公开(公告)号：US5866950A

公开(公告)日：1999-02-02

申请号：US749028

申请日：1996-11-14

申请人： Hiroshi Iwasaki ,  Hideo Aoki

发明人： Hiroshi Iwasaki ,  Hideo Aoki

IPC分类号： H01L21/56 ,  H01L21/58 ,  H01L23/31 ,  H01L23/48 ,  H01L23/52 ,  H01L29/40

CPC分类号： H01L24/28 ,  H01L21/563 ,  H01L23/3107 ,  H01L24/81 ,  H01L24/83 ,  H01L2224/16225 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/81205 ,  H01L2224/8183 ,  H01L2224/83102 ,  H01L2224/8319 ,  H01L2224/8385 ,  H01L2224/92125 ,  H01L2224/92225 ,  H01L24/48 ,  H01L24/73 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/14 ,  H01L2924/15162 ,  H01L2924/181 ,  H01L2924/30107

摘要： A semiconductor package comprises a circuit board having a wiring circuit including at least a connecting portion, the wiring circuit being formed on a first main surface of the circuit board, a semiconductor chip mounted on the first main surface of the circuit board on face-down basis, an insulation resin layer filled in a space between the semiconductor chip and the circuit board, and a flat-type external connecting terminal electrically connected to the semiconductor chip and formed and exposed to a second main surface of the circuit board.

摘要翻译： 半导体封装包括具有至少包括连接部分的布线电路的电路板，布线电路形成在电路板的第一主表面上，半导体芯片安装在电路板的第一主表面上，面朝下 基板，填充在半导体芯片和电路板之间的空间中的绝缘树脂层和电连接到半导体芯片并形成并暴露于电路板的第二主表面的平面型外部连接端子。

公开(公告)号：US5856336A

公开(公告)日：1999-01-05

申请号：US883398

申请日：1992-05-15

申请人： Yoshihiro Fujikawa ,  Mikio Suzuki ,  Hiroshi Iwasaki ,  Mitsuaki Sakashita ,  Masaki Kitahara

发明人： Yoshihiro Fujikawa ,  Mikio Suzuki ,  Hiroshi Iwasaki ,  Mitsuaki Sakashita ,  Masaki Kitahara

IPC分类号： A61K31/47 ,  A61K31/473 ,  A61P3/06 ,  A61P7/00 ,  A61P9/10 ,  C07D215/12 ,  C07D215/14 ,  C07D215/18 ,  C07D215/20 ,  C07D215/38 ,  C07D215/54 ,  C07D221/06 ,  C07D405/06 ,  C07D491/056

CPC分类号： C07D405/06 ,  C07D215/14 ,  C07D215/18 ,  C07D215/20

摘要： A compound of the formula ##STR1## Z=--CH(OH)--CH.sub.2 --CH(OH)--CH.sub.2 --COO.1/2Ca have HMG--CoA inhibiting effects, making them useful as inhibitors of cholesterol biosynthesis. The compound may be prepared as a pharmaceutical for reducing hyperlipidemia, hyperlipoproteinemia or atherosclerosis.

摘要翻译： 具有下式的化合物[A] Z = -CH（OH）-CH 2 -CH（OH）-CH 2 COO + E，fra 1/2 + EE Ca具有HMG-CoA抑制作用，使其有用 作为胆固醇生物合成的抑制剂。 该化合物可以制备为用于降低高脂血症，高脂蛋白血症或动脉粥样硬化的药物。

公开(公告)号：US5822190A

公开(公告)日：1998-10-13

申请号：US871967

申请日：1997-06-10

申请人： Hiroshi Iwasaki

发明人： Hiroshi Iwasaki

IPC分类号： B42D15/10 ,  G06K19/077 ,  H01L21/56 ,  H01L23/28 ,  H05K7/02

CPC分类号： G06K19/07743 ,  H01L2224/16245 ,  H01L2224/48227 ,  H01L2224/4826 ,  H01L2924/01079 ,  H01L2924/1815 ,  Y10T29/49121

摘要： A card type memory device comprises a semiconductor chip having a nonvolatile semiconductor memory formed with external connection terminals and a metal frame comprising bed sections and external terminal electrode sections with a step section formed between the bed section and the external terminal electrode section, the bed sections of the metal frame being electrically connected to the external terminal electrode sections of the semiconductor chip. At least one surface and outer peripheral surface of the semiconductor chip are resin sealed such that at least electrode surfaces of the external terminal electrode sections of the metal frame are exposed substantially flush with a resin-sealed body surface. By doing so, a semiconductor package is formed. The semiconductor package is buried in a recess in a card type base board such that the electrode surfaces of the external terminal electrode sections of the metal frame in the semiconductor package is buried substantially flush with an external surface.

