Abstract:
A thin, deformable member may be fixed at one end, while another portion of the member rests on a hydrogel substance whose thickness changes depending on a characteristic of a liquid that permeates the hydrogel. When the hydrogel changes thickness and causes part of the member to tilt, a reflective surface on the member may reflect light in a different direction. Appropriate sensors may detect the change in the direction of the reflected light, allowing determination of the change in thickness, which in turn permits determination of the relevant characteristic of the liquid.
Abstract:
A measurement system that uses a laser triangulation device to measure the thickness of transparent and/or opaque layers of a multilayer film. The triangulation device has a laser device that projects a beam perpendicularly to a surface of the multilayer film and first and second detectors that image first and second reflected rays of the beam at first and second distances offset from first and second optical axes to produce first and second measurement signals. A controller processes the measurement signals using a triangulation procedure and a simultaneous equation procedure to provide a thickness of an outer transparent layer. For a multilayer film having an opaque layer sandwiched between outer transparent layers, first and second triangulation devices are disposed on opposed sides of the film to measure the thickness of each outer film. Knowing the distance between the two devices, the thickness of the opaque layer can be derived.
Abstract:
A method of determining a physical property of a substrate includes recording a first spectrum obtained from a substrate, the first spectrum being obtained during a polishing process that alters a physical property of the substrate. The method includes identifying, in a database, at least one of several previously recorded spectra that is similar to the recorded first spectrum. Each of the spectra in the database has a physical property value associated therewith. The method includes generating a signal indicating that a first value of the physical property is associated with the first spectrum, the first value being determined using the physical property value associated with the identified previously recorded spectrum in the database. A system for determining a physical property of a substrate includes a polishing machine, an endpoint determining module, and a database.
Abstract:
A method and apparatus for protecting an optical transmission measurement when sensing transparent materials. Sensing apparatus located in a housing directs a light beam at an upward angle to a sheet of transparent material and detects downward surface reflections of the beam from the transparent material. The light beam and the reflections pass through a transparent protective layer on the housing. A flow of clean air is passed between the protective layer and the transparent material to remove particles and liquid from the protective layer and from the space between the protective layer and the transparent material. Preferably, the protective layer is either made from a hydrophobic material or has a hydrophobic surface coating to facilitate blowing liquid and particles from the surface.
Abstract:
Providing a spectrometric measuring instrument suitable for in-line measurement for example in a semiconductor manufacturing process, an FPD manufacturing process, or the like, by realizing size reduction and imparting resistance to distance fluttering, angle fluttering in a horizontal direction, and angle fluttering in a perpendicular direction. A light interference type spectral element for gradually changing a wavelength of transmitted light by means of a transmitted position is provided immediately before the photoelectric transfer part array device, and based upon a light-receiving side optical system having the function of detecting a change in state of polarization of a reflected light from a sample, and a series of light-receiving amount data obtained from each of photoelectric transfer parts of the photoelectric transfer part array device, polarized light is analyzed. By fitting of a measured waveform to a theoretical waveform, a film thickness or film quality is obtained.
Abstract:
The invention relates to a level sensor for determining a height of a substrate. The level sensor generates one or more measurement beam and directs the measurement beam to a measurement spot on the substrate and produces a reflected measurement beam. The level sensor also generates one or more reference beams. A detector detects both the reflected measurement beam and the reference beam, respectively, and produces a measurement signal and a reference signal, respectively, the measurement signal being indicative for the height at the measurement spot. A processor that receives these signals and corrects the measurement signal based on the reference signal. The level sensor has an optical arrangement in a predetermined area close to where the substrate is to be located. The measurement beam and the reference beam propagate along substantially equal optical paths of propagation in the predetermined area. The optical arrangement deviates the reference beam from the substantially equal optical paths of propagation in the predetermined area such that the at least one reference beam does not hit the substrate.
Abstract:
An optical method and system for measuring characteristics of a sample using a broadband metrology tool in a purge gas flow environment are disclosed. In the method a beam path for the metrology tool is purged with purge gas at a first flow rate. A surface of the sample is illuminated by a beam of source radiation having at least one wavelength component in a vacuum ultraviolet (VUV) range and/or at least one wavelength component in an ultraviolet-visible (UV-Vis) range. A flow rate of a purge gas is adjusted between the first flow rate for metrology measurements made when the source radiation is in the VUV spectral region and a second flow rate for metrology measurements made when the source radiation is in the UV-Vis spectral region. The system includes a light source, illumination optics, collection optics, detector, a purge gas source and a controller. The purge gas source is configured to supply a flow of purge gas to a beam path in the light source and/or illumination optics and/or sample and/or collection optics and/or detector. The controller is configured to control a flow rate of the purged gas flow in response to an output signal from the detector.
Abstract:
A measuring instrument for a wafer for measuring the thickness of a wafer held on a chuck table using a laser beam includes a condenser for condensing and irradiating the laser beam on the wafer held on the chuck table, a light reception unit for receiving reflected light of the laser beam irradiated upon the wafer, a convergence light point changing unit for changing the convergence light point of the laser beam, and a control unit for measuring the thickness of the wafer based on a change signal from the convergence light point changing unit and a light reception signal from the light reception unit. The control unit stores a thickness control map. The control unit controls an angle adjustment actuator, provided for adjusting the installation angle of a pair of mirrors, to change the installation angle and detects two peaks of the light amount based on the reception signal from the light reception unit.
Abstract:
A measurement system that uses a laser triangulation device to measure the thickness of transparent and/or opaque layers of a multilayer film. The triangulation device has a laser device that projects a beam perpendicularly to a surface of the multilayer film and first and second detectors that image first and second reflected rays of the beam at first and second distances offset from first and second optical axes to produce first and second measurement signals. A controller processes the measurement signals using a triangulation procedure and a simultaneous equation procedure to provide a thickness of an outer transparent layer. For a multilayer film having an opaque layer sandwiched between outer transparent layers, first and second triangulation devices are disposed on opposed sides of the film to measure the thickness of each outer film. Knowing the distance between the two devices, the thickness of the opaque layer can be derived.
Abstract:
A process monitoring system has a process chamber configured to hold an object to be processed, an illumination source configured to emit a light to the object, a polarizer configured to polarize the light, a monitor window having a birefringent material and provided on the process chamber to propagate the light, direction adjusting equipment configured to adjust a relationship between a polarization plane of the light and a direction of an optic axis of the monitor window, and a monitoring information processor configured to detect the light reflected from the object.