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公开(公告)号：US20140030443A1
公开(公告)日：2014-01-30
申请号：US13560791
申请日：2012-07-27
Applicant: Christopher D. Prest , Ashutosh Y. Shukla , Dale N. Memering , Vashist Vasanthakumar , Vincent Yan , Thomas Johannessen
Inventor： Christopher D. Prest , Ashutosh Y. Shukla , Dale N. Memering , Vashist Vasanthakumar , Vincent Yan , Thomas Johannessen
Abstract: Methods for creating sapphire windows are provided herein. In particular, one embodiment may take the form of a method of manufacturing sapphire windows. The method includes obtaining a polished sapphire wafer and applying decoration to the sapphire wafer. The method also includes cutting the sapphire wafer into discrete windows. In some embodiments, the cutting step comprises laser ablation of the sapphire.
Abstract translation: 本文提供了制造蓝宝石窗的方法。 特别地，一个实施例可以采用制造蓝宝石窗的方法。 该方法包括获得抛光的蓝宝石晶片并将其装配到蓝宝石晶片上。 该方法还包括将蓝宝石晶片切割成离散的窗口。 在一些实施例中，切割步骤包括蓝宝石的激光烧蚀。
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122.发明申请NON-DESTRUCTIVE METHOD TO DETERMINE CRYSTALLINITY IN AMORPHOUS ALLOY USING SPECIFIC HEAT CAPACITY 审中-公开使用特定热容测定非晶态合金中晶体结构的非破坏性方法公开(公告)号：US20140012534A1
公开(公告)日：2014-01-09
申请号：US13541694
申请日：2012-07-04
Applicant: Christopher D. PREST , Matthew S. SCOTT , Dermot J. STRATTON , Joseph C. POOLE , Theodore A. WANIUK
Inventor： Christopher D. PREST , Matthew S. SCOTT , Dermot J. STRATTON , Joseph C. POOLE , Theodore A. WANIUK
CPC classification number: G01N25/005
Abstract: One embodiment provides a method and apparatus for determining an unknown degree of crystallinity of a bulk-solidifying amorphous alloy specimen based on the heat capacity of the specimen. The method and apparatus make use of the different heat capacities of alloys having differing degrees of crystallinity.
Abstract translation: 一个实施方案提供了一种用于基于样品的热容量确定体固固化非晶合金样品的未知结晶度的方法和装置。 该方法和装置利用具有不同结晶度的合金的不同热容。
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123.发明申请BMG PARTS HAVING GREATER THAN CRITICAL CASTING THICKNESS AND METHOD FOR MAKING THE SAME 有权具有大于临界铸造厚度的BMG部件及其制造方法公开(公告)号：US20140011050A1
公开(公告)日：2014-01-09
申请号：US13541707
申请日：2012-07-04
Applicant: Joseph C. Poole , Christopher D. Prest , Matthew S. Scott , Dermot J. Stratton , Stephen P. Zadesky
Inventor： Joseph C. Poole , Christopher D. Prest , Matthew S. Scott , Dermot J. Stratton , Stephen P. Zadesky
CPC classification number: C22C45/10 , B32B2307/702 , C22C1/002 , C22C33/003 , C22C45/00 , C22C45/001 , C22C45/003 , C22C45/02 , Y10T428/12986 , Y10T428/31678
Abstract: The embodiments described herein relate to BMG articles with high bulk having all dimensions greater than the critical dimension. Exemplary BMG article can include at least one bulk component and/or one or more fixation elements configured on surface of the bulk component or inserted into the bulk component. Other embodiments relate to methods of making the BMG articles by thermo-plastic-formation of BMG alloy materials.
Abstract translation: 本文描述的实施例涉及具有大于临界尺寸的所有尺寸的具有高体积的BMG制品。 示例性的BMG制品可以包括构造在散装部件的表面上或插入大块部件中的至少一个散装部件和/或一个或多个固定元件。 其他实施方案涉及通过BMG合金材料的热塑性形成来制造BMG制品的方法。
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124.发明申请公开(公告)号：US20140009872A1
公开(公告)日：2014-01-09
申请号：US13541696
申请日：2012-07-04
Applicant: CHRISTOPHER D. PREST , Matthew S. Scott , Stephen P. Zadesky , Dermot J. Stratton , Joseph C. Poole
Inventor： CHRISTOPHER D. PREST , Matthew S. Scott , Stephen P. Zadesky , Dermot J. Stratton , Joseph C. Poole
CPC classification number: C23C4/18 , B22F9/08 , C22C1/045 , C22C1/0458 , C22C1/0466 , C22C19/07 , C22C32/0047 , C22C33/0278 , C22C33/0285 , C22C38/18 , C22C38/24 , C22C38/28 , C22C38/32 , C22C38/34 , C22C38/38 , C22C38/42 , C22C38/44 , C22C38/50 , C22C38/54 , C22C45/02 , C23C4/067 , C23C24/04
Abstract: Various embodiments provide materials, parts, and methods useful for electronic devices. One embodiment includes providing a coating on at least one surface of a substrate, increasing an amorphicity of the coating, and incorporating the substrate including the coating having increased amorphicity into an electronic device. Another embodiment relates to frictionally transforming a coating from crystalline into amorphous to form a metamorphically transformed coating for an electronic device. Another embodiment relates to an electronic device part having a metamorphically transformed coating disposed on at least one surface thereof.
