公开(公告)号：US09818937B2

公开(公告)日：2017-11-14

申请号：US14982600

申请日：2015-12-29

Applicant: STMicroelectronics Pte Ltd

Inventor： Olivier Le Neel ,  Ravi Shankar

IPC: H01L21/00 ,  H01L43/14 ,  G01N27/74 ,  H01L21/8234 ,  H01L43/04 ,  H01L43/06 ,  H01L43/10

CPC classification number: H01L43/14 ,  G01N27/74 ,  H01L21/8234 ,  H01L43/04 ,  H01L43/065 ,  H01L43/10 ,  Y10T29/4913

Abstract: A miniature oxygen sensor makes use of paramagnetic properties of oxygen gas to provide a fast response time, low power consumption, improved accuracy and sensitivity, and superior durability. The miniature oxygen sensor disclosed maintains a sample of ambient air within a micro-channel formed in a semiconductor substrate. O2 molecules segregate in response to an applied magnetic field, thereby establishing a measurable Hall voltage. Oxygen present in the sample of ambient air can be deduced from a change in Hall voltage with variation in the applied magnetic field. The magnetic field can be applied either by an external magnet or by a thin film magnet integrated into a gas sensing cavity within the micro-channel. A differential sensor further includes a reference element containing an unmagnetized control sample. The miniature oxygen sensor is suitable for use as a real-time air quality monitor in consumer products such as smart phones.

公开(公告)号：US09793427B1

公开(公告)日：2017-10-17

申请号：US15218966

申请日：2016-07-25

Applicant: STMICROELECTRONICS PTE LTD

Inventor： David Gani

IPC: H01L27/15 ,  H01L31/024 ,  H01L31/173 ,  G01V8/10

CPC classification number: H01L31/024 ,  G01V8/10 ,  G01V8/12 ,  H01L31/173 ,  H01L2224/48091 ,  H01L2224/48471 ,  H01L2224/73265 ,  H01L2924/00014

Abstract: One or more embodiments are directed to system in package (SiP) for optical devices, including proximity sensor packaging. One embodiment is directed to an optical sensor that includes a substrate and a sensor die. A through-hole extends through the substrate, and a trench is formed in a first surface of the substrate and is in fluid communication with the through-hole. The sensor die is attached to the first surface of the substrate and covers the first through-hole and a first portion of the trench. A second portion of the trench is left uncovered by the sensor die.

公开(公告)号：US09780080B2

公开(公告)日：2017-10-03

申请号：US14510433

申请日：2014-10-09

Applicant: STMICROELECTRONICS PTE LTD

Inventor： Yonggang Jin

IPC: H01L25/00 ,  H01L25/16 ,  G06F1/32 ,  H03K17/94 ,  G06F3/01

CPC classification number: H01L25/50 ,  G06F1/3231 ,  G06F3/017 ,  H01L25/165 ,  H01L25/167 ,  H01L2924/0002 ,  H03K17/941 ,  H03K2217/94108 ,  H04M2250/12 ,  H01L2924/00

Abstract: A method for making an optical proximity sensor includes forming a package top plate having an optical transmit opening and an optical receive opening extending therethrough, attaching an optical transmit element to the package top plate adjacent the optical transmit opening, and attaching an optical receive element to the package top plate adjacent the optical receive opening. A package body is formed onto the package top plate to define an optical transmit cavity receiving the optical transmit element and an optical receive cavity receiving the optical receive element.

公开(公告)号：US09723186B2

公开(公告)日：2017-08-01

申请号：US14183937

申请日：2014-02-19

Applicant: STMicroelectronics Pte Ltd.

Inventor： Loic Pierre Louis Renard ,  Wee Chin Judy Lim

IPC: H04N5/225 ,  H04N17/00 ,  H04N5/217 ,  H04N5/357

CPC classification number: H04N5/2254 ,  H04N5/217 ,  H04N5/2257 ,  H04N5/3572 ,  H04N17/002 ,  Y10T29/49128

Abstract: A low-cost resin lens is disclosed for use in miniature cameras. The resin lens features a low profile that is particularly well-suited to consumer products such as smart phones. The resin lens is mounted to an integrated circuit die that is attached to a standard four-layer substrate. The integrated circuit die includes electronic and/or optoelectronic circuits to support digital image capture, transfer, and processing. Image correction software adjusts the image to correct for distortion introduced by the resin lens.