摘要翻译： 卡型存储装置包括具有形成有外部连接端子的非易失性半导体存储器和包括床部分的金属框架和外部端子电极部分的半导体芯片，在床部分和外部端子电极部分之间形成有台阶部分，床部分 的金属框架电连接到半导体芯片的外部端子电极部分。 半导体芯片的至少一个表面和外周表面被树脂密封，使得金属框架的外部端子电极部分的至少电极表面暴露于与树脂密封体表面基本上齐平的位置。 通过这样做，形成半导体封装。 半导体封装被埋在卡型基板的凹部中，使得半导体封装中的金属框架的外部端子电极部分的电极表面被大致与外表面齐平地埋设。

公开(公告)号：US5814890A

公开(公告)日：1998-09-29

申请号：US396234

申请日：1995-03-01

申请人： Hiroshi Iwasaki

发明人： Hiroshi Iwasaki

IPC分类号： H01L23/12 ,  H01L21/56 ,  H01L23/498 ,  H01L23/48

CPC分类号： H01L23/49827 ,  H01L21/563 ,  H01L23/49811 ,  H01L23/49838 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/73257 ,  H01L2224/73265 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/181

摘要： A semiconductor package comprises a resin type board or a ceramic type board having a wiring circuit including a connecting portion on a first main surface, a semiconductor chip mounted on the first main surface of the board in face-down relation, a sealing resin layer filled between the lower surface of the semiconductor chip and the upper surface of the board, and flat type external connecting terminals electrically connected to the semiconductor chip and formed on a second main surface of the board with constant pitches in a lattice shape. A fabrication method for fabricating a semiconductor package comprises the steps of aligning connecting bumps of a board with gold bumps formed at an electrode terminal portion of a semiconductor chip so as to place the semiconductor chip on the board, the board having a wiring circuit including connecting pads composed of gold being and flat type external connecting terminals, the wiring circuit being formed on a first main surface of the board, the flat type external connecting terminals being formed on a second main surface of the board, pressuring the aligned board and semiconductor chip so as to contact the connecting portions thereof, filling a sealing resin in a space formed between the upper surface of the board and the lower surface of the semiconductor chip, and curing the filled resin while pressuring the resultant structure so as to prevent the connecting portions from dislocating.

摘要翻译： 半导体封装包括树脂型板或具有布线电路的陶瓷型板，该布线电路包括在第一主表面上的连接部分，以面朝下的关系安装在板的第一主表面上的半导体芯片，填充了密封树脂层 在半导体芯片的下表面和板的上表面之间，以及平面型外部连接端子，其电连接到半导体芯片并以恒定的间距形成在板的第二主表面上。 一种用于制造半导体封装的制造方法，包括以下步骤：将板的连接凸块与形成在半导体芯片的电极端子部分处的金凸块对准，以将半导体芯片放置在板上，该板具有布线电路，其包括连接 由金构成的焊盘和扁平型外部连接端子，布线电路形成在板​​的第一主表面上，扁平型外部连接端子形成在板的第二主表面上，对准板和半导体芯片 与其连接部分接触，将密封树脂填充在形成在板的上表面和半导体芯片的下表面之间的空间中，并且在加压所得结构的同时固化填充的树脂，以防止连接部分 脱臼

公开(公告)号：US5752352A

公开(公告)日：1998-05-19

申请号：US671944

申请日：1996-06-28

申请人： Shinichi Goto ,  Masao Kobayashi ,  Hiroshi Iwasaki ,  Sadao Nada

发明人： Shinichi Goto ,  Masao Kobayashi ,  Hiroshi Iwasaki ,  Sadao Nada

IPC分类号： B60J1/02 ,  B60J10/00 ,  B60J10/02 ,  E06B3/00

CPC分类号： B60J10/24 ,  B60J10/16 ,  B60J10/70

摘要： An automobile window molding includes an elongated leg having an embedded core member, an outer head portion having a contact portion, an inner support portion, a seal lip and a position control portion. The molding is suited to position a window in a supporting window frame. The head portion is integrally formed at an upper end of the leg and extends over a portion of the front widow glass. The contact portion is defined by a projection positioned between the head portion and the inner support portion so as to touch the end surface of the front window glass. The inner support portion is formed at a lower end of the leg and is configured to touch an inner surface of the front window glass. The perimeter of the front window glass is held between the head portion and the inner support portion. At least one seal lip is formed on the leg so as to contact a window frame. The position control portion is preferably bent towards the window glass, such that the projection is disposed to be closer to the inner support portion than to the core member.

