公开(公告)号：US20240317971A1

公开(公告)日：2024-09-26

申请号：US18735727

申请日：2024-06-06

Applicant: Milliken & Company

Inventor： Darin Dotson ,  Walter Forrister ,  Xiaoyou XU ,  Hua Sun

IPC: C08K5/5317

CPC classification number: C08K5/5317 ,  C08K2201/006

Abstract: A polymer composition comprises a polyethylene polymer and a salt of a branched alkyl phosphonic acid. A polyethylene film having improved barrier to water vapor and oxygen comprises a high-density polyethylene polymer having a density of about 930 kg/m3 to about 980 kg/m3 and a salt of a branched alkyl phosphonic acid.

公开(公告)号：US20240309172A1

公开(公告)日：2024-09-19

申请号：US18681250

申请日：2022-08-05

Applicant: BIRLA CARBON U.S.A.

Inventor： Ranjan K. Kamat ,  Douglas Barr ,  Kenneth Fritsch ,  Daniel Corella

IPC: C08K3/04 ,  C08J3/22 ,  C09D7/40 ,  C09D7/61

CPC classification number: C08K3/041 ,  C08J3/226 ,  C09D7/61 ,  C09D7/70 ,  C08K2201/003 ,  C08K2201/004 ,  C08K2201/006 ,  C08K2201/011 ,  C08K2201/014

Abstract: The present disclosure relates to masterbatch compositions comprising a base polymer and carbon black and carbon nanotubes as filler that can be used to prepare an article with improved electrical or mechanical performance relative to a masterbatch having carbon black filler alone. The masterbatch compositions can also be used to prepared colored articles without sacrificing electrical or mechanical performance as is typically seen with highly-loaded carbon black-filled compositions.

公开(公告)号：US12091546B2

公开(公告)日：2024-09-17

申请号：US17043190

申请日：2019-03-15

Applicant: DOW SILICONES CORPORATION

Inventor： Tatiana Dimitrova ,  Anne-Marie Van Stiphoudt

IPC: C08L83/04 ,  C09J183/04

CPC classification number: C08L83/04 ,  C09J183/04 ,  C08K2201/006

Abstract: A condensation cure organosiloxane composition is disclosed. The composition may be used as an electrically insulating sealant and/or adhesive. The composition is a silicone elastomer composition comprising: (a) a polydiorganosiloxane having at least two —OH or hydrolysable groups per molecule; (b) a cross-linker which will cross-link polydiorganosiloxane (a); (c) a filler component comprising (i) a maximum of 25% by weight of the composition of calcium carbonate and/or silica, and (ii) an amount of one or more fibrous fillers selected from mineral fibers, bulk fibers, refractory fibers, basalt fibers, or mixtures thereof; (d) a condensation curing catalyst; and optionally (e) one or more additives. Upon cure, the composition provides a silicone elastomer having a volume resistivity which is ≥2×1015 Ω·cm.

公开(公告)号：US20240304356A1

公开(公告)日：2024-09-12

申请号：US18275402

申请日：2022-02-02

Applicant: NEXANS

Inventor： Christelle MAZEL ,  Gabriele PEREGO ,  Daphné MERLE ,  Claire GRANGER

IPC: H01B3/44 ,  C08K5/01 ,  C08K7/00 ,  C08K13/02 ,  H01B3/22 ,  H01B7/42

CPC classification number: H01B3/441 ,  C08K5/01 ,  C08K7/00 ,  C08K13/02 ,  H01B3/22 ,  H01B7/428 ,  C08K2201/001 ,  C08K2201/005 ,  C08K2201/006

Abstract: The invention relates to a cable comprising at least one electrically insulating layer obtained from a polymer composition comprising at least one thermoplastic polymer material based on polypropylene, at least one dielectric liquid, at least a first thermally conductive inorganic filler having a morphology M1 and at least a second thermally conductive inorganic filler having a morphology M2 different from M1.

公开(公告)号：US20240301176A1

公开(公告)日：2024-09-12

申请号：US18268741

申请日：2021-12-14

Applicant: ASAHI KASEI KABUSHIKI KAISHA

Inventor： Kenzo ONIZUKA ,  Naoya KAMIMURA ,  Masanori YOSHIDA

IPC: C08K9/10 ,  C08K3/013 ,  C08K5/05 ,  C09J163/00 ,  H01L23/498 ,  H05K3/46

CPC classification number: C08K9/10 ,  C08K3/013 ,  C08K5/05 ,  C09J163/00 ,  C08K2201/003 ,  C08K2201/006 ,  H01L23/49894 ,  H05K3/4661 ,  H05K2203/068 ,  H05K2203/107 ,  H05K2203/1461

Abstract: An epoxy resin composition comprising an epoxy resin (A) and a latent curing agent (B), wherein the latent curing agent (B) is solid at 25° C.

