公开(公告)号：US07657974B2

公开(公告)日：2010-02-09

申请号：US11511264

申请日：2006-08-29

Applicant: Yu-Cheng Huang

Inventor： Yu-Cheng Huang

IPC: E05B1/00

CPC classification number: H01H19/11 ,  B60K37/06 ,  B60K2350/102 ,  G05G1/08 ,  G05G5/065 ,  Y10T16/506 ,  Y10T16/52

Abstract: A knob structure includes a holder, a steel ball, an elastic metallic piece, a swiveling element and a connecting element. The holder has at least one through hole. The steel ball is slidably placed inside the through hole. The elastic metallic piece and the swiveling element reside at either sides of the holder. The elastic metallic piece slidably lies against the steel ball. The swiveling element has a sliding portion which has a plurality of notches spaced at intervals. The sliding portion slidably lies against the steel ball so that the steel ball slides into or out of the notches by turning the swiveling element. The steel ball has a smooth surface and is in point-to-point contact with the sliding portion and with the elastic metallic piece. Therefore, frictions therebetween are so small that no scraps generate due to the frictional operation.

Abstract translation: 旋钮结构包括支架，钢球，弹性金属件，旋转元件和连接元件。 支架至少有一个通孔。 钢球可滑动地放置在通孔内。 弹性金属片和旋转元件位于支架的两侧。 弹性金属片可滑动地抵靠钢球。 旋转元件具有滑动部分，该滑动部分具有间隔开的多个凹口。 滑动部分可滑动地抵靠钢球，使得钢球通过转动旋转元件滑入或离开凹口。 钢球具有光滑的表面，并且与滑动部分和弹性金属片点对点接触。 因此，它们之间的摩擦力很小，由于摩擦操作而不产生废料。

公开(公告)号：US20100009476A1

公开(公告)日：2010-01-14

申请号：US12501333

申请日：2009-07-10

Applicant: Po Min TU ,  Shih Cheng HUANG ,  Shih Hsiung CHAN

Inventor： Po Min TU ,  Shih Cheng HUANG ,  Shih Hsiung CHAN

IPC: H01L33/00 ,  H01L21/205

CPC classification number: H01L21/02639 ,  H01L21/0254 ,  H01L21/02653 ,  H01L33/0079

Abstract: A method of removing a substrate structure is described. A plurality of pillars is formed on a substrate by using a photolithography etching process. A group III nitride semiconductor layer is grown on the plurality of pillars. The plurality of pillars is etched to separate the group III nitride semiconductor layer from the substrate by using a chemical etching process.

Abstract translation: 描述了去除衬底结构的方法。 通过使用光刻蚀刻工艺在基板上形成多个柱。 在所述多个支柱上生长III族氮化物半导体层。 通过使用化学蚀刻工艺蚀刻多个柱以将III族氮化物半导体层与衬底分离。

公开(公告)号：US20090321780A1

公开(公告)日：2009-12-31

申请号：US12491806

申请日：2009-06-25

Applicant: SHIH CHENG HUANG ,  PO MIN TU ,  YING CHAO YEH ,  WEN YU LIN ,  PENG YI WU ,  CHIH PENG HSU ,  SHIH HSIUNG CHAN

Inventor： SHIH CHENG HUANG ,  PO MIN TU ,  YING CHAO YEH ,  WEN YU LIN ,  PENG YI WU ,  CHIH PENG HSU ,  SHIH HSIUNG CHAN

IPC: H01L33/00

CPC classification number: H01L33/32 ,  H01L33/14

Abstract: A gallium nitride-based light emitting device with a roughened surface is described. The light emitting device comprises a substrate, a buffer layer grown on the substrate, an n-type III-nitride semiconductor layer grown on the buffer layer, a III-nitride semiconductor active layer grown on the n-type III-nitride semiconductor layer, a first p-type III-nitride semiconductor layer grown on the III-nitride semiconductor active layer, a heavily doped p-type III semiconductor layer grown on the first p-type III-nitride semiconductor, and a roughened second p-type III-nitride semiconductor layer grown on the heavily doped p-type III semiconductor layer.

