公开(公告)号：US20040089414A1

公开(公告)日：2004-05-13

申请号：US10686100

申请日：2003-10-14

Applicant: Shibaura Mechatronics Corporation

Inventor： Tsutomu Makino ,  Shinichi Ogimoto

IPC: B32B031/00

CPC classification number: B32B37/003 ,  B32B2305/55 ,  B32B2309/68 ,  B32B2457/20 ,  G02F1/1339 ,  G02F1/1341 ,  G02F2001/13415

Abstract: There is disclosed a method including an applying step of applying a sealing agent onto either one of two substrates, a dropping step of dropping a predetermined amount of a liquid crystal onto either one of the two substrates, a leaving step of leaving the substrate on which the liquid crystal has been dropped to stand under a reduced pressure atmosphere for a predetermined time, and a bonding step of bonding the two substrates onto each other under the reduced pressure atmosphere, after leaving the substrate on which the liquid crystal has been dropped under the reduced pressure atmosphere for the predetermined time.

Abstract translation: 公开了一种方法，其包括将密封剂施加到两个基板中的任一个上的施加步骤，将预定量的液晶下落到两个基板中的任一个上的下落步骤，离开其上的基板的离开步骤 液晶已经在减压气氛下放置预定时间，并且在将液晶已经滴下的基板离开之后，在减压气氛下将两个基板彼此接合的接合步骤 减压气氛达预定时间。

公开(公告)号：US20030173020A1

公开(公告)日：2003-09-18

申请号：US10369725

申请日：2003-02-21

Applicant: SHIBAURA MECHATRONICS CORPORATION

Inventor： Eiichi Ishiyama

IPC: B44C001/00

CPC classification number: G02F1/1341 ,  G02F2001/13415

Abstract: For the vacuum pumping performed for a chamber, the opening of a valve communicating with a vacuum pump is controlled to change the intake resistance of a pipe from high to low, and to suppress an exhaust air stream occurring when vacuum pumping is started. Further, in the process (vacuum venting) for recovering the atmospheric pressure in the chamber, a recovery valve is controlled to change, from high to low, the inflow resistance of a gas introduced into the chamber, so that the amount of the gas introduced into the chamber 2 at the beginning of the vacuum venting is reduced. Therefore, since the air stream in the chamber 2 can be moderated during the vacuum pumping and the vacuum venting, the deterioration of the electric characteristics of the substrates by the stirring up of dust in the chamber and the attachment of the dust to the substrates can be avoided, and high-quality laminated substrates can be provided at a high manufacturing yield.

Abstract translation: 为了对室进行真空抽吸，控制与真空泵连通的阀的开度，以将管的进气阻力从高变为低，并且抑制当真空泵送开始时发生的排气流。 此外，在用于回收室内的大气压力的过程（真空排气）中，控制回收阀从高到低将导入室的气体的流入阻力改变，使得引入的气体的量 在真空排气开始时进入腔室2减少。 因此，由于在真空抽吸和真空排气过程中腔室2中的空气流可以缓和，所以通过搅拌室内的灰尘和将灰尘附着在基板上而导致的基板的电特性的劣化 可以以高的制造成品率提供高质量的层合基板。

公开(公告)号：US20030155033A1

公开(公告)日：2003-08-21

申请号：US10367426

申请日：2003-02-14

Applicant: SHIBAURA MECHATRONICS CORPORATION

Inventor： Shingo Tamai

IPC: B65B003/04 ,  B67C003/02 ,  B65B001/04

CPC classification number: B05B17/0607 ,  B05C5/0212 ,  B05C11/1034

Abstract: Liquid crystal dropping apparatus and method for dropping liquid crystal discharged from discharging ports of a liquid crystal dropping head on a planned drop region, wherein the liquid crystal is discharged only from one or some of discharging ports located in correspondence with the planned drop region among a plurality of discharging ports of the liquid crystal dropping head.