公开(公告)号：US20240293955A1

公开(公告)日：2024-09-05

申请号：US18661834

申请日：2024-05-13

Applicant: KNAUF INSULATION

Inventor： Richard HAND ,  Liam JOHNSON

IPC: B27N3/00 ,  B27D1/04 ,  B27N3/02 ,  C08K3/36

CPC classification number: B27N3/002 ,  B27D1/04 ,  B27N3/02 ,  C08K3/36 ,  C08K2201/005 ,  C08K2201/006 ,  C08K2201/011

Abstract: A sugar-based binder composition for manufacturing a composite product, notably a wood board, comprises at least one further particulate additive selected from the group consisting of:



particulate additive(s) having a BET specific surface area which is ≥50 m2/g;
amorphous silica particles;
fumed silica particles; and
untreated fumed silica particles.

公开(公告)号：US20240271001A1

公开(公告)日：2024-08-15

申请号：US18336943

申请日：2023-06-16

Applicant: BenQ Materials Corporation

Inventor： Tsun-Sheng TAO ,  Kuo-Hsuan YU

IPC: C09D175/06 ,  C08K7/18

CPC classification number: C09D175/06 ,  C08K7/18 ,  C08K2201/005 ,  C08K2201/006

Abstract: The present invention is to provide an anti-glare film. The anti-glare film comprises a transparent substrate and an anti-glare layer formed on a surface of the transparent substrate, wherein the anti-glare layer comprises an acrylate binder resin and a plurality of silica microparticles, wherein the particle size of the silica microparticles is ranging between 2 μm and 6 μm and the BET specific surface area is not more than 250 m2/g, and the amount of the silica microparticles is ranging between 3 to 20 parts by weight per hundred parts by weight of the acrylate binder resin. The anti-glare film provides an enhanced abrasion-resistance.

公开(公告)号：US20240270930A1

公开(公告)日：2024-08-15

申请号：US18567068

申请日：2022-06-07

Applicant: HENKEL IP & HOLDING GMBH

Inventor： Kevin White ,  Yuqiang Qian

IPC: C08K3/22 ,  C08G65/336 ,  C08L101/10

CPC classification number: C08K3/22 ,  C08G65/336 ,  C08L101/10 ,  C08K2003/2227 ,  C08K2201/001 ,  C08K2201/005 ,  C08K2201/006 ,  C08L2203/20

Abstract: A thermally conductive composition includes a polymer formed from a condensation-curable silyl-modified resin and particulate alumina filler having a high total specific surface area. The composition exhibits a thermal conductivity of at least 1 W/m*K. and is curable without added environmental moisture and with reduced catalyst loading.

公开(公告)号：US20240266542A1

公开(公告)日：2024-08-08

申请号：US18690925

申请日：2023-04-20

Applicant: LG Energy Solution, Ltd.

Inventor： Seong-Wook Kang ,  Jae-Sung Han ,  Sang-Min Kwak ,  Kyung-Hwan Yoon ,  Dong-Oh Shin ,  Ki-Seok Lee ,  Kwang-Ho Yoo ,  Nam-Jeong Lee

IPC: H01M4/62 ,  C08J3/22 ,  C08K3/04 ,  C08L27/16 ,  H01M4/02 ,  H01M4/04 ,  H01M4/139

CPC classification number: H01M4/623 ,  C08J3/226 ,  C08K3/041 ,  C08L27/16 ,  H01M4/0404 ,  H01M4/139 ,  H01M4/625 ,  C08J2327/16 ,  C08J2427/18 ,  C08K2201/001 ,  C08K2201/003 ,  C08K2201/006 ,  C08K2201/011 ,  C08L2205/025 ,  C08L2310/00 ,  H01M2004/021

Abstract: The present disclosure relates to a conductive material master batch for use in an electrode and an electrode obtained by using the same. The electrode obtained by using the conductive material master batch has an electrode resistance of 55 ohm·cm or less.

公开(公告)号：US20240262985A1

公开(公告)日：2024-08-08

申请号：US18628842

申请日：2024-04-08

Applicant: Sumitomo Riko Company Limited

Inventor： Yuto Watanabe ,  Seiji Kasai ,  Toyohisa Tohyama

IPC: C08K5/548 ,  C08K3/04 ,  C08K3/36 ,  C08K9/06 ,  F16F1/36

CPC classification number: C08K5/548 ,  C08K3/04 ,  C08K3/36 ,  C08K9/06 ,  F16F1/3605 ,  C08K2201/005 ,  C08K2201/006 ,  F16F2224/025

Abstract: Provided are a vibration-damping rubber composition and a vibration-damping rubber member which have excellent durability, can attain a reduction in dynamic-to-static modulus ratio, and can exhibit excellent scorch resistance even in wet-heat environments, etc. This vibration-damping rubber composition comprises a diene-based rubber composition comprising the following (A) to (C). (A) A diene-based rubber. (B) Silica having a silanol group density of four groups per nm2 or greater, a BET specific surface area of 13-60 m2/g, and an average particle diameter of 3-10 μm. (C) A silane coupling agent having a sulfide group and a mercapto group in the molecule.