Memory Device Formed On Silicon-On-Insulator Substrate, And Method Of Making Same

    公开(公告)号:US20240389319A1

    公开(公告)日:2024-11-21

    申请号:US18228414

    申请日:2023-07-31

    Abstract: A memory device includes a SOI substrate comprising bulk silicon, an insulation layer vertically over the bulk silicon, and a silicon layer vertically over the insulation layer. A memory cell includes source and drain regions formed in the bulk silicon with a channel region of the bulk silicon extending therebetween, and a floating gate which includes a first portion of the silicon layer disposed vertically over and insulated from a first portion of the channel region by the insulation layer. The first portion of the silicon layer is epitaxially thickened or a layer of polysilicon is formed on the first portion of the silicon layer. A select gate is disposed vertically over and insulated from a second portion of the channel region. A control gate is disposed vertically over and insulated from the floating gate. An erase gate is disposed vertically over and insulated from the source region.

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