Abstract translation: 液晶滴落装置和液晶滴出头的排出口排出液晶的方法，其中液晶仅从位于与计划的液滴区域相对应的一个或一些排出口排出， 多个液晶滴头的排出口。

公开(公告)号：US20020134753A1

公开(公告)日：2002-09-26

申请号：US10152001

申请日：2002-05-22

Applicant: SHIBAURA MECHATRONICS CORPORATION

Inventor： Masaru Kasai

IPC: B44C001/22 ,  C23F001/00

CPC classification number: H01L21/30

Abstract: A vacuum processing apparatus produces fluorine radicals by activating a fluorinating gas containing at least fluorine atoms and fluorinates the surface of a component formed of an organic material (32) exposed to an atmosphere of a processing chamber (2) before carrying an object (S) into the processing chamber (2). The object (S) is carried into the processing chamber (2) after the completion of a fluorinating process. The object (S) is processed with a processing gas containing at least oxygen radicals. Etching of the component formed of the organic material (32) can be prevented by the fluorination of surface of the component formed of the organic material (32) and exposed to an atmosphere in the processing chamber (2).

公开(公告)号：US20250108415A1

公开(公告)日：2025-04-03

申请号：US18897797

申请日：2024-09-26

Applicant: SHIBAURA MECHATRONICS CORPORATION

Inventor： Junji ISHIHARA ,  Hisaaki MIYASAKO ,  Yukinobu NISHIBE

IPC: B08B9/28 ,  B65G47/90 ,  H01L21/673

Abstract: According to one embodiment of the present disclosure, a wafer storage container cleaning apparatus includes a cleaning chamber that cleans a wafer storage container. The cleaning chamber includes: a chamber that accommodates a shell of the wafer storage container, and capable of being opened and closed by an opening/closing lid via a hinge; a door holder that holds the door; a cleaning nozzle that supplies a cleaning liquid to the shell and the door; a rotation mechanism that rotates the shell and the door; a circular frame that surrounds an outside of the door and has a height that covers a part of the thickness of the door; and an inclined cover that is provided to be inclined such that an end opposite the hinge is the lowest and is higher toward the circular frame, and guides the cleaning liquid supplied to the door and scattered thereon.

公开(公告)号：US12109597B2

公开(公告)日：2024-10-08

申请号：US17230152

申请日：2021-04-14

Applicant: Shibaura Mechatronics Corporation

Inventor： Daisuke Matsushima ,  Kensuke Demura ,  Satoshi Nakamura ,  Masaya Kamiya ,  Minami Nakamura

IPC: B08B7/00 ,  B08B3/04 ,  B08B3/08 ,  B08B3/10 ,  F25C1/12 ,  H01L21/67

CPC classification number: B08B7/0014 ,  B08B3/041 ,  B08B3/08 ,  B08B3/10 ,  F25C1/12 ,  H01L21/67028

Abstract: According to one embodiment, a substrate treatment device includes a placement stand configured to rotate the substrate, a cooling part configured to supply a cooling gas into a space between the placement stand and the substrate, a first liquid supplier configured to supply a first liquid on a surface of the substrate, a second liquid supplier configured to supply a second liquid on the surface, and a controller controlling rotation of the substrate, supply of the cooling gas, the first and second liquids. The controller performs a preliminary process of supplying the second liquid on the surface, and supplying the cooling gas into the space, a liquid film forming process by supplying the first liquid toward the surface after the preliminary process, a supercooling process of the liquid film on the surface, and a freezing process of at least a part of the liquid film on the surface.

公开(公告)号：US20240328713A1

公开(公告)日：2024-10-03

申请号：US18612598

申请日：2024-03-21

Applicant: SHIBAURA MECHATRONICS CORPORATION

Inventor： Yukinobu NISHIBE ,  Toshihiro HAYASHI ,  Hisaaki MIYASAKO ,  Junji ISHIHARA ,  Hirokazu MASUDA

IPC: F26B21/10 ,  F26B25/22

CPC classification number: F26B21/10 ,  F26B25/22

Abstract: According to one embodiment of the present disclosure, a drying apparatus includes a drying chamber that holds a drying processing target in an inside thereof, a decompression device that decompresses the inside of the drying chamber; and a controller that controls the decompression device to decompress the inside of the drying chamber, thereby executing a drying processing of evaporating and removing moisture from the drying processing target. The controller executes, after the drying processing, an additional decompression processing of lowering a pressure of the inside of the drying chamber below a pressure at a time of the drying processing, for a predetermined time and determines a dry condition of the drying processing target based on a pressure of the inside of the drying chamber that has been reached after the additional decompression processing.

