公开(公告)号：US20050051867A1

公开(公告)日：2005-03-10

申请号：US10852324

申请日：2004-05-24

Applicant: Wen-Chin Lee ,  Yee-Chia Yeo

Inventor： Wen-Chin Lee ,  Yee-Chia Yeo

IPC: H01L21/336 ,  H01L21/8244 ,  H01L27/11 ,  H01L29/00

CPC classification number: H01L27/11 ,  H01L27/1104

Abstract: A semiconductor device comprises a substrate. In addition, the semiconductor device comprises an active region and an isolation region. The active region is in the substrate and comprises a semiconductor material. The isolation region is also in the substrate, adjacent the active region and comprises an insulating material. The active region and isolation region form a surface having a step therein. The semiconductor further comprises a dielectric material formed over the step. The dielectric material has a dielectric constant greater than about 8.

Abstract translation: 半导体器件包括衬底。 此外，半导体器件包括有源区和隔离区。 有源区在衬底中并且包括半导体材料。 隔离区也在衬底中，邻近有源区并且包括绝缘材料。 有源区和隔离区形成其中具有台阶的表面。 半导体还包括在该步骤上形成的电介质材料。 电介质材料的介电常数大于约8。

公开(公告)号：US20050035409A1

公开(公告)日：2005-02-17

申请号：US10729095

申请日：2003-12-05

Applicant: Chih-Hsin Ko ,  Wen-Chin Lee ,  Yee-Chia Yeo ,  Chun-Chieh Lin ,  Chenming Hu

Inventor： Chih-Hsin Ko ,  Wen-Chin Lee ,  Yee-Chia Yeo ,  Chun-Chieh Lin ,  Chenming Hu

IPC: H01L21/336 ,  H01L21/8238 ,  H01L27/01 ,  H01L29/78

CPC classification number: H01L29/7848 ,  H01L21/26506 ,  H01L21/324 ,  H01L21/823807 ,  H01L21/823814 ,  H01L29/665 ,  H01L29/6653 ,  H01L29/6659 ,  H01L29/66636 ,  H01L29/7834

Abstract: A semiconductor chip includes a semiconductor substrate 126, in which first and second active regions are disposed. A resistor 124 is formed in the first active region and the resistor 124 includes a doped region 128 formed between two terminals 136. A strained channel transistor 132 is formed in the second active region. The transistor includes a first and second stressor 141, formed in the substrate oppositely adjacent a strained channel region 143.

Abstract translation: 半导体芯片包括其中设置有第一和第二有源区的半导体衬底126。 电阻器124形成在第一有源区域中，并且电阻器124包括形成在两个端子136之间的掺杂区域128.应变沟道晶体管132形成在第二有源区域中。 该晶体管包括第一和第二应力源141，该第一和第二应力器141形成在与基片相反的相邻的应变通道区域143之间。

公开(公告)号：US4596059A

公开(公告)日：1986-06-24

申请号：US562184

申请日：1983-12-16

Applicant: Wen-Chin Lee

Inventor： Wen-Chin Lee

IPC: B43L21/02 ,  B43L21/00

CPC classification number: B43L21/02

Abstract: An automatic dust-removing eraser of a rolling-friction type for use on a blackboard includes: a casing body having an open section or cavity in the central portion; a plurality of different guiding slots vertically formed at both ends of the side walls defining the open section; a spare space provided at each end portion with an escape clack valve and a discharge door respectively disposed in the opposing side walls defining the spare spaces; a pair of supporting members each having integrally-linked parallel plates respectively secured in the guiding slots of the casing body; and a plurality of master rollers and slave rollers mounted within the cavity in interrelated coupling; so that, by means of the matched rotation of the master and slave rollers and the unilateral check action effected from the supporting members, the chalk dust gathered by the master rollers over the surface of the blackboard is automatically removed through self-brushing and discharging action of the slave rollers.

Abstract translation: 用于黑板上的滚动摩擦型自动除尘橡皮擦包括：壳体，其在中心部分具有开口部分或空腔; 多个不同的引导槽，垂直地形成在限定开放部分的侧壁的两端; 在每个端部设置有分别设置在限定备用空间的相对侧壁中的排气门和排放门的备用空间; 一对支撑构件，每个支撑构件具有分别固定在壳体主体的引导槽中的一体连接的平行板; 以及安装在所述腔内的相互联接的多个主辊和从动辊; 使得通过主从轮的匹配旋转和从支撑构件实现的单侧检查动作，由主辊聚集在黑板表面上的白垩粉尘通过自刷和排出动作自动去除 的从动辊。

公开(公告)号：US09398733B2

公开(公告)日：2016-07-19

申请号：US13461006

申请日：2012-05-01

Applicant: Cheng-Hsien Lin ,  Yao-Wen Bai ,  Wen-Chin Lee ,  Rui Zhang ,  Kai-Li Jiang ,  Chen Feng

Inventor： Cheng-Hsien Lin ,  Yao-Wen Bai ,  Wen-Chin Lee ,  Rui Zhang ,  Kai-Li Jiang ,  Chen Feng

IPC: H05K9/00 ,  B29C70/88 ,  B29K105/16

CPC classification number: H05K9/009 ,  B29C70/882 ,  B29C70/885 ,  B29K2105/167 ,  C08L2666/76 ,  H05K9/0083 ,  H05K9/0088 ,  Y10S977/784 ,  Y10S977/789 ,  Y10T428/24132 ,  Y10T428/249979

Abstract: An electromagnetic shielding composite includes a polymer and a carbon nanotube film structure. The carbon nanotube structure includes a number of carbon nanotubes disposed in the polymer. The number of carbon nanotubes are parallel with each other.

Abstract translation: 电磁屏蔽复合材料包括聚合物和碳纳米管薄膜结构。 碳纳米管结构包括设置在聚合物中的多个碳纳米管。 碳纳米管的数量彼此平行。

公开(公告)号：US09005842B2

公开(公告)日：2015-04-14

申请号：US12546004

申请日：2009-08-24

Applicant: Tsung-Hsiung Wang ,  Jing-Pin Pan ,  Wen-Chin Lee ,  Yueh-Wei Lin ,  Ya-Tin Hsu ,  Chung-Liang Chang ,  Chih-Jer Shih

Inventor： Tsung-Hsiung Wang ,  Jing-Pin Pan ,  Wen-Chin Lee ,  Yueh-Wei Lin ,  Ya-Tin Hsu ,  Chung-Liang Chang ,  Chih-Jer Shih

IPC: H01M8/10 ,  C08G73/12 ,  C08J5/22 ,  C08L79/08 ,  H01M4/92

CPC classification number: H01M8/1041 ,  C08G73/12 ,  C08J5/2256 ,  C08J2371/12 ,  C08J2400/202 ,  C08L79/085 ,  H01M4/92 ,  H01M8/1023 ,  H01M8/1025 ,  H01M8/1027 ,  H01M8/103 ,  H01M8/1032 ,  H01M8/1048 ,  Y02E60/521

Abstract: Proton exchange membrane compositions having high proton conductivity are provided. The proton exchange membrane composition includes a hyper-branched polymer, wherein the hyper-branched polymer has a DB (degree of branching) of more than 0.5. A polymer with high ion conductivity is distributed uniformly over the hyper-branched polymer, wherein the hyper-branched polymer has a weight ratio equal to or more than 5 wt %, based on the solid content of the proton exchange membrane composition.

Abstract translation: 提供了具有高质子传导性的质子交换膜组合物。 质子交换膜组合物包括超支化聚合物，其中超支化聚合物具有大于0.5的DB（支化度）。 具有高离子电导率的聚合物均匀地分布在超支化聚合物上，其中基于质子交换膜组合物的固体含量，超支化聚合物的重量比等于或大于5重量％。

公开(公告)号：US08377252B2

公开(公告)日：2013-02-19

申请号：US11614362

申请日：2006-12-21

Applicant: Wen-Chin Lee ,  Cheng-Hsien Lin

Inventor： Wen-Chin Lee ,  Cheng-Hsien Lin

IPC: H01B13/00 ,  B44C1/22 ,  C23F1/00

CPC classification number: C23F1/08 ,  H05K3/068 ,  H05K2203/075

Abstract: The present invention relates to an apparatus for spraying an etchant and a method for manufacturing a printed circuit board. In one exemplary embodiment the apparatus includes a manifold, a plurality of feed pipes in fluid communication with the manifold, each of the feed pipes having a plurality of spray nozzles mounted thereon, the feed pipes cooperatively constitute a spray region, and a pressure-boosting device configured for increasing a spray pressure of the spray nozzles which are located at a central area of the spray region. The apparatus can overcome “the puddle effect” on an upper surface of the printed circuit board.

Abstract translation: 本发明涉及喷涂蚀刻剂的设备和印刷电路板的制造方法。 在一个示例性实施例中，设备包括歧管，与歧管流体连通的多个进料管，每个进料管具有安装在其上的多个喷嘴，进料管协同地构成喷射区域，并且加压 该装置被配置为增加位于喷射区域的中心区域处的喷嘴的喷雾压力。 该装置可以克服印刷电路板的上表面上的水坑效应。

公开(公告)号：US08101266B2

公开(公告)日：2012-01-24

申请号：US12135842

申请日：2008-06-09

Applicant: Wen-Chin Lee ,  Cheng-Hsien Lin

Inventor： Wen-Chin Lee ,  Cheng-Hsien Lin

IPC: H01K1/00

CPC classification number: H05K3/4641 ,  H05K3/386 ,  H05K2201/0382 ,  Y10S428/901 ,  Y10T428/24917

Abstract: A multilayer printed circuit board includes a first printed circuit board, a second printed circuit board, an adhesive film, and a function layer. The adhesive film is sandwiched between the first printed circuit board and the second printed circuit board. The function layer is disposed between the first printed circuit board and the second printed circuit board for blocking water from passing therethrough and for screening electromagnetic interference between the first printed circuit board and the second printed circuit board.

