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    Image sensor chip package
    131.
    发明申请
    Image sensor chip package 失效
    图像传感器芯片封装

    公开(公告)号：US20070023608A1

    公开(公告)日：2007-02-01

    申请号：US11448570

    申请日：2006-06-07

    Applicant: Steven Webster ,  Ying-Cheng Wu

    Inventor： Steven Webster ,  Ying-Cheng Wu

    IPC: C12Q1/68

    CPC classification number: H01L27/14618 ,  H01L27/14683 ,  H01L31/0203 ,  H01L2224/32014 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2224/8592 ,  H01L2924/16195 ,  H01L2924/00014

    Abstract: A chip package (200) includes a carrier (20), a chip (22), a second conductive means (26) and a transparent cover (28). The carrier (20) includes a base (24). The chip is mounted on the base and has an active area (222). The second conductive means electronically connects the chip with the conductive means. The first adhesive means is applied around the active area of the chip. The transparent cover is mounted to the base of the carrier. The cover is adhered with the first adhesive means so as to define a sealing space (32) for sealing the active area of the chip therein. It can be seen that the active area of the chip is sufficiently protected from pollution by the small volume of the sealing space.

    Abstract translation: 芯片封装（200）包括载体（20），芯片（22），第二导电装置（26）和透明盖（28）。 载体（20）包括基座（24）。 芯片安装在基座上并具有有效区域（222）。 第二导电装置将芯片与导电装置电连接。 第一粘合装置被施加在芯片的有效区域周围。 透明盖安装在托架的底座上。 该盖用第一粘合装置粘合以便限定用于密封芯片的有效区域的密封空间（32）。 可以看出，芯片的有效面积被充分保护，免受小体积密封空间的污染。

    Thin integrated circuit package having an optically transparent window
    134.
    发明授权
    Thin integrated circuit package having an optically transparent window 有权
    薄的集成电路封装，具有光学透明的窗口

    公开(公告)号：US06784534B1

    公开(公告)日：2004-08-31

    申请号：US10067068

    申请日：2002-02-06

    Applicant: Thomas P. Glenn ,  Vincent Di Caprio ,  Steven Webster

    Inventor： Thomas P. Glenn ,  Vincent Di Caprio ,  Steven Webster

    IPC: H01L2348

    CPC classification number: H01L31/0203 ,  H01L2924/15311

    Abstract: A thin integrated circuit package having an optically transparent window provides a small profile optical integrated circuit assembly for use in digital cameras, video cellular telephones and other devices requiring a small physical size and optical integrated circuit technology. A tape having a conductive metal layer on a surface is used to interface the optical integrated circuit die with electrical interconnects disposed on a surface of the tape opposite the die. A supporting structure surrounds the die and a glass cover is either bonded to the top of the supporting structure over the die, or the glass cover is bonded to the top of the die and the gap between the glass cover and supporting structure filled with encapsulant. The resulting assembly yields a very thin optical integrated circuit package.

    Abstract translation: 具有光学透明窗口的薄集成电路封装提供了用于数字照相机，视频蜂窝电话和需要较小物理尺寸和光学集成电路技术的其它设备的小型光学集成电路组件。 使用在表面上具有导电金属层的带将光学集成电路管芯与设置在与管芯相对的带的表面上的电互连接合。 支撑结构围绕模具，并且玻璃盖或者结合到模具上方的支撑结构的顶部，或者玻璃盖结合到模具的顶部以及玻璃盖和填充有密封剂的支撑结构之间的间隙。 所得组件产生非常薄的光学集成电路封装。

    Ceramic semiconductor package and method for fabricating the package
    136.
    发明授权
    Ceramic semiconductor package and method for fabricating the package 有权
    陶瓷半导体封装及其制造方法

    公开(公告)号：US06627987B1

    公开(公告)日：2003-09-30

    申请号：US09881343

    申请日：2001-06-13

    Applicant: Thomas P. Glenn ,  Roy D. Hollaway ,  Steven Webster

    Inventor： Thomas P. Glenn ,  Roy D. Hollaway ,  Steven Webster

    IPC: H01L2348

    CPC classification number: H01L23/10 ,  H01L24/48 ,  H01L2224/05599 ,  H01L2224/45099 ,  H01L2224/48227 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/16195 ,  Y10T428/239 ,  H01L2224/45015 ,  H01L2924/207

    Abstract: A sealed ceramic package for a semiconductor device and a method of fabricating the same are disclosed. In one embodiment, a ceramic substrate has a set of cavities each having an opening at a substrate top surface. A semiconductor die is disposed within each cavity, and is electrically connected through the substrate to input/output terminals of the substrate. The substrate has a metal film on the top surface thereof around the opening of the respective the cavities. A metal lid panel, covering the cavity openings, is soldered to the metal film by reflowing a layer of solder disposed over a lid panel bottom surface, thereby sealing the die in each cavity. Subsequently, individual packages are singulated from the ceramic substrate.