摘要翻译： 汽车窗口模制件包括具有嵌入式芯构件的细长腿部，具有接触部分的外部头部部分，内部支撑部分，密封唇缘和位置控制部分。 模制件适于将窗口定位在支撑窗框中。 头部一体地形成在腿部的上端，并延伸到前遗体玻璃的一部分上。 接触部分由位于头部和内部支撑部之间的突起限定，以便接触前窗玻璃的端面。 内支撑部分形成在腿的下端，并被构造成接触前窗玻璃的内表面。 前窗玻璃的周边保持在头部和内支撑部之间。 在腿上形成至少一个密封唇以便接触窗框。 位置控制部分优选地朝向窗玻璃弯曲，使得突出部布置成比与芯构件更靠近内支撑部。

公开(公告)号：US5719439A

公开(公告)日：1998-02-17

申请号：US537396

申请日：1995-10-02

申请人： Hiroshi Iwasaki ,  Hideo Aoki

发明人： Hiroshi Iwasaki ,  Hideo Aoki

IPC分类号： H01L21/60 ,  H01L23/31 ,  H01L23/485 ,  H01L23/525 ,  H01L23/528

CPC分类号： H01L24/81 ,  H01L23/3171 ,  H01L23/525 ,  H01L23/5283 ,  H01L24/11 ,  H01L24/13 ,  H01L2224/0401 ,  H01L2224/05124 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05164 ,  H01L2224/05166 ,  H01L2224/05554 ,  H01L2224/05559 ,  H01L2224/05572 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/11 ,  H01L2224/1147 ,  H01L2224/13 ,  H01L2224/13007 ,  H01L2224/13023 ,  H01L2224/13099 ,  H01L2224/81801 ,  H01L2224/94 ,  H01L2924/0002 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2224/05552 ,  H01L2924/00 ,  H01L2224/03 ,  H01L2924/00014

摘要： A semiconductor chip having a semiconductor substrate, a plurality of pads formed above the semiconductor substrate a first passivating film formed over an entire surface of the semiconductor substrate, and having openings above the pads the surface of the first passivating film being flat, a plurality of interconnection lines formed on the surface of the first passivating film, a second passivating film formed over the entire surface of the first passivating film and having through holes, the through holes being arranged in the form of an array, the surface of the second passivating film being flat, a plurality of contacts for connection to external leads each of the contacts being formed within and above a respective one of the through holes, the contacts being arranged in the form of an array.

公开(公告)号：US5710458A

公开(公告)日：1998-01-20

申请号：US554104

申请日：1995-11-06

申请人： Hiroshi Iwasaki

发明人： Hiroshi Iwasaki

IPC分类号： H01L23/12 ,  G06K19/077 ,  H01L23/498 ,  H01Q1/22 ,  H01Q1/38 ,  H01Q7/00 ,  H01Q11/12 ,  H01L23/48

CPC分类号： G06K19/07749 ,  G06K19/0775 ,  G06K19/07779 ,  G06K19/07783 ,  G06K19/07784 ,  H01L23/49855 ,  H01Q1/22 ,  H01Q1/2225 ,  H01Q1/38 ,  H01Q7/00 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204

摘要： A semiconductor package has high reliability and a simple structure and configuration, can be removed as a function section performing the main data processing, substantially improves retainability and portability, and is connected to external equipment without the need of contact. The semiconductor package comprises a circuit board on one main side of which has a region in which IC chips can be mounted, ac IC chip mounted in said region on the surface of the circuit board, a shield resin layer that buries or covers at least part of the mounted IC chip, at least one loop-like antenna pattern integrally formed in a region of the main side other than the region in which the IC chip is mounted for transmitting and receiving signals without the need of contact, and an antenna pattern for power induction located independently of said antenna pattern and inducing power electromagnetically. According to this semiconductor package, the antenna pattern for transmission and reception is also used to cause electromagnetic induction, and the induced power is used to drive the IC chip. This allows drive power batteries or external power connection terminals to be omitted, thereby substantially simplifying the handling of this package. Since this also obviates the need of the space for installing these power batteries and external power connection terminals, the package can be more compact.