Abstract translation: 多层印刷电路板包括第一印刷电路板，第二印刷电路板，粘合膜和功能层。 粘合膜夹在第一印刷电路板和第二印刷电路板之间。 功能层设置在第一印刷电路板和第二印刷电路板之间，用于阻止水从其中通过，并用于屏蔽第一印刷电路板和第二印刷电路板之间的电磁干扰。

公开(公告)号：US07987586B2

公开(公告)日：2011-08-02

申请号：US12274190

申请日：2008-11-19

Applicant: Dong-Qing He ,  Ming Wang ,  Yun-Li Zhu ,  Wen-Chin Lee

Inventor： Dong-Qing He ,  Ming Wang ,  Yun-Li Zhu ,  Wen-Chin Lee

IPC: H05K3/36

CPC classification number: H05K3/4691 ,  H05K3/386 ,  H05K3/4652 ,  H05K2201/0909 ,  H05K2201/09127 ,  H05K2203/063 ,  H05K2203/308 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49155 ,  Y10T29/49165

Abstract: A method for manufacturing a printed circuit board (PCB) having different thicknesses in different areas includes: providing a first substrate having two lateral unwanted portions bounded two imaginary boundary lines, a binder layer having a through opening and a second substrate having a mounting area for mounting electronic elements; forming two slots bounded the imaginary boundary lines in an intermediated unwanted portion of the first substrate corresponding to the mounting area; laminating the first and second substrates, and the binder layer with the mounting area exposed via the through opening; filling the two slots and the through opening with a filling material, thereby obtaining a semifinished PCB board; cutting the semifinished PCB board along the imaginary boundary lines to remove the two lateral unwanted portions and a portion of the second substrate corresponding to the two lateral unwanted portions; and removing the intermediate unwanted portion and the filling material.

Abstract translation: 一种用于制造在不同区域中具有不同厚度的印刷电路板（PCB）的方法包括：提供具有限定两个假想边界线的两个横向不需要部分的第一基板，具有通孔的粘合剂层和具有用于 安装电子元件; 在对应于安装区域的第一基板的中间不想要的部分中形成限定虚拟边界线的两个槽; 层叠第一和第二基板和粘合剂层，其中安装区域经由通孔暴露; 用填充材料填充两个槽和通孔，从而获得半成品PCB板; 沿着虚拟边界线切割半成品PCB板，以去除对应于两个横向不需要部分的两个横向不需要部分和第二基板的一部分; 并去除中间不需要的部分和填充材料。

公开(公告)号：US07928474B2

公开(公告)日：2011-04-19

申请号：US11839352

申请日：2007-08-15

Applicant: Hong-Nien Lin ,  Chih-Hsin Ko ,  Wen-Chin Lee

Inventor： Hong-Nien Lin ,  Chih-Hsin Ko ,  Wen-Chin Lee

IPC: H01L21/02

CPC classification number: H01L29/7833 ,  H01L29/165 ,  H01L29/665 ,  H01L29/66553 ,  H01L29/6659 ,  H01L29/66628 ,  H01L29/66636

Abstract: A semiconductor structure is provided. The semiconductor structure includes a semiconductor substrate; an insulating region extending from substantially a top surface of the semiconductor substrate into the semiconductor substrate; an embedded dielectric spacer adjacent the insulating region, wherein a bottom of the embedded dielectric spacer adjoins the semiconductor substrate; and a semiconductor material adjoining a top edge and extending on a sidewall of the embedded dielectric spacer.

Abstract translation: 提供半导体结构。 半导体结构包括半导体衬底; 绝缘区域，其从所述半导体衬底的大致顶表面延伸到所述半导体衬底中; 邻近所述绝缘区域的嵌入式电介质间隔件，其中所述嵌入式电介质间隔件的底部邻接所述半导体衬底; 以及邻接在顶部边缘并且在嵌入的电介质间隔物的侧壁上延伸的半导体材料。

公开(公告)号：US07875959B2

公开(公告)日：2011-01-25

申请号：US11216512

申请日：2005-08-31

Applicant: Chung-Hu Ke ,  Wen-Chin Lee ,  Chenming Hu

Inventor： Chung-Hu Ke ,  Wen-Chin Lee ,  Chenming Hu

IPC: H01L29/04

CPC classification number: H01L29/045 ,  H01L21/823807 ,  H01L21/823814 ,  H01L21/823828 ,  H01L29/665 ,  H01L29/7833 ,  H01L29/7845 ,  H01L2924/0002 ,  H01L2924/00

Abstract: The channel of a MOSFET is selectively stressed by selectively stressing the silicide layers on the gate electrode and the source/drain. Stress in the silicide layer is selectively produced by orienting the larger dimensions of the silicide grains in a first direction and the smaller dimensions in a second, perpendicular direction, with one of the directions being parallel to the direction of carrier movement in the channel and the other direction being perpendicular thereto.

Abstract translation: 通过选择性地施加栅极电极和源极/漏极上的硅化物层来选择性地施加MOSFET的沟道。 硅化物层中的应力选择性地通过使第一方向上的硅化物颗粒的尺寸取向，并且在第二垂直方向上定向较小的尺寸，其中一个方向平行于通道中的载体移动方向，并且 其他方向与其垂直。