Abstract translation: 各种实施例提供了用于电子设备的材料，部件和方法。 一个实施方案包括在基材的至少一个表面上提供涂层，增加涂层的不规则性，以及将包含具有增加的非晶性的涂层的基材结合到电子器件中。 另一个实施方案涉及将涂层从结晶摩擦转化为无定形以形成电子装置的变质转化涂层。 另一实施例涉及一种具有设置在其至少一个表面上的变质涂层的电子器件部件。
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公开(公告)号：US20140008327A1
公开(公告)日：2014-01-09
申请号：US13541360
申请日：2012-07-03
Applicant: CHRISTOPHER D. PREST , Joseph C. Poole , Matthew S. Scott , Dermot J. Stratton
Inventor： CHRISTOPHER D. PREST , Joseph C. Poole , Matthew S. Scott , Dermot J. Stratton
CPC classification number: C22C33/02 , B22F3/225 , B22F5/10 , B22F2005/103 , C22C1/0458 , C22C1/0466 , C22C2200/00
Abstract: Provided in one embodiment is a method of forming a movable joint or connection between parts that move with respect to one another, wherein at least one part is at least partially enclosed by at least one second part. The method includes positioning an etchable material over an at least one first part, molding or forming an at least one second part over at least the etchable material, and removing the etchable material.
Abstract translation: 在一个实施例中提供了一种在相对于彼此移动的部件之间形成可移动接头或连接的方法，其中至少一个部分至少部分地被至少一个第二部分包围。 该方法包括将可蚀刻材料定位在至少一个第一部分上，在至少可蚀刻材料上成型或形成至少一个第二部分，以及去除可蚀刻材料。
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Patent Agency Ranking
126.发明申请METHOD OF USING CORE SHELL PRE-ALLOY STRUCTURE TO MAKE ALLOYS IN A CONTROLLED MANNER 有权使用芯壳预合金结构在控制管道中制备合金的方法公开(公告)号：US20140007987A1
公开(公告)日：2014-01-09
申请号：US13541708
申请日：2012-07-04
Applicant: CHRISTOPHER D. PREST , Joseph C. Poole , Matthew S. Scott , Dermot J. Stratton
Inventor： CHRISTOPHER D. PREST , Joseph C. Poole , Matthew S. Scott , Dermot J. Stratton
IPC: C22F1/00
CPC classification number: C22C45/02 , B22F1/0085 , B22F1/025 , B22F9/002 , C22C1/002 , C22C1/0425 , C22C1/0458 , C22C1/0466 , C22C33/0278 , C22C45/00 , C22C45/003 , C22F1/00 , C22F1/186
Abstract: Disclosed herein are methods of combining at least one bulk-solidifying amorphous alloy and at least one additional metal or alloy of a metal to provide a composite preform. The composite preform then is heated to produce an alloy of the bulk-solidifying amorphous alloy and the at least one additional metal or alloy of the metal.
Abstract translation: 本文公开了将至少一种本体固化的非晶态合金和至少一种金属的另外的金属或合金组合以提供复合预型体的方法。 然后将复合预型体加热以产生本体固化非晶态合金和该金属的至少一种附加金属或合金的合金。
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公开(公告)号：US20140007985A1
公开(公告)日：2014-01-09
申请号：US13541565
申请日：2012-07-03
Applicant: CHRISTOPHER D. PREST , JOSEPH C. POOLE , MATTHEW S. SCOTT , DERMOT J. STRATTON
Inventor： CHRISTOPHER D. PREST , JOSEPH C. POOLE , MATTHEW S. SCOTT , DERMOT J. STRATTON
IPC: C21D11/00
CPC classification number: C21D11/00 , C21D2201/03
Abstract: Disclosed is a method of controlling the production of a bulk-solidifying amorphous alloy by providing a set point control system, run in conjunction with a continuous smart feedback process control system that continuously monitors the processing conditions during manufacture, and continuously updates the smart feedback control system thereby enabling the control system to learn as the process is running.
