公开(公告)号：US6041141A

公开(公告)日：2000-03-21

申请号：US513294

申请日：1995-08-10

申请人： Hiroshi Yamamoto ,  Hisao Niwa ,  Yoshihiro Kojima ,  Susumu Maruno ,  Kazuhiro Kayashima ,  Toshiyuki Kouda ,  Hidetsugu Maekawa ,  Satoru Ito ,  Yasuharu Shimeki

发明人： Hiroshi Yamamoto ,  Hisao Niwa ,  Yoshihiro Kojima ,  Susumu Maruno ,  Kazuhiro Kayashima ,  Toshiyuki Kouda ,  Hidetsugu Maekawa ,  Satoru Ito ,  Yasuharu Shimeki

IPC分类号： G06K9/72 ,  G06K9/68

CPC分类号： G06K9/726 ,  G06K2209/01

摘要： There is disclosed a character recognition machine adapted to recognize Japanese characters such as kanjis and kanas. The machine comprises a character string storage portion, a character extraction portion, a character recognition portion, and a language processing portion. A character string to be recognized is stored as an image in the storage portion. The character extraction portion comprises a network consisting a plurality of interconnected operators each of which has numerous inputs and outputs. An evaluation function which assumes its minimum value when a character extraction produces the best results is calculated by the operators simultaneously so as to minimize the value of the function. The character recognition portion calculates degrees of similarity of a character pattern to various character categories, the character pattern being applied from the character extraction portion. The language processing portion receives these degrees of similarity and selects a character category which seems to provide the must correct combination of characters in terms of vocabulary and grammar.

摘要翻译： 公开了一种适于识别诸如kanjis和kanas之类的日本字符的字符识别机。 机器包括字符串存储部分，字符提取部分，字符识别部分和语言处理部分。 要识别的字符串作为图像存储在存储部分中。 字符提取部分包括由多个互连操作器组成的网络，每个操作器具有许多输入和输出。 当字符提取产生最佳结果时，假设其最小值的评估函数由运算符同时计算，以便使函数的值最小化。 字符识别部分从字符提取部分计算字符图案与各种字符类别的相似度，字符图案被应用。 语言处理部分接收这些相似程度，并且选择似乎在词汇和语法方面提供必须正确的字符组合的字符类别。

公开(公告)号：US5583381A

公开(公告)日：1996-12-10

申请号：US535956

申请日：1995-09-28

申请人： Yuji Hara ,  Satoru Ito ,  Tatsuro Toya

发明人： Yuji Hara ,  Satoru Ito ,  Tatsuro Toya

IPC分类号： H01L23/29 ,  H01L23/31 ,  H01L23/58 ,  H01L29/34 ,  H01L23/48 ,  H01L27/02 ,  H01L29/40

CPC分类号： H01L23/3171 ,  H01L23/291 ,  H01L23/585 ,  H01L2224/451 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L24/45 ,  H01L24/48 ,  H01L2924/01014 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/181

摘要： A resin molded type semiconductor device has a metallic guard ring that is formed to cover the peripheral edge of the surface of a tetragonal semiconductor substrate. In order to prevent a passivation film on the guard ring from being cracked by stresses due to a resin mold package concentrating in the four corners of the semiconductor substrate, slits or rows of small holes are formed in the corner portions of the guard ring.

摘要翻译： 树脂模制型半导体器件具有形成为覆盖四边形半导体衬底的表面的周缘的金属保护环。 为了防止保护环上的钝化膜由于聚集在半导体衬底的四个角中的树脂模具封装而受到应力的破坏，在保护环的角部形成有狭缝或一排小孔。

公开(公告)号：US5366768A

公开(公告)日：1994-11-22

申请号：US875271

申请日：1992-04-28

申请人： Akira Kasari ,  Satoru Ito ,  Shigeru Nakamura

发明人： Akira Kasari ,  Satoru Ito ,  Shigeru Nakamura

IPC分类号： B05D5/06 ,  B05D7/00 ,  C08L33/06 ,  C08L61/20 ,  C08L83/04 ,  C09D125/14 ,  C09D133/06 ,  C09D143/04 ,  C09D163/00 ,  C09D167/00 ,  C09D183/04 ,  C09D201/06 ,  B05D1/36

CPC分类号： B05D7/532 ,  B05D5/068 ,  C09D125/14 ,  C09D133/06 ,  C09D143/04 ,  C09D163/00 ,  C09D167/00 ,  C09D183/04 ,  C09D201/06 ,  B05D2451/00 ,  B05D2601/02 ,  C08L33/06 ,  C08L61/20 ,  C08L83/04

摘要： A method for forming a coating film by sequentially forming a pigmented base coat and a clear top coat on a substrate. The pigmented base coat composition includes (1) an OH-containing resin, (2) an amino resin, (3) a polyorganosiloxane resin a number average molecule weight of at least 1,000 and having at least two groups per molecule selected from a silanol group and an alkoxysilane group and (4) a flaky metal or a mica powder in (5) an organic solvent. The clear top coat composition includes (1) an OH- and epoxy-containing base resin which additionally contains at least one of a silanol group and a hydrolyzable group bound directly to a silicon atom, (2) a curing catalyst and (3) an organic solvent.

