Abstract:
A micro-electromechanical device and method of manufacture are disclosed. A sacrificial layer is formed on a silicon substrate. A metal layer is formed on a top surface of the sacrificial layer. Soft magnetic material is electrolessly deposited on the metal layer to manufacture the micro-electromechanical device. The sacrificial layer is removed to produce a metal beam separated from the silicon substrate by a space.
Abstract:
According to the present invention there is provided an actuator comprising, a movable member, the movable member comprising a support frame which is configured such that it can oscillate about a first oscillation axis and a mirror which is fixed to the support frame such that oscillation of the support frame will effect oscillation of the mirror; an coil, which cooperates with the support frame; one or more boundary portions provided between the support frame and the mirror which reduce the influence of warp transmitted from an edge of the support frame to the mirror, as the support frame oscillates about the first oscillation axis; wherein the support frame further comprises one or more cut-out regions, wherein the one or more cut-out regions are configured to be parallel to at least a portion of the coil, to reduce stress on the coil as the support frame oscillates about the first oscillation axis and/or to reduce the temperature dependence of the properties of the actuator.
Abstract:
The device comprises a first actuating bump made from electrically conducting material with a first contact surface. A second actuating bump made from electrically conducting material is facing the first actuating bump. An electrostatic actuating circuit moves the actuating bumps with respect to one another between a first position and another position. The actuating circuit comprises a device for applying a higher potential on the second actuating bump than on the first actuating bump. A film of electrically insulating material performs electric insulation between the first and second bumps. The electrically insulating material film comprises an interface with a positive ion source and is permeable to said positive ions.
Abstract:
A mechanism and method for motion conversion is disclosed. This mechanism can be easily fabricated using standard bulk micromachining technology. Based on this method with appropriate design, a horizontal, in-plane motion can be converted to a vertical or angular displacement out-of-plane. This design has great advantages in micro devices, which are built from a single layer, i.e. wafer fabrication, where an in-plane force is easy to implement, such as by the use of comb drive mechanisms, but an out-of-plane motion may be hard to achieve. The mechanism comprises a pair of beams of different heights, rigidly connected together at a number of points along their length, such that application of an in-plane force to the double beam structure results in out-of-plane motion of the double beam structure at points distant from the point of application of the force.
Abstract:
Processes for making a profile-transferring substrate surface and membranes having curved features are disclosed. A profile-transferring substrate surface having a curved feature is created by isotropic plasma etching through a shadow mask. The shadow mask has a through hole which has a lower portion adjacent to the bottom surface of the shadow mask and an upper portion that is above and narrower than the lower portion. The isotropic plasma etching through the shadow mask can create a curved dent in a planar substrate in a central portion of an area enclosed by the bottom opening. After the shadow mask is removed. A uniform layer of material deposited over the exposed surface of the substrate will include a curved feature at the location of the curved dent in the substrate surface.
Abstract:
A silicon MEMS device can have at least one solder contact formed thereupon. The silicon MEMS device can be configured to be mounted to a circuit board via the solder contact(s). The silicon MEMS device can be configured to be electrically connected to the circuit board via the solder contact(s).
Abstract:
A motion conversion system is described. The motion conversion system comprises a first torsional member operative for rotating in a first direction. A second torsional member is offset a distance from the first torsional member, wherein the second torsional member is operative for rotating in a direction opposite from the first direction. And, a lateral member has a lower surface connected to the first and second torsional members. Wherein, translational movement of the lateral member results from rotational movement of the first and second torsional members.
Abstract:
Semiconductor nano-devices, such as nano-probe and nano-knife devices, which are constructed using graphene films that are suspended between open cavities of a semiconductor structure. The suspended graphene films serve as electro-mechanical membranes that can be made very thin, from one or few atoms in thickness, to greatly improve the sensitivity and reliability of semiconductor nano-probe and nano-knife devices.
Abstract:
A microelectromechanical system (MEMS) device includes an actuator having a plurality of charge collection elements. At least one of the charge collection elements is configured to build up electrical charges by directly interacting with an energy field thereby actuating the MEMS through Coulombic interactions. An actuator for a MEMS device is configured to actuate the MEMS device through Coulombic interactions by pumping charges to the actuator when subject to an energy field. A method of actuating a MEMS device includes irradiating an actuator of the MEMS device with an energy field thereby building up electrical charges on the actuator, and actuating the MEMS device with Coulomb forces from the built up electrical charges.
Abstract:
A method of fabricating a MEMS composite transducer includes providing a substrate having a first surface and a second surface opposite the first surface. A transducing material is deposited over the first surface of the substrate. The transducing material is patterned by retaining transducing material in a first region and removing transducing material in a second region. A polymer layer is deposited over the first region and the second region. The polymer layer is patterned by retaining polymer in a third region and removing polymer in a fourth region. A first portion of the third region is coincident with a portion of the first region and a second portion of the third region is coincident with a portion of the second region. A cavity is etched from the second surface to the first surface of the substrate. An outer boundary of the cavity at the first surface of the substrate intersects the first region where transducing material is retained, so that a first portion of the transducing material is anchored to the first surface of the substrate and a second portion of the transducing material extends over at least a portion of the cavity.