摘要翻译： 半导体封装具有高可靠性和简单的结构和配置，可以作为执行主数据处理的功能部件被去除，大大提高了保持性和便携性，并且连接到外部设备而不需要接触。 该半导体封装包括一个主电路板上具有可安装IC芯片的区域的电路板，安装在电路板表面上的所述区域中的交流IC芯片，至少部分地覆盖或覆盖部分的屏蔽树脂层 安装的IC芯片的至少一个环状天线图案，其一体地形成在除了安装IC芯片的区域之外的主侧的区域中，以不需要接触的方式发送和接收信号，以及天线图案 功率感应器独立于所述天线图案并且以电磁感应功率。 根据该半导体封装，也用于发送和接收的天线方向图来产生电磁感应，并且使用感应电力来驱动IC芯片。 这允许省略驱动动力电池或外部电源连接端子，从而大大简化了该包装的处理。 由于这也避免了安装这些动力电池和外部电源连接端子的空间，因此该封装可以更紧凑。

公开(公告)号：USD369156S

公开(公告)日：1996-04-23

申请号：US36252

申请日：1995-03-16

申请人： Jun Ohmori ,  Hiroshi Iwasaki

设计人： Jun Ohmori ,  Hiroshi Iwasaki

公开(公告)号：US5408808A

公开(公告)日：1995-04-25

申请号：US102196

申请日：1993-08-05

申请人： Tadao Masuda ,  Katsumi Hayakawa ,  Masahiro Tsukuda ,  Hiroshi Iwasaki

发明人： Tadao Masuda ,  Katsumi Hayakawa ,  Masahiro Tsukuda ,  Hiroshi Iwasaki

IPC分类号： B65B11/04 ,  B65B11/00 ,  B65B53/00

CPC分类号： B65B11/045

摘要： An automatic stretch-wrapping apparatus for wrapping a load, including empty PET bottles, with a stretchable film. The apparatus includes a turntable for placing the load thereon, and the stretchable film is supplied from a roll of stretchable film in a vertical position via film tensioning rollers to a gripper device. The gripper device is mounted on the turntable for gripping the leading end of the film and can rotate not only with the turntable but also relative to the turntable. Also, a swing arm device is arranged for movement toward and away from the gripper device to cooperate with the gripper device and includes pusher blades for pushing the film toward the gripping fingers of the gripper device, a heatsealer, and a cutter. It is possible to automatically wrap the load by the film in only one turn thereof.

摘要翻译： 一种自动拉伸包装设备，用于将包含空的PET瓶的负载包裹在可拉伸的薄膜中。 该装置包括用于将负载放置在其上的转台，并且可拉伸膜通过薄膜张紧辊从垂直位置从可拉伸薄膜卷供给到夹持装置。 夹持装置安装在转盘上，用于夹持胶片的前端，并且可以不仅与转台旋转，而且可相对于转台旋转。 此外，摆臂装置被布置成朝向和远离夹持装置移动以与夹持装置协作，并且包括用于将薄膜推向夹持装置的夹持指状物，热封机和切割器的推动器叶片。 可以在仅一匝的时候自动地将薄膜包裹在薄膜上。

公开(公告)号：US5347759A

公开(公告)日：1994-09-20

申请号：US40359

申请日：1993-03-30

申请人： Masao Kobayashi ,  Koichi Ogiso ,  Shinichi Goto ,  Haruyasu Mizutani ,  Masaomi Goto ,  Hiroshi Iwasaki

发明人： Masao Kobayashi ,  Koichi Ogiso ,  Shinichi Goto ,  Haruyasu Mizutani ,  Masaomi Goto ,  Hiroshi Iwasaki

IPC分类号： B60J10/00 ,  B60J10/08 ,  E06B7/16

CPC分类号： B60J10/86 ,  B60J10/15

摘要： A door lower molding that has a main body molded of a synthetic resin by extrusion. The main body is fixed along a lower end of a door of a vehicle. The main body has a seal lip extended thereon, which closely contacts a rocker molding of the vehicle body when the door is closed. A core made of a synthetic resin is embedded in the main body. The seal lip may be covered on its outer side with a skin which has a flaw resistance characteristic and on its inner side with a sealing layer including silicone to prevent freeze-sticking to the vehicle body.

摘要翻译： 具有通过挤出由合成树脂模制的主体的门下模制品。 主体沿着车门的下端固定。 主体具有延伸在其上的密封唇，当门关闭时，该密封唇与车身的摇杆模制紧密接触。 由合成树脂制成的芯子嵌入主体。 密封唇缘可以在其外侧被覆有具有防裂特性的皮肤，并且在其内侧上具有包括硅酮的密封层以防止冻结到车体。