摘要翻译： 通过在基材上依次形成着色底涂层和透明面漆来形成涂膜的方法。 着色底涂层组合物包括（1）含OH树脂，（2）氨基树脂，（3）数均分子量至少为1,000且每分子具有至少两个基团的聚有机硅氧烷树脂，其选自硅烷醇基 和（4）有机溶剂中的（4）片状金属或云母粉末。 透明面漆组合物包括（1）含有OH-和环氧基的基础树脂，其另外包含直接与硅原子结合的硅烷醇基和可水解基团中的至少一种，（2）固化催化剂和（3） 有机溶剂。

公开(公告)号：US5348998A

公开(公告)日：1994-09-20

申请号：US944032

申请日：1992-09-11

申请人： Satoru Ito ,  Takao Matoba ,  Kenji Yamamoto ,  Shinji Sugiura

发明人： Satoru Ito ,  Takao Matoba ,  Kenji Yamamoto ,  Shinji Sugiura

IPC分类号： C09D7/12 ,  C09D201/00 ,  C08K5/23

CPC分类号： C09D7/125 ,  C09D201/00 ,  C09D7/1266 ,  C09D7/1275

摘要： A coating composition comprising(A) a film-forming binder resin,(B) a volatile organic liquid diluent dissolving the film-forming binder resin (A) and(C) fine particles of a polymer which does not dissolve in a solution of the binder resin (A) in the diluent (B) but are dispersed stably in said solution, andthe fine polymer particles (C) being fine particles of gelled polymer obtained by emulsion polymerization of(a) a polymerizable monomer having at least two radical-polymerizable unsaturated groups in the molecule, and(b) a radical polymerizable unsaturated monomer other than the monomer (a),in the presence of a reactive emulsifier having an allyl group in the molecule.

摘要翻译： 一种涂料组合物，其包含（A）成膜粘合剂树脂，（B）溶解成膜粘合剂树脂（A）的挥发性有机液体稀释剂和（C）不溶于所述成膜粘合剂树脂 稀释剂（B）中的粘合剂树脂（A），但稳定地分散在所述溶液中，聚合物微粒（C）是通过（a）具有至少两个自由基的聚合性单体的乳液聚合得到的凝胶状聚合物的细颗粒， 在（b）分子中具有烯丙基的反应性乳化剂存在下，单体（a）以外的自由基聚合性不饱和单体，分子内的聚合性不饱和基团。

公开(公告)号：US5323025A

公开(公告)日：1994-06-21

申请号：US998891

申请日：1992-12-29

申请人： Satoru Ito ,  Michihiro Murata ,  Norio Fukui ,  Keizou Yamamoto ,  Tetsujiro Sawao ,  Satoshi Awata ,  Yasuo Tada ,  Satoru Kawabata

发明人： Satoru Ito ,  Michihiro Murata ,  Norio Fukui ,  Keizou Yamamoto ,  Tetsujiro Sawao ,  Satoshi Awata ,  Yasuo Tada ,  Satoru Kawabata

IPC分类号： G01J5/34 ,  H01L37/02 ,  H01L29/66 ,  G01J5/00 ,  H01L27/14 ,  H01L31/00

CPC分类号： H01L37/02 ,  G01J5/34 ,  B29L2031/3493

摘要： A pyroelectric IR-sensor in which a pyroelectric light receiving element is mounted on a MID substrate or a ceramic substrate of which thermal conductivity is less than 0.02 cal/cm.sec..degree. C. in a manner that both end portions of the pyroelectric light receiving element are supported by the substrate with the central portion of the pyloelectric light receiving element being spaced from the substrate, and chip parts are further mounted on the substrate.

