公开(公告)号：US08152594B2

公开(公告)日：2012-04-10

申请号：US12010738

申请日：2008-01-29

申请人： Kenichiro Saito ,  Osamu Nabeya ,  Kimihide Nagata ,  Tetsuji Togawa

发明人： Kenichiro Saito ,  Osamu Nabeya ,  Kimihide Nagata ,  Tetsuji Togawa

IPC分类号： B24B49/00

CