Memory Device Formed On Silicon-On-Insulator Substrate, And Method Of Making Same

    公开(公告)号:US20240389319A1

    公开(公告)日:2024-11-21

    申请号:US18228414

    申请日:2023-07-31

    Abstract: A memory device includes a SOI substrate comprising bulk silicon, an insulation layer vertically over the bulk silicon, and a silicon layer vertically over the insulation layer. A memory cell includes source and drain regions formed in the bulk silicon with a channel region of the bulk silicon extending therebetween, and a floating gate which includes a first portion of the silicon layer disposed vertically over and insulated from a first portion of the channel region by the insulation layer. The first portion of the silicon layer is epitaxially thickened or a layer of polysilicon is formed on the first portion of the silicon layer. A select gate is disposed vertically over and insulated from a second portion of the channel region. A control gate is disposed vertically over and insulated from the floating gate. An erase gate is disposed vertically over and insulated from the source region.

    OUTPUT CIRCUIT FOR ARTIFICIAL NEURAL NETWORK ARRAY

    公开(公告)号:US20240112003A1

    公开(公告)日:2024-04-04

    申请号:US18077993

    申请日:2022-12-08

    CPC classification number: G06N3/063 G06F5/01 G06F7/501

    Abstract: Numerous examples are disclosed of output circuitry and associated methods in an artificial neural network. In one example, a system comprises an array of non-volatile memory cells arranged into rows and columns, an output block to convert current from columns of the array into a first digital output during a first time period and a second digital output during a second time period, a first output register to store the first digital output during the first time period and to output the stored first digital output during the second time period, and a second output register to store the second digital output during the second time period and to output the stored second digital output during a third time period.

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