Abstract translation: 公开了一种通过提供一个设定点控制系统来控制大块固体非晶态合金的生产的方法，该设定点控制系统与在制造期间连续监视加工条件的连续智能反馈过程控制系统一起运行，并且连续地更新智能反馈控制 系统，从而使得控制系统能够在进程正在运行时学习。
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公开(公告)号：US20140007984A1
公开(公告)日：2014-01-09
申请号：US13541848
申请日：2012-07-05
Applicant: Christopher D. Prest , Matthew S. Scott , Stephen P. Zadesky , Dermot J. Stratton , Joseph C. Poole
Inventor： Christopher D. Prest , Matthew S. Scott , Stephen P. Zadesky , Dermot J. Stratton , Joseph C. Poole
CPC classification number: B22D29/002 , C22C1/002 , C22C1/02 , C22C33/003 , C22C45/001 , C22C45/003 , C22C45/02 , C22C45/10
Abstract: Provided in an embodiment is a method for molding, including: providing a molten alloy in a space between a mold cavity and an etchable block shaped to form an undercut on a part formed in the space, cooling the molten alloy to form the part with the undercut, and etching the etchable block. An undercut is a beveled edge caused by an etchant attacking an etchable block laterally and optionally vertically. The formed part can be made of a bulk amorphous alloy. In some cases, the etchable block can also be used to form at least one threaded portion in the part.
Abstract translation: 在一个实施例中提供了一种模制方法，包括：在模具腔和可蚀刻块之间的空间中提供熔融合金，其形状在形成在该空间中的部分上形成底切，冷却熔融合金以形成具有 底切和蚀刻可蚀刻块。 底切是由蚀刻剂横向和任选垂直地攻击可蚀刻块而引起的斜边。 形成的部分可以由块状非晶合金制成。 在一些情况下，可蚀刻块也可用于在该部分中形成至少一个螺纹部分。
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129.发明申请INSERT CASTING OR TACK WELDING OF MACHINABLE METAL IN BULK AMORPHOUS ALLOY PART AND POST MACHINING THE MACHINABLE METAL INSERT 有权在大块非晶合金部件中插入或焊接可加工金属，并机加工机械金属插件公开(公告)号：US20140007982A1
公开(公告)日：2014-01-09
申请号：US13541481
申请日：2012-07-03
Applicant: Christopher D. PREST , Matthew S. SCOTT , Stephen P. ZADESKY , Dermot J. STRATTON , Joseph C. POOLE , Richard W. HELEY
Inventor： Christopher D. PREST , Matthew S. SCOTT , Stephen P. ZADESKY , Dermot J. STRATTON , Joseph C. POOLE , Richard W. HELEY
CPC classification number: B32B15/01 , B22D19/04 , B22D19/16 , B22D25/06 , B23K15/0046 , B23K20/122 , B23K31/02 , B23K35/26 , B23K35/262 , B23K35/28 , B23K35/282 , B23K35/284 , B23K35/286 , B23K35/302 , B23K35/3033 , B23K2103/02 , B23K2103/08 , B23K2103/10 , B23K2103/12 , B23K2103/14 , B23K2103/15 , B23K2103/18 , B23K2103/26 , C22C1/002 , C22C33/003 , C22C45/001 , C22C45/003 , C22C45/02 , C22C45/10 , Y10T428/12389
Abstract: Provided in one embodiment is a method of forming a connection mechanism in or on a bulk-solidifying amorphous alloy by casting in or on, or forming with the bulk-solidifying amorphous alloy, a machinable metal. The connection mechanism can be formed by machining the machinable metal.
Abstract translation: 在一个实施方案中提供了一种在本体固化的非晶态合金中或其上浇铸连接机构的方法，该非晶合金通过在体固化非晶态合金中铸造或加工成可加工金属。 连接机构可以通过加工可加工金属形成。
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公开(公告)号：US20130321237A1
公开(公告)日：2013-12-05
申请号：US13610782
申请日：2012-09-11
Applicant: Charles B. Woodhull , David A. Pakula , Tang Y. Tan , Douglas Joseph Weber , Christopher D. Prest , Dale N. Memering , Bryan P. Kiple
Inventor： Charles B. Woodhull , David A. Pakula , Tang Y. Tan , Douglas Joseph Weber , Christopher D. Prest , Dale N. Memering , Bryan P. Kiple
IPC: H01Q1/42
CPC classification number: H05K5/04 , B23C5/00 , B23C5/1081 , B23C2220/04 , B23C2220/16 , B23C2220/20 , B23C2220/28 , B23C2220/48 , B23C2226/31 , B23C2226/315 , B23P11/00 , B23P17/00 , B23P17/02 , C25D7/00 , C25D11/02 , C25D11/022 , C25D11/12 , C25D11/246 , C25D11/34 , G03F1/38 , H01Q1/243 , H01Q1/42 , H04M1/0249 , H04M1/0254 , H04M1/11 , H05K5/02 , H05K5/0217 , H05K5/0243 , H05K5/0247 , H05K5/03 , H05K13/00 , Y10T29/47 , Y10T29/49002 , Y10T29/49826 , Y10T156/10 , Y10T156/1064 , Y10T407/1906 , Y10T409/300896 , Y10T409/303752 , Y10T409/30952
Abstract: Various components of an electronic device housing and methods for their assembly are disclosed. The housing can be formed by assembling and connecting two or more different sections together. The sections of the housing may be coupled together using one or more coupling members. The coupling members may be formed using a two-shot molding process in which the first shot forms a structural portion of the coupling members, and the second shot forms cosmetic portions of the coupling members.
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