摘要翻译： 热电式IR传感器，其热电接收元件安装在MID基板或导热率小于0.02cal / cm·sec的陶瓷基板上。 以使得热电接收元件的两个端部由基底支撑的方式，其中，电致电接收元件的中心部分与基板间隔开，并且芯片部件进一步安装在基板上。

公开(公告)号：US4951122A

公开(公告)日：1990-08-21

申请号：US199538

申请日：1988-05-27

申请人： Kunihiro Tsubosaki ,  Gen Murakami ,  Toshiyuki Sakuta ,  Masamichi Ishihara ,  Satoru Ito ,  Yasuo Mori

发明人： Kunihiro Tsubosaki ,  Gen Murakami ,  Toshiyuki Sakuta ,  Masamichi Ishihara ,  Satoru Ito ,  Yasuo Mori

IPC分类号： H01L23/31 ,  H01L23/495 ,  H01L23/498

CPC分类号： H01L24/32 ,  H01L23/3135 ,  H01L23/49506 ,  H01L23/4951 ,  H01L23/49541 ,  H01L23/49558 ,  H01L23/49861 ,  H01L2224/05554 ,  H01L2224/32014 ,  H01L2224/32245 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/48465 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2224/8592 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/10253 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/3011 ,  H01L2924/351

摘要： The present invention relates to a technique in which the pellet fixing parts of a lead frame of the tabless type or the type having no die pads are molded in or coated with a resin beforehand in order to enhance the reliability of a resin-encapsulated IC having become important with enlargement in the size of the chip of a memory IC or the like and reduction in the size of a resin package, and a resin package structure in which the technique of the lead frame having no die pads is applied to flat packaging so as to lessen reflow cracks.

摘要翻译： 本发明涉及一种技术，其中预先将无凸型引线框架或不具有模片焊盘的引线框架的芯片固定部件预先模制或涂覆树脂，以提高具有树脂封装的IC的可靠性 随着存储器IC等的芯片的尺寸的增大和树脂封装的尺寸的减小而变得重要，并且将没有管芯焊盘的引线框架的技术应用于平面封装的树脂封装结构，因此 以减少回流裂纹。

公开(公告)号：US4598163A

公开(公告)日：1986-07-01

申请号：US628915

申请日：1984-07-09

申请人： Satoru Ito

发明人： Satoru Ito

IPC分类号： G01J1/02 ,  G01J5/02 ,  G01J5/12 ,  G01J5/34 ,  H01B3/00 ,  H01L37/02 ,  H01L35/00 ,  G01J5/00 ,  G01J5/48

CPC分类号： G01J5/34 ,  H01L37/02

摘要： A pyroelectric detector comprising a functional portion in which opposed electrodes 111 to 118 are formed on both surfaces of a pyroelectric type substrate 101 and four light receiving electrode portions a, b, c and d are structured by the opposed electrodes 111 to 118. Among the light receiving electrode portions a, b, c and d, the light receiving electrode portions a and c in odd-numbered positions constitute one light receiving electrode group A and the light receiving electrode portions b and d in even-numbered positions constitute the other light receiving electrode group B. The light receiving electrode portions a and c and the light receiving electrode portions b and d are electrically connected alternately and in series, and the light receiving electrode group A and the other light receiving electrode group B are connected to have opposite polarities.

摘要翻译： 一种热电检测器，其包括功能部分，其中相对电极111至118形成在热电型基板101的两个表面上，并且四个光接收电极部分a，b，c和d由相对的电极111至118构成。 光接收电极部分a，b，c和d中，奇数位置的受光电极部分a和c构成一个受光电极组A，偶数位置的受光电极部分b和d构成另一个光 光接收电极部分a和c以及受光电极部分b和d交替地和串联地电连接，并且光接收电极组A和另一个光接收电极组B被连接成相反的 极性

公开(公告)号：US4226901A

公开(公告)日：1980-10-07

申请号：US962034

申请日：1978-11-20

申请人： Shinji Sugiura ,  Tadashi Watanabe ,  Satoru Ito

发明人： Shinji Sugiura ,  Tadashi Watanabe ,  Satoru Ito

IPC分类号： C09D5/38 ,  B05D5/06 ,  B05D7/00 ,  C08L61/20 ,  C09D133/04 ,  C09D133/10 ,  B05D3/02

CPC分类号： B05D7/532 ,  B05D5/068 ,  C09D133/10 ,  C08L61/20

摘要： In a method for applying a metallic finish coat to a substrate which comprises applying a base coat composed of a metallic paint containing a thermosetting resin as a film-forming ingredient to a substrate, applying a top coat composed of a clear paint containing a thermosetting resin as a film-forming ingredient to the surface of the base coat, and heating both the base coat and top coat to cure them, the improvement wherein the film-forming ingredient of the clear paint in the top coat comprises (A) an acrylic resin having a number average molecular weight of 5,000 to 15,000 and a glass transition temperature of from 5.degree. to 35.degree. C. obtained by copolymerizing (a) 42 to 90 parts by weight of at least one methacrylate selected from alkyl methacrylates with the alkyl moiety having 4 to 18 carbon atoms and (b) 10 to 58 parts by weight of a monomer having an ethylenically unsaturated bond and a hydroxyl group in the molecule, the total amount of components (a) and (b) being 100 parts by weight, and (B) an aminoaldehyde resin, the weight ratio of the acrylic resin (A) to the aminoaldehyde resin (B) being from 80:20 to 65:35.

