摘要:
A structure in which blocks of random access memory, or RAM, are integrated with FPGA configurable logic blocks. Routing lines which access configurable logic blocks also access address, data, and control lines in the RAM blocks. Thus, the logic blocks of the FPGA can use these routing lines to access portions of RAM. In one embodiment, dedicated address and data lines access the RAM blocks of the present invention and are connectable to routing lines in the interconnect structure. These lines allow RAM blocks and arrays of RAM blocks to be configured long, wide, or in between, and allow logic blocks to conveniently access RAM blocks in a remote part of the chip. Access to the RAM blocks is efficient in any RAM configuration. Bidirectional buffers or pass devices segment the address and data lines at each RAM block so that a selectable number of RAM blocks can operate together as a RAM. In another embodiment, dedicated data lines are programmably connectable in a staggered arrangement so that RAM blocks can be connected over a long distance without conflict between the RAM blocks.
摘要:
The invention provides an FPGA interconnect structure preferably included in an array of identical tiles. A combination of single-length lines connecting to adjacent tiles and intermediate-length lines connecting to tiles several tiles away creates an interconnect hierarchy which allows any logic block to be connected to any other logic block, yet also allows for fast paths to both adjacent tiles and tiles some distance away. Longer interconnect lines may be included as a third level of hierarchy to permit interconnection of widely separated tiles. In a preferred embodiment, from a given tile an intermediate-length line connects to the tile three tiles away, then continues and connects to the tile six tiles away. In this embodiment, the intermediate-length line does not connect to the intervening tiles one, two, four, and five tiles away. According to a second aspect of the invention, high fanout signals can be distributed to any tile in the array. A signal on a horizontal long line traverses a row of tiles, in which it makes contact with the logic block in each tile through hex lines and single-length lines. The horizontal single-length lines connected to some horizontal hex lines can programmably drive vertical long lines. Using these programmable connections, the signal on the horizontal long line bus is transferred to the vertical long lines. From the vertical long lines, a high-fanout signal is delivered to an array of tiles.
摘要:
A six-input multiplexer is disclosed using only two transistors in the signal path from an input port to the output port. The multiplexer uses control signals that are not decoded. The multiplexer uses three control signals and requires that the control signal combinations 000 and 111 not be used. The other six control signal combinations 001, 010, 011, 100, 101, and 110 can be used to select between six input signals by placing only two transistors in the signal path, taking advantage of the fact that two of the three control signals are the same and the third is different from the other two. A compact layout results when two multiplexers use common input signals.
摘要:
Multiplier circuits that can optionally be configured as bit shifters. An exemplary multiplier includes a one-hot circuit, a multi-bit multiplexing circuit, and a multiply block. The one-hot circuit has a multi-bit input and a multi-bit output. The multiplexing circuit has first and second multi-bit inputs and a multi-bit output, with the first input of the multiplexing circuit being coupled to the output of the one-hot circuit. The multiply block has first and second multi-bit inputs and a multi-bit output, with the first input of the multiply block being coupled to the output of the multiplexing circuit. When selected by the multiplexer, the position of the single high bit in the one-hot circuit output determines the number of bits by which the multiplier output is shifted relative to the second multiplier input. When the one-hot circuit output is not selected as an input to the multiplier, the multiplier performs a multiply function.
摘要:
An embodiment of an integrated circuit (IC) is described. This embodiment of the IC includes an interposer; a first die on an interposer, where the first die generates a global signal propagated through the interposer; and a second die on the surface of the interposer and coupled to the global signal. The first die and the second die each is configured to implement a same operating state concurrently in response to the global signal.
摘要:
A wheel suspension system for a three-wheeled motorcycle or “trike” includes parallel wheels mounted on vertically pivoting suspension arms governed by hydraulic pistons. The pistons have upper liquid reservoirs that are interconnected through a valve system, which interconnects the upper reservoirs when the trike is in motion, allowing opposing vertical wheel movements when banking through turns, and prevents liquid exchange when the trike is stopped, thereby holding the motorcycle upright, Embodiments include a manual and/or automatic valve control. A threshold switching speed for an automatic controller can be factory set and/or user adjustable. The pistons can include directly interconnected lower fluid reservoirs. A shock-absorbing reservoir can allow transient vertical movement of both wheels to absorb shocks. A cover system can emulate the appearance of saddle bags and can appear to be covering only a single wheel.
摘要:
An embodiment of a method to form a hybrid integrated circuit device is described. This embodiment of the method comprises: forming a first die using a first lithography, where the first die is on a substrate; and forming a second die using a second lithography, where the second die is on the first die. The first lithography used to form the first die is a larger lithography than the second lithography used to form the second die. The first die is an IO die.
摘要:
Method and apparatus for error checking information is described. Configuration data includes data bits and parity bits. Notably, parity bits may be relocated for determining a syndrome value. Syndrome bits are determined by computing a partial syndrome value for each word serially transmitted of the configuration data, where the configuration data includes one or more data vectors. Location of each word of the configuration data is identified. It is determined whether a partial syndrome value is an initial partial syndrome value or other partial syndrome value responsive to word location. An initial partial syndrome value is stored, and subsequent partial syndrome values are cumulatively added for each word of a data vector to arrive at a syndrome value for the data vector.
摘要:
An embodiment of an integrated circuit (IC) is described. This embodiment of the IC includes an interposer; a first die on an interposer, where the first die generates a global signal propagated through the interposer; and a second die on the surface of the interposer and coupled to the global signal. The first die and the second die each is configured to implement a same operating state concurrently in response to the global signal.
摘要:
A method of modeling two IC dies using the same software model, although the two dies include physical differences. A first programmable logic device (PLD) die includes first and second portions, and is encoded to render the first portion operational and the second portion non-operational. At a boundary between the two portions, interconnect lines traversing the boundary include a first section in the first portion and a second section in the second portion. The second PLD die includes the first portion of the first PLD die, while omitting the second portion. The interconnect lines extending to the edge of the second die are coupled together in pairs. A software model for both die includes a termination model that omits the pair coupling, adds an RC load compensating for the omitted connection, and (for bidirectional interconnect lines) flags one interconnect line in each pair as being invalid for use by routing software.