112287B2

公开(公告)日：2006-09-26

申请号：US10491888

申请日：2003-07-23

申请人： Hiroshi Yagi ,  Takanori Maeda ,  Yoshinori Oota ,  Yasuhiro Uchida

发明人： Hiroshi Yagi ,  Takanori Maeda ,  Yoshinori Oota ,  Yasuhiro Uchida

IPC分类号： B31D3/00

CPC分类号： B01D67/0069 ,  B01D53/228 ,  B01D67/006 ,  B01D67/0072 ,  B01D69/10 ,  B01D71/022 ,  B01D2325/021 ,  C01B3/505 ,  C01B2203/0405 ,  C01B2203/041 ,  C01B2203/047 ,  C23F1/02 ,  C23F1/28 ,  C23F1/34 ,  C23F1/44 ,  C25D1/08 ,  C25D1/10 ,  C25D5/022 ,  H01M8/0618 ,  H01M8/0662 ,  Y10T428/12201 ,  Y10T428/12361 ,  Y10T428/12417 ,  Y10T428/12479 ,  Y10T428/12951 ,  Y10T428/24273 ,  Y10T428/249953

摘要： In a through hole closing process, a metal plate is attached to one surface of a conductive base member having a plurality of through holes by the use of a magnet, in a copper plating process, a copper plating layer is formed on the conductive base member and the metal plate exposed within the through holes, from the side of the conductive base member where the metal plate is not attached, thereby to fill up the through holes, in a film forming process, a Pd alloy film is formed by plating on the surface of the conductive base member after removal of the metal plate, and in a removal process, the copper plating layer is removed by selective etching, thereby to produce a hydrogen production filter that is used in a reformer of a fuel cell so as to be capable of stably producing high purity hydrogen gas.

摘要翻译： 在通孔闭合处理中，通过使用磁体将金属板附着到具有多个通孔的导电性基材的一个表面上，在镀铜工序中，在导电性基材上形成有镀铜层 并且金属板从通孔的暴露于未安装金属板的导电性基材的一侧露出，从而填充通孔，在成膜工艺中，通过在 在除去金属板之后的导电性基材的表面，在去除工序中，通过选择性蚀刻去除铜镀层，由此制造用于燃料电池的重整器的氢制造用过滤器， 能够稳定地生产高纯氢气。

公开(公告)号：US06942817B2

公开(公告)日：2005-09-13

申请号：US09813759

申请日：2001-03-21

申请人： Hiroshi Yagi ,  Shigeki Kawano ,  Kazuo Umeda ,  Jiro Takei ,  Yukio Iimura ,  Satoshi Sasaki ,  Katsuya Sakayori ,  Hiroko Amasaki

发明人： Hiroshi Yagi ,  Shigeki Kawano ,  Kazuo Umeda ,  Jiro Takei ,  Yukio Iimura ,  Satoshi Sasaki ,  Katsuya Sakayori ,  Hiroko Amasaki

IPC分类号： G11B5/48 ,  H05K1/05 ,  H05K3/00 ,  H05K3/06 ,  H05K3/10 ,  B44C1/22 ,  C03C15/00 ,  C03C25/68 ,  C23F1/00 ,  G11B21/16

CPC分类号： H05K3/0017 ,  G11B5/4833 ,  G11B5/484 ,  G11B5/486 ,  H05K1/056 ,  H05K3/002 ,  H05K3/0041 ,  H05K3/064 ,  H05K3/108 ,  H05K2201/0394 ,  H05K2201/0969 ,  H05K2203/0554

摘要： A wireless suspension blank is made using a two-layer laminate composed of a metallic layer with the spring property and an electrically insulating layer. The first method includes a first step for working the metallic layer by the photo etching method, a second step for forming a wiring part on the insulating layer by the semi-additive method and a third step for working the insulating layer by the wet-etching method. The second method includes a first step for working the metallic layer by the photo etching method, a second step for forming a wiring part on the insulating layer by the semi-additive method and a third step for working the insulating layer by the plasma etching method. The third method includes a first step for forming a wiring part on the metallic layer by the semi-additive method, a second step for working the metallic layer by the wet-etching method and a third step for working the insulating layer by the dry-etching method or the wet-etching method. The use of a two-layer laminate makes possible a low cost production. Further, the forming of a wiring part by the semi-additive method makes possible to working very accurately a fine wiring part.

摘要翻译： 使用由具有弹簧性质的金属层和电绝缘层组成的双层层压制造无线悬挂坯料。 第一种方法包括通过光蚀刻方法加工金属层的第一步骤，通过半添加方法在绝缘层上形成布线部分的第二步骤以及通过湿法蚀刻来对绝缘层进行加工的第三步骤 方法。 第二种方法包括通过光蚀刻法工作金属层的第一步骤，通过半添加方法在绝缘层上形成布线部分的第二步骤和通过等离子体蚀刻方法对绝缘层进行加工的第三步骤 。 第三种方法包括通过半添加方法在金属层上形成布线部分的第一步骤，用于通过湿式蚀刻方法加工金属层的第二步骤和通过干式加热方法对绝缘层进行加工的第三步骤， 蚀刻方法或湿式蚀刻方法。 使用双层层压板可以实现低成本生产。 此外，通过半添加方法形成布线部分，可以非常精确地精加工精细的布线部分。

公开(公告)号：US20050046045A1

公开(公告)日：2005-03-03

申请号：US10957683

申请日：2004-10-05

申请人： Hiroshi Yagi

发明人： Hiroshi Yagi

IPC分类号： H01L23/12 ,  H01L23/31 ,  H01L23/495 ,  H01L23/50 ,  H01L21/48 ,  H01L23/52

CPC分类号： H01L23/4951 ,  H01L23/3107 ,  H01L23/3114 ,  H01L23/49548 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2224/16245 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/1433 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2224/05599 ,  H01L2924/00012

摘要： A resin-encapsulated package includes a semiconductor IC chip, wherein the ratio of the size of the semiconductor IC chip to the package size of the resin-encapsulated package including the semiconductor IC chip is large to miniaturize the resin-encapsulated package. The resin-encapsulated package includes a semiconductor IC chip sealed in a resin molding, and a lead member having an arrangement of a plurality of discrete terminal sections. Each terminal section has inner terminal parts to be electrically connected to terminals of the semiconductor IC chip, outer terminal parts to be connected to external circuits, and connecting parts interconnecting the inner and the outer terminal parts. The contact surfaces of the inner terminal parts and outer terminal parts face toward opposite directions, respectively. The contact surfaces of the inner terminal parts of the terminal sections are flush with each other.

摘要翻译： 树脂封装的封装包括半导体IC芯片，其中半导体IC芯片的尺寸与包括半导体IC芯片的树脂封装封装的封装尺寸的比例大，以使树脂封装的封装小型化。 树脂封装的封装包括密封在树脂模制品中的半导体IC芯片和具有多个分立端子部分的布置的引线部件。 每个端子部具有与半导体IC芯片的端子电连接的内部端子部分，要连接到外部电路的外部端子部分和互连内部和外部端子部分的连接部件。 内部端子部分和外部端子部分的接触表面分别朝向相反方向。 端子部的内部端子部的接触面相互齐平。