摘要翻译： 在将金属涂层涂布在基材上的方法中，其包括将由含有热固性树脂的金属涂料构成的底涂层作为成膜剂施用到基材上，涂布由含有热固性树脂的透明涂料 作为底涂层表面的成膜成分，并且加热底涂层和顶涂层以固化它们，其中顶涂层中的透明涂料的成膜成分包括（A）丙烯酸树脂 通过共聚合（a）42至90重量份的至少一种选自甲基丙烯酸烷基酯的甲基丙烯酸酯的甲基丙烯酸酯与烷基部分具有共聚合而获得的数均分子量为5,000至15,000，玻璃化转变温度为5至35℃ 4至18个碳原子，和（b）10至58重量份的分子中具有烯键式不饱和键和羟基的单体，组分（a）和（b）的总量为100份b （B）氨基甲醛树脂，丙烯酸树脂（A）与氨基甲醛树脂（B）的重量比为80:20〜65:35。

公开(公告)号：US4000507A

公开(公告)日：1976-12-28

申请号：US542301

申请日：1975-01-20

申请人： Sumio Nishida ,  Katsuro Sugawara ,  Eiichi Yamada ,  Satoru Ito ,  Kohei Yamada

发明人： Sumio Nishida ,  Katsuro Sugawara ,  Eiichi Yamada ,  Satoru Ito ,  Kohei Yamada

IPC分类号： H01L29/40 ,  H01L21/331 ,  H01L23/31 ,  H01L23/485 ,  H01L23/58 ,  H01L23/60 ,  H01L29/06 ,  H01L29/73 ,  H01L29/861 ,  H01L29/34 ,  H01L23/48

CPC分类号： H01L29/402 ,  H01L23/3171 ,  H01L23/485 ,  H01L23/585 ,  H01L23/60 ,  H01L2924/0002

摘要： In a semiconductor device wherein an insulating film is provided on that surface of a semiconductor substrate to which a base-collector junction extends, two annular electrodes are formed with the junction formed therebetween. One of the electrodes is maintained at base potential, while the other electrode is maintained at collector potential. Thus, moisture or like contaminants adhering to the insulating film are prevented from leading to the generation of excessive channel current.

摘要翻译： 在半导体器件中，在集电极结延伸的半导体衬底的表面上设置绝缘膜，形成两个环形电极，其间形成有结。 其中一个电极保持在基极电位，而另一个电极保持在集电极电位。 因此，防止粘附到绝缘膜上的水分或类似污染物导致过大的通道电流的产生。

公开(公告)号：US09337409B2

公开(公告)日：2016-05-10

申请号：US14342115

申请日：2011-11-22

申请人： Takahiro Ochi ,  Shogo Suzuki ,  Masaaki Kikuchi ,  Huiyuan Geng ,  Satoru Ito ,  Junqing Guo

发明人： Takahiro Ochi ,  Shogo Suzuki ,  Masaaki Kikuchi ,  Huiyuan Geng ,  Satoru Ito ,  Junqing Guo

IPC分类号： H01L35/10 ,  H01L35/08

CPC分类号： H01L35/10 ,  H01L35/08

摘要： A thermal stress of electrode members (121 to 123) due to an operation temperature may be relaxed by thermal stress relaxation layers (141 to 144), and thus peeling of the electrode members (121 to 123) due to thermal stress at the operation temperature may be prevented in a satisfactory manner. Furthermore, diffusion of a constituent component of the thermoelectric conversion members (111 and 112) due to the operation temperature and the like may be prevented by diffusion prevention layers (151 to 154), and thus durability and stability of the thermoelectric conversion module (100) may be improved.

摘要翻译： 由于工作温度导致的电极构件（121〜123）的热应力可能会被热应力松弛层（141〜144）松弛，由此在工作温度下由于热应力而导致的电极构件（121〜123）的剥离 可以以令人满意的方式被防止。 此外，由于操作温度等导致的热电转换构件（111和112）的构成部件的扩散可以通过防扩散层（151至154）来防止，因此热电转换模块（100）的耐久性和稳定性 ）可以改进。