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    Tensile Stress Measurement Device with Attachment Plates and Related Methods
    102.
    发明申请
    Tensile Stress Measurement Device with Attachment Plates and Related Methods 审中-公开

    公开(公告)号：US20170315035A1

    公开(公告)日：2017-11-02

    申请号：US15650380

    申请日：2017-07-14

    Applicant: STMicroelectronics S.r.l.

    Inventor： Alberto Pagani ,  Bruno Murari ,  Federico Giovanni Ziglioli

    IPC: G01N3/08 ,  H01L23/31 ,  G01N3/06

    CPC classification number: G01N3/08 ,  G01L1/005 ,  G01L5/103 ,  G01N3/066 ,  H01L23/3107

    Abstract: A tensile stress measurement device is to be attached to an object to be measured. The tensile stress measurement device may include an IC having a semiconductor substrate and tensile stress detection circuitry, the semiconductor substrate having opposing first and second attachment areas. The tensile stress measurement device may include a first attachment plate coupled to the first attachment area and extending outwardly to be attached to the object to be measured, and a second attachment plate coupled to the second attachment area and extending outwardly to be attached to the object to be measured. The tensile stress detection circuitry may be configured to detect a tensile stress imparted on the first and second attachment plates when attached to the object to be measured.

    MAGNETIC INERTIAL SENSOR ENERGY HARVESTING AND SCAVENGING METHODS, CIRCUITS AND SYSTEMS
    106.
    发明申请
    MAGNETIC INERTIAL SENSOR ENERGY HARVESTING AND SCAVENGING METHODS, CIRCUITS AND SYSTEMS 审中-公开

    公开(公告)号：US20170093265A1

    公开(公告)日：2017-03-30

    申请号：US14871322

    申请日：2015-09-30

    Applicant: STMICROELECTRONICS S.r.l.

    Inventor： Alberto Pagani

    IPC: H02K35/02 ,  G01P15/18 ,  B81B3/00 ,  G01C19/5776

    CPC classification number: B81B3/0021 ,  G01C19/5776 ,  H02K35/02

    Abstract: A magnetic energy harvesting and scavenging circuit includes a first substrate having a first surface and a second surface. An energy harvesting and scavenging coil is formed proximate the first surface. An electromechanical systems device, which may be a MEMS device, includes a moveable mass that extends over the first surface of the first substrate and may be displaced relative to the substrate in three dimensions responsive to an external force applied to the moveable mass. The movable mass includes at least one permanent magnet that is magnetically coupled to the energy harvesting and scavenging coil. Energy harvesting and scavenging circuitry, which may be formed in the first substrate where the first substrate is a semiconductor chip, is electrically coupled to the energy harvesting and scavenging coil and generates electrical energy due to magnetic flux variation through the energy harvesting and scavenging coil responsive to movement of the moveable mass.

    Integrated electronic device for monitoring mechanical stress within a solid structure
    109.
    发明授权
    Integrated electronic device for monitoring mechanical stress within a solid structure 有权
    用于监测固体结构内的机械应力的集成电子装置

    公开(公告)号：US09464952B2

    公开(公告)日：2016-10-11

    申请号：US14108951

    申请日：2013-12-17

    Applicant: STMICROELECTRONICS S.R.L.

    Inventor： Alberto Pagani ,  Federico Giovanni Ziglioli ,  Bruno Murari

    IPC: G01M5/00 ,  G01B5/30 ,  G01B7/16 ,  G01L1/00 ,  G01N3/00 ,  G01L1/18 ,  H01L27/20

    CPC classification number: G01L1/18 ,  H01L27/20

    Abstract: The integrated electronic device is for detecting a local parameter related to a force observed in a given direction, within a solid structure. The device includes at least one sensor configured to detect the above-mentioned local parameter at least in the given direction through piezo-resistive effect. At least one damping element, integrated in the device, is arranged within a frame-shaped region that is disposed around the at least one sensor and belongs to a substantially planar region comprising a plane passing through the sensor and perpendicular to the given direction. Such at least one damping element is configured to damp forces acting in the planar region and substantially perpendicular to the given direction.

    Abstract translation: 集成电子装置用于在固体结构内检测与在给定方向上观察到的力有关的局部参数。 该装置包括至少一个传感器，其配置成至少在给定方向上通过压阻效应来检测上述局部参数。 集成在装置中的至少一个阻尼元件布置在围绕至少一个传感器设置的框状区域中，并且属于基本上平面的区域，该区域包括通过传感器并垂直于给定方向的平面。 这样的至少一个阻尼元件构造成阻碍作用在平面区域中并基本垂直于给定方向的力。

    HIGH-FREQUENCY OPTOELECTRONIC DETECTOR, SYSTEM AND METHOD
    110.
    发明申请
    HIGH-FREQUENCY OPTOELECTRONIC DETECTOR, SYSTEM AND METHOD 有权
    高频光电检测器，系统和方法

    公开(公告)号：US20160197223A1

    公开(公告)日：2016-07-07

    申请号：US15071525

    申请日：2016-03-16

    Applicant: STMicroelectronics S.r.l.

    Inventor： Alberto Pagani

    IPC: H01L31/105 ,  H01L31/0352 ,  H01L31/0232

    CPC classification number: H01L31/105 ,  H01L27/14 ,  H01L27/14643 ,  H01L31/02 ,  H01L31/0216 ,  H01L31/02327 ,  H01L31/035281

    Abstract: An optoelectronic device for detecting electromagnetic radiation includes a body of semiconductor material. A first region and a second region that form a junction are provided within the body. A recess extends into the body and is delimited by side arranged transverse to a main surface of the body. The junction is exposed by the sidewall to coupled electromagnetic radiation received in the recess into a photodiode formed by the junction.

    Abstract translation: 用于检测电磁辐射的光电子器件包括半导体材料体。 形成结的第一区域和第二区域设置在体内。 凹部延伸到主体中并且由横向于主体的主表面设置的侧限定。 该接合部被侧壁暴露以将容纳在凹部中的耦合的电磁辐射转换成由该接合部形成的光电二极管。

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