    Abstract translation: 公开了一种用于半导体器件的密封陶瓷封装及其制造方法。 在一个实施例中，陶瓷衬底具有一组空腔，每个空腔在衬底顶表面具有开口。 半导体管芯设置在每个腔内，并且通过衬底电连接到衬底的输入/输出端子。 衬底在其顶表面上具有围绕各腔的开口的金属膜。 覆盖空腔开口的金属盖板通过回流设置在盖板底部表面上的焊料层而焊接到金属膜，从而将模具密封在每个空腔中。 随后，从陶瓷衬底分离各个封装。

    Chip size image sensor wirebond package fabrication method
    138.
    发明授权
    Chip size image sensor wirebond package fabrication method 有权
    芯片尺寸图像传感器引线封装制造方法

    公开(公告)号：US06620646B1

    公开(公告)日：2003-09-16

    申请号：US09712314

    申请日：2000-11-13

    Applicant: Thomas P. Glenn ,  Steven Webster ,  Markus K. Liebhard

    Inventor： Thomas P. Glenn ,  Steven Webster ,  Markus K. Liebhard

    IPC: H01L2148

    CPC classification number: H01L27/14618 ,  H01L27/14636 ,  H01L31/0203 ,  H01L2224/48091 ,  H01L2924/01079 ,  H01L2924/10253 ,  H01L2924/12041 ,  H01L2924/00014 ,  H01L2924/00

    Abstract: To form an image sensor package, a window is mounted above an active area on an upper surface of an image sensor. A noncritical region of the upper surface of the image sensor is between the active area and bond pads of the image sensor. A lower surface of a step up ring is mounted above the noncritical region of the upper surface of the image sensor. An upper surface of the step up ring includes a plurality of electrically conductive traces. Bond wires are formed between the bond pads of the image sensor and the electrically conductive traces on the upper surface of the step up ring. The step up ring is mounted so that the window is located in or adjacent a central aperture of the step up ring.

    Abstract translation: 为了形成图像传感器封装，将窗口安装在图像传感器的上表面上的有效区域上方。 图像传感器的上表面的非临界区域在图像传感器的有源区域和接合焊盘之间。 升压环的下表面安装在图像传感器的上表面的非关键区域上方。 升压环的上表面包括多个导电迹线。 接合线形成在图像传感器的接合焊盘和升压环的上表面上的导电迹线之间。 安装升降环使得窗口位于升压环的中心孔中或其附近。

    Method for fabricating a special-purpose die using a polymerizable tape
    139.
    发明授权
    Method for fabricating a special-purpose die using a polymerizable tape 有权
    使用可聚合胶带制造专用模具的方法

    公开(公告)号：US06610167B1

    公开(公告)日：2003-08-26

    申请号：US09764166

    申请日：2001-01-16

    Applicant: Thomas P. Glenn ,  Steven Webster ,  Roy Dale Hollaway

    Inventor： Thomas P. Glenn ,  Steven Webster ,  Roy Dale Hollaway

    IPC: B32B3100

    CPC classification number: H01L27/14685 ,  H01L27/1462 ,  Y10T156/1158

    Abstract: A method includes adhesively mounting an adhesive lower surface of a protective layer to a top surface of a die such as an image sensor die or a micromachine die. A special-purpose area on the top surface of the die is contacted and protected by said protective layer. The protective layer includes a polymerizable material, which includes the adhesive lower surface. The method further includes rendering the adhesive lower surface to be nonadhesive. The adhesive lower surface is rendered nonadhesive by polymerizing the polymerizable material of the protective layer with ultraviolet radiation.

    Abstract translation: 一种方法包括将保护层的粘合剂下表面粘合地安装到诸如图像传感器模具或微机械模具的模具的顶表面上。 模具顶表面上的专用区域被所述保护层接触和保护。 保护层包括可聚合材料，其包括粘合剂下表面。 该方法还包括使粘合剂下表面不粘附。 通过用紫外线辐射聚合保护层的可聚合材料，使粘合剂下表面变得不粘附。

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