公开(公告)号：US09679870B2

公开(公告)日：2017-06-13

申请号：US14565484

申请日：2014-12-10

Applicant: STMICROELECTRONICS PTE LTD

Inventor： Yiyi Ma ,  Kim-Yong Goh ,  Xueren Zhang ,  Wei Zhen Goh

IPC: H01L23/00 ,  H01L23/482 ,  H01L23/495 ,  H01L23/31

CPC classification number: H01L24/85 ,  H01L23/3107 ,  H01L23/4822 ,  H01L23/49555 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/48177 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: An integrated circuit (IC) device includes an IC and encapsulating material surrounding the IC. Leads are coupled to the IC and extend outwardly from sides of the encapsulating material, with each lead having three contiguous exposed segments with upper and lower bends defining a Z-shape. In another example, the leads include an upper horizontal segment, lower horizontal segment, and intermediate curved segment extending upwardly from the upper horizontal segment and downwardly to the lower horizontal segment.

公开(公告)号：US09645238B1

公开(公告)日：2017-05-09

申请号：US14981196

申请日：2015-12-28

Applicant: STMICROELECTRONICS PTE LTD

Inventor： Jing-En Luan

IPC: G01J1/42 ,  G01S17/02 ,  G01J1/04

CPC classification number: G01S17/026 ,  G01J1/0204 ,  G01J1/0209 ,  G01J1/0271 ,  G01J1/0488 ,  G01J1/06 ,  G01J1/42 ,  G01S7/4813 ,  H01L31/167 ,  H01L2224/73265

Abstract: The embodiments of the present disclosure provide a proximity sensor, an electronic apparatus and a method for manufacturing a proximity sensor. The proximity sensor comprises a substrate, a sensor chip, a light-emitting device, a non-transparent isolation structure and a non-transparent molding material, wherein the sensor chip is located on the substrate and electrically coupled to the substrate; the light-emitting device is located on the sensor chip and electrically coupled to the sensor chip; the non-transparent isolation structure is located on the sensor chip and isolates the light-emitting device from a sensor region of the sensor chip; and the non-transparent molding material at least partially covers the substrate, the sensor chip and the non-transparent isolation structure, such that a portion of the proximity sensor which is located right above the sensor region and the light-emitting device is not covered by the non-transparent molding material.

公开(公告)号：US09530681B2

公开(公告)日：2016-12-27

申请号：US14986130

申请日：2015-12-31

Applicant: STMicroelectronics Pte Ltd

Inventor： Calvin Leung ,  Olivier Le Neel

IPC: H01L21/683 ,  H01L21/768 ,  H01L27/06 ,  H01L23/498 ,  H01L23/538 ,  H01L23/31 ,  H01L21/56 ,  H01L21/48 ,  H01L23/00 ,  H01L27/105 ,  H01L49/02 ,  H01L29/66

CPC classification number: H01L21/6835 ,  H01L21/4846 ,  H01L21/568 ,  H01L21/76895 ,  H01L23/3135 ,  H01L23/49822 ,  H01L23/4985 ,  H01L23/5389 ,  H01L24/20 ,  H01L27/0629 ,  H01L27/1052 ,  H01L28/60 ,  H01L29/6675 ,  H01L2221/68345 ,  H01L2221/68359 ,  H01L2224/18 ,  H01L2924/0002 ,  H01L2924/00

Abstract: An electronic device is formed by depositing polyimide on a glass substrate. A conductive material is deposited on the polyimide and patterned to form electrodes and signal traces. Remaining portions of the electronic device are formed on the polyimide. A second polyimide layer is then formed on the first polyimide layer. The glass substrate is then removed, exposing the electrodes and the top surface of the electronic device.

公开(公告)号：US09525832B1

公开(公告)日：2016-12-20

申请号：US14740565

申请日：2015-06-16

Applicant: STMICROELECTRONICS PTE LTD

Inventor： Dave Alexis De La Cruz

IPC: H04N5/225 ,  H04N5/369 ,  G01D11/24 ,  H01L31/0232

CPC classification number: H04N5/2252 ,  G01D11/245 ,  H01L27/14618 ,  H01L31/02325 ,  H04N5/2253 ,  H04N5/2257

Abstract: An image sensor device includes a base having a rectangular shape and comprising first contacts and a reference voltage contact extending along a first side thereof, a housing carried by the base, and an image sensor integrated circuit (IC) carried by the base within the housing and having an image sensing surface. A focus cell is within the housing, aligned with the image sensing surface, and includes second contacts. An electromagnetic compatibility (EMC) shield is carried by the housing and includes a top panel having an opening therein aligned with the focus cell, and side panels extending downwardly from the top panel. Conductive leads extend between one of the first contacts and a corresponding one of the second contacts. A reference conductive lead extends between the reference voltage contact and the EMC shield.

Abstract translation: 一种图像传感器装置包括具有矩形形状的基部，包括第一触点和沿其第一侧延伸的参考电压触点，由基座承载的外壳以及由基座承载在壳体内的图像传感器集成电路（IC） 并具有图像感测表面。 聚焦单元位于壳体内，与图像感测表面对准，并且包括第二触点。 电磁兼容性（EMC）屏蔽由壳体承载，并且包括顶板，其具有与聚焦电池对准的开口，以及从顶板向下延伸的侧板。 导电引线在第一触点中的一个和第二触点之间相应的一个之间延伸。 参考导线在参考电压触点和EMC屏蔽之间延伸。

公开(公告)号：US09448216B2

公开(公告)日：2016-09-20

申请号：US14511280

申请日：2014-10-10

Applicant: STMICROELECTRONICS PTE LTD

Inventor： Yonggang Jin ,  Ravi Shankar

IPC: G01N27/12 ,  G01N33/00

CPC classification number: G01N33/0009 ,  H01L2224/48091 ,  H01L2924/00014

Abstract: A gas sensor device may include a gas sensor integrated circuit (IC) having a gas sensing surface, and bond pads adjacent to the gas sensing surface, and a frame having gas passageways extending therethrough adjacent the gas sensing surface. The gas sensor device may include leads, each having a proximal end spaced from the frame and bonded to a respective bond pad, and a distal end extending downwardly from the proximal end, and encapsulation material filling the space between the proximal ends of the leads and the frame.

Abstract translation: 气体传感器装置可以包括具有气体检测表面的气体传感器集成电路（IC）和与气体感测表面相邻的接合焊盘，以及具有在气体感测表面附近延伸穿过的气体通道的框架。 气体传感器装置可以包括引线，每个引线具有与框架间隔开并且接合到相应的接合焊盘的近端和从近端向下延伸的远端，以及填充引线的近端之间的空间的封装材料和 框架。

公开(公告)号：US09435763B2

公开(公告)日：2016-09-06

申请号：US13929515

申请日：2013-06-27

Applicant: STMicroelectronics Pte Ltd.

Inventor： Olivier Le Neel ,  Suman Cherian

IPC: G01N27/327

CPC classification number: G01N27/3274 ,  G01N27/327

Abstract: A bio-fluid test strip includes a fluid receiving area and a contact pad area for interfacing with a fluid sensing device. The test strip includes a fluid sensing electrodes and a first temperature sensing resistor in the fluid receiving area. The test strip further includes a second temperature sensing resistor in the contact pad area. The first and second temperature sensing resistors together provide an indication of the temperature difference between the fluid sensing area and ambience.

Abstract translation: 生物流体测试条包括用于与流体感测装置接口的流体接收区域和接触焊盘区域。 测试条在流体接收区域中包括流体感测电极和第一温度感测电阻器。 测试条还包括接触焊盘区域中的第二温度感测电阻器。 第一和第二温度感测电阻器一起提供流体感测区域和环境之间的温度差的指示。