公开(公告)号：US20240321623A1

公开(公告)日：2024-09-26

申请号：US18613488

申请日：2024-03-22

Applicant: SHIBAURA MECHATRONICS CORPORATION

Inventor： Yoshihiro KUSUBE

IPC: H01L21/683 ,  H01L21/687

CPC classification number: H01L21/6838 ,  H01L21/68785

Abstract: According to one embodiment, a mounting tool and a mounting apparatus that can be used for the electronic components with different sizes without changing a shape thereof and can reduce remaining air bubbles when mounting the electronic component on the substrate are provided. A mounting tool 31 of the embodiment includes: a holder 311 including a holding surface 311a configured to hold an inner side of the electronic component 2 inside a pair of opposite outer edges of the electronic component 2; an expanded portion 312 including an opposing surface that is facing away from an overhang portion 2c of the electronic component 2 that protrudes outward than the outer edge of the holding surface 311a of the holder 311 and is not held by the holder 311; a first opening 313 provided in the holding surface 311a; a second opening 315 provided in the opposing surface 312a; a first ventilation path 314 configured to communicate with the first opening 313 and to suck and hold the electronic component 2 at the holding surface 311a by creating negative internal pressure; and a second ventilation path 316 that sucks the overhang portion 2c of the electronic component 2 facing the opposing surface 312a by creating negative internal pressure.

公开(公告)号：US20240100577A1

公开(公告)日：2024-03-28

申请号：US18371121

申请日：2023-09-21

Applicant: SHIBAURA MECHATRONICS CORPORATION

Inventor： Yuichi IMAOKA

IPC: B08B7/04 ,  B08B1/00 ,  B08B3/10 ,  B08B11/02

CPC classification number: B08B7/04 ,  B08B1/002 ,  B08B3/10 ,  B08B11/02

Abstract: According to one embodiment of the present disclosure, a cleaning apparatus includes a plurality of rollers that rotates a substrate in contact with an outer periphery of the substrate; a rotation mechanism including a motor that rotates the rollers about the rotation shaft; a cover interposed between the rollers and the rotation mechanism to cover the rotation mechanism; an ejection port provided in the cover and that ejects gas between the cover and the rollers; a negative pressure region provided in the cover on a side of the rotation mechanism and having a negative pressure lower than an atmospheric pressure outside the cover through exhaust; a liquid ejector that ejects a cleaning liquid onto the substrate; and a cleaning unit that brings the brush into contact with at least one surface of the substrate that is being rotated, thereby cleaning the surface of the substrate.

公开(公告)号：US20240096653A1

公开(公告)日：2024-03-21

申请号：US18469619

申请日：2023-09-19

Applicant: SHIBAURA MECHATRONICS CORPORATION ,  KIOXIA CORPORATION

Inventor： Kensuke DEMURA ,  Satoshi NAKAMURA ,  Masaya KAMIYA ,  Minami NAKAMURA ,  Kosuke TAKAI ,  Mana TANABE ,  Kaori UMEZAWA

IPC: H01L21/67 ,  H01L21/02 ,  H01L21/687

CPC classification number: H01L21/67051 ,  H01L21/02052 ,  H01L21/67023 ,  H01L21/67109 ,  H01L21/68764

Abstract: According to one embodiment a substrate treatment apparatus incorporates, into a frozen film, a contaminant adhered to a substrate surface by freezing a liquid film on the surface. The apparatus includes a placement part configured to rotate the substrate, a liquid supply part configured to supply a liquid via a nozzle to the frozen film including the contaminant, a moving part configured to move the nozzle parallel to the substrate surface, and a controller configured to control a rotation of the substrate by the placement part, a supply of the liquid by the liquid supply part, and a movement of the nozzle by the moving part. The controller rotates the substrate by controlling the placement part, supplies the liquid to the frozen film by controlling the liquid supply part, and moves the nozzle from a perimeter edge vicinity to a rotation center vicinity of the substrate by controlling the moving part.