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160 条记录 (耗时 0.02 秒)

    Heat Pipe For A Bag Machine
    97.
    发明申请
    Heat Pipe For A Bag Machine 审中-公开
    袋机热管

    公开(公告)号：US20090156381A1

    公开(公告)日：2009-06-18

    申请号：US12325053

    申请日：2008-11-28

    申请人： Mitchell Hein ,  Robert Beschta ,  Lawrence D. Mikulsky

    发明人： Mitchell Hein ,  Robert Beschta ,  Lawrence D. Mikulsky

    IPC分类号： B31B1/64 ,  B31B1/00

    CPC分类号： B29C65/305 ,  B29C65/18 ,  B29C66/003 ,  B29C66/1122 ,  B29C66/3472 ,  B29C66/43 ,  B29C66/80 ,  B29C66/83421 ,  B29C66/83511 ,  B29C66/8511 ,  B31B70/00 ,  B31B70/64 ,  B31B2155/00 ,  B31B2160/10 ,  B29C65/00

    摘要： A method and apparatus for bag making includes an input section, a sealing section and an output section. The sealing section includes a seal bar having a heat pipe with a relief zone, through which pressure is relieved. The heat pipe is preferably disposed in or near the seal bar. The relief zone can be a valve that opens and closes, or other reusable devices, or it can be a destructive relief zone. The heat pipe is preferably a generally closed cylindrical shape with the relief zone located on one end. The heat pipe can have a second relief zone, possibly located at the other end of the heat pipe. Fluid may be in the heat pipe. The invention can be implemented as a bag machine with a seal bar, or a seal bar with a heat pipe, or solely as a heat pipe.

    摘要翻译： 用于制袋的方法和装置包括输入部分，密封部分和输出部分。 密封部分包括具有带有释放区的热管的密封条，压力被释放。 热管优选设置在密封条中或附近。 减压区可以是开关阀或其他可重复使用的装置，也可以是破坏性的减压区。 热管优选地是一般为闭合的圆柱形，其中安全区位于一端。 热管可以具有可能位于热管的另一端的第二缓冲区。 流体可能在热管中。 本发明可以实现为具有密封条或具有热管或仅作为热管的密封条的袋装机。

    Methods and systems for debonding substrates
    98.
    发明申请
    Methods and systems for debonding substrates 审中-公开
    剥离基材的方法和系统

    公开(公告)号：US20070144653A1

    公开(公告)日：2007-06-28

    申请号：US11316380

    申请日：2005-12-22

    申请人： Kenneth Padilla ,  Chad Grant ,  James Threlfall

    发明人： Kenneth Padilla ,  Chad Grant ,  James Threlfall

    IPC分类号： B29C63/00 ,  H05B1/02

    CPC分类号： B29C66/861 ,  B29C65/10 ,  B29C65/103 ,  B29C65/14 ,  B29C65/76 ,  B29C66/003 ,  B29C66/1282 ,  B29C66/12881 ,  B29C66/43 ,  B29C66/836 ,  B29C66/91212 ,  B29C66/91216 ,  B29C66/91221 ,  B29C66/91411 ,  B29C66/91431 ,  B29C66/91443 ,  B29C66/91641 ,  B29C66/961 ,  B29L2031/3076 ,  Y10T156/19

    摘要： Methods and systems for applying heat to substrates that are in contact with an uncured bonding material or that are bonded with one or more sealants or other bonding material/s. Substrates may be heated, for example, so that the substrates may be debonded by degrading one or more mechanical properties of the bonding material/s so that the substrates may be separated. The application of heat to a substrate may be controlled based on the temperature of the substrate during the heating process. Damage-sensitive substrates, such as aircraft substrates, may be heated in a manner that controls surface temperature of the substrates to meet heat treating requirements and/or to limit heating to maximum temperatures for the substrates in a manner that substantially eliminates damage to the substrates during the heating operation while at the same time at least partially curing uncured bonding material, or degrading one or more mechanical properties of cured bonding material/s.

    摘要翻译： 将热量施加到与未固化的粘合材料接触或与一种或多种密封剂或其它结合材料粘合的基材上的方法和系统。 可以例如加热衬底，使得可以通过降低接合材料的一个或多个机械性能来剥离衬底，使得衬底可以被分离。 可以基于加热过程中的基板的温度来控制对基板的加热。 可以以如下方式来加热损伤敏感的基材，例如飞机基材，以便以基本上消除对基材的损害的方式来控制基材的表面温度以满足热处理要求和/或限制加热到基材的最高温度的方式 在加热操作期间同时至少部分固化未固化的粘合材料，或降低固化粘合材料的一种或多种机械性能。