Abstract translation: 描述了具有粗糙表面的氮化镓基发光器件。 发光器件包括衬底，在衬底上生长的缓冲层，在缓冲层上生长的n型III族氮化物半导体层，在n型III族氮化物半导体层上生长的III族氮化物半导体有源层， 在III族氮化物半导体有源层上生长的第一p型III族氮化物半导体层，在第一p型III族氮化物半导体上生长的重掺杂p型III半导体层和粗糙化的第二p型III- 在重掺杂的p型III半导体层上生长的氮化物半导体层。

公开(公告)号：US20090279262A1

公开(公告)日：2009-11-12

申请号：US12118839

申请日：2008-05-12

Applicant: Meng-Cheng HUANG ,  Cheng-Tu Wang

Inventor： Meng-Cheng HUANG ,  Cheng-Tu Wang

IPC: H05K7/20

CPC classification number: H01L23/427 ,  G06F1/203 ,  G06F2200/203 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A heat dissipating structure for a portable electronic device which includes a heat generating electronic member. The heat dissipating structure includes a base, a first heat pipe, a heat conducting sleeve, and a second heat pipe. The base is mounted on the heat generating electronic member. The base includes a through groove defined therein. One end of the first heat pipe is received in the through groove. The heat conducting sleeve includes a through hole defined therein. The through hole is configured for pivotably connecting the other end of the first heat pipe. One end of the coaxially joining with the first heating pipe in the heat conducting sleeve. The base is configured for conducting heat generated by the heat generating electronic member to the first heat pipe. It is advantageous that the heat dissipating structured can be mounted in limited space.

Abstract translation: 一种用于便携式电子设备的散热结构，其包括发热电子部件。 散热结构包括基座，第一热管，导热套和第二热管。 基座安装在发热电子部件上。 底座包括限定在其中的通槽。 第一热管的一端容纳在通槽中。 导热套管包括限定在其中的通孔。 通孔构造成可枢转地连接第一热管的另一端。 与导热套管中的第一加热管同轴连接的一端。 基座构造成将由发热电子部件产生的热量导向第一热管。 有利的是，散热结构可以在有限的空间内安装。

公开(公告)号：USD603766S1

公开(公告)日：2009-11-10

申请号：US29304183

申请日：2008-02-26

Applicant: Tan-Cheng Huang

Designer： Tan-Cheng Huang

公开(公告)号：US07614888B2

公开(公告)日：2009-11-10

申请号：US12237052

申请日：2008-09-24

Applicant: Ho-Ming Tong ,  Shin-Hua Chao ,  Ming-Chiang Lee ,  Tai-Yuan Huang ,  Chao-Yuan Liu ,  Yung-Cheng Huang ,  Teck-Chong Lee ,  Jen-Chieh Kao ,  Jau-Shoung Chen

Inventor： Ho-Ming Tong ,  Shin-Hua Chao ,  Ming-Chiang Lee ,  Tai-Yuan Huang ,  Chao-Yuan Liu ,  Yung-Cheng Huang ,  Teck-Chong Lee ,  Jen-Chieh Kao ,  Jau-Shoung Chen

IPC: H01L21/00

CPC classification number: H01L21/561 ,  H01L21/4853 ,  H01L21/568 ,  H01L23/3128 ,  H01L23/3135 ,  H01L24/81 ,  H01L24/97 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/92125 ,  H01L2224/97 ,  H01L2924/01023 ,  H01L2924/01033 ,  H01L2924/15311 ,  H01L2224/81 ,  H01L2224/83 ,  H01L2924/00

Abstract: A flip chip package process is provided. First, a substrate strip including at least one substrate is provided. Next, at least one chip is disposed on the substrate, and the chip is electrically connected to the substrate. Then, a stencil having at least one opening and an air slot hole is disposed on an upper surface of the substrate strip, an air gap is formed between the stencil and the substrate strip, the air gap connects the opening and the air slot hole, and the chip is located in the opening. Finally, a liquid compound is formed into the opening of the stencil to encapsulate the chip, and a vacuum process is performed through the air slot hole and the air gap, so as to prevent the air inside the opening from being encapsulated by the liquid compound to become voids.

Abstract translation: 提供了一种倒装芯片封装工艺。 首先，提供包括至少一个基板的基板条。 接下来，在基板上设置至少一个芯片，并且芯片与基板电连接。 然后，具有至少一个开口和空气狭缝孔的模板设置在基板条的上表面上，在模板和基板条之间形成气隙，气隙连接开口和空气槽孔， 芯片位于开口处。 最后，将液体化合物形成在模板的开口中以封装芯片，并且通过空气槽孔和气隙进行真空处理，以防止开口内的空气被液体化合物包封 变成空洞。

公开(公告)号：US20090267911A1

公开(公告)日：2009-10-29

申请号：US12408804

申请日：2009-03-23

Applicant: Yu-Cheng Huang ,  Tzu-Chih Lin

Inventor： Yu-Cheng Huang ,  Tzu-Chih Lin

IPC: G06F3/041

CPC classification number: G06F3/041

Abstract: The present invention discloses a touch screen comprising a flexible print circuit board, an electrically conducting layer, and a flexible control board. The flexible print circuit board has a functional plane, and the functional plane comprises a plurality of electrically conducting areas. Each of the electrically conducting areas is capable of transmitting a corresponding signal when conducted. The electrically conducting layer is disposed on the functional plane of the flexible print circuit board. The flexible control board covers on the conducting layer and comprises a plurality of pressing areas, wherein each of the pressing areas corresponds to one of the conducting areas. By pressing any of the pressing areas, the corresponding electrically conducting area on the flexible print circuit board is conducted, so the conducted electrically conducting area transmits the corresponding signal.

Abstract translation: 本发明公开了一种包括柔性印刷电路板，导电层和柔性控制板的触摸屏。 柔性印刷电路板具有功能平面，功能平面包括多个导电区域。 每个导电区域能够在传导时传输相应的信号。 导电层设置在柔性印刷电路板的功能平面上。 柔性控制板覆盖在导电层上并且包括多个按压区域，其中每个按压区域对应于一个导电区域。 通过按压任何按压区域，柔性印刷电路板上的相应的导电区域被传导，因此传导的导电区域传输相应的信号。

公开(公告)号：US20090267097A1

公开(公告)日：2009-10-29

申请号：US12426010

申请日：2009-04-17

Applicant: PO MIN TU ,  SHIH CHENG HUANG ,  WEN YU LIN ,  CHIH PENG HSU ,  SHIH HSIUNG CHAN

Inventor： PO MIN TU ,  SHIH CHENG HUANG ,  WEN YU LIN ,  CHIH PENG HSU ,  SHIH HSIUNG CHAN

IPC: H01L33/00 ,  H01L21/20

CPC classification number: H01L21/0237 ,  H01L21/02458 ,  H01L21/0254 ,  H01L21/02639 ,  H01L21/0265 ,  H01L33/007

Abstract: A method of fabricating a photoelectric device of Group III nitride semiconductor comprises the steps of: forming a first Group III nitride semiconductor layer on a surface of an original substrate; forming a patterned epitaxial-blocking layer on the first Group III nitride semiconductor layer; forming a second Group III nitride semiconductor layer on the epitaxial-blocking layer and the first Group III nitride semiconductor layer not covered by the epitaxial-blocking layer and then removing the epitaxial-blocking layer; forming a third Group III nitride semiconductor layer on the second Group III nitride semiconductor layer; depositing or adhering a conductive layer on the third Group III nitride semiconductor layer; and releasing a combination of the third Group III nitride semiconductor layer and the conductive layer apart from the second Group III nitride semiconductor layer.

Abstract translation: 制造III族氮化物半导体的光电器件的方法包括以下步骤：在原始衬底的表面上形成第一III族氮化物半导体层; 在所述第一III族氮化物半导体层上形成图案化的外延阻挡层; 在所述外延阻挡层上形成第二III族氮化物半导体层，在所述第二III族氮化物半导体层上未被所述外延阻挡层覆盖，然后除去所述外延阻挡层; 在所述第二III族氮化物半导体层上形成第三III族氮化物半导体层; 在第三III族氮化物半导体层上沉积或粘附导电层; 以及释放所述第三III族氮化物半导体层和与所述第二III族氮化物半导体层分离的所述导电层的组合。

公开(公告)号：US20090245135A1

公开(公告)日：2009-10-01

申请号：US12060655

申请日：2008-04-01

Applicant: Hung-Cheng Huang ,  Ming-Che Yu ,  Tomonori Hirai

Inventor： Hung-Cheng Huang ,  Ming-Che Yu ,  Tomonori Hirai

IPC: G01R31/08

CPC classification number: H04L49/45 ,  H04L49/352 ,  H04L49/358 ,  H04L49/40

Abstract: A network switch fabric is provided for a clustering system to facilitate flexibility of network-related interconnection selection and system scalability. The network switch fabric includes replaceable network switch(s) and network interface(s) selectively configured on a base board. Multiple types of interconnection protocols with similar characteristics will be able to implement on a common infrastructure of network switch fabric. A pass through card operating as a network interface is also applicable on the network switch fabric to directly connect with an external network. The pass through card allows the network switch fabric supporting the clustering system to be scalable, thereby capable of supporting a large-scale cluster computing.

Abstract translation: 为集群系统提供网络交换结构，以促进网络相关互连选择和系统可扩展性的灵活性。 网络交换结构包括可选的网络交换机和选择性地配置在基板上的网络接口。 具有相似特性的多种类型的互连协议将能够在网络交换结构的公共基础设施上实现。 通过作为网络接口的卡通过网络交换结构也可以直接与外部网络连接。 通过卡允许支持集群系统的网络交换机架构可扩展，从而支持大规模集群计算。

公开(公告)号：US20090231221A1

公开(公告)日：2009-09-17

申请号：US11908357

申请日：2005-12-19

Applicant: Kao-Cheng Huang ,  Zhaocheng Wang ,  Vladimir Nikolajevic

Inventor： Kao-Cheng Huang ,  Zhaocheng Wang ,  Vladimir Nikolajevic

IPC: H01Q1/36 ,  H01Q21/00

CPC classification number: H01Q9/0407 ,  H01Q3/24 ,  H01Q13/24 ,  H01Q25/00

Abstract: A rod antenna and a method for operating the rod antenna. The rod antenna includes a two-dimensional patch for radiating and/or receiving an electromagnetic wave, the patch extending along a plane defined by two coordinate axes orthogonal to each other. A feeding line is coupled to the patch for transferring signal energy to and/or from the patch, and a dielectric rod radiates and/or receives the electromagnetic wave, the rod extending longitudinally from the patch in direction of a third coordinate axis outside of the plane defined by the first two coordinate axes. A metal holder is coupled to the patch and to the rod for transferring the electromagnetic wave between the patch and the rod.

Abstract translation: 棒状天线和操作杆状天线的方法。 棒状天线包括用于辐射和/或接收电磁波的二维贴片，该贴片沿着由彼此正交的两个坐标轴限定的平面延伸。 馈电线耦合到贴片，用于将信号能量传递到贴片和/或从贴片传送，并且介电棒辐射和/或接收电磁波，杆从贴片沿着第三坐标轴的方向纵向延伸， 平面由前两个坐标轴定义。 金属保持器联接到贴片和杆，用于在贴片和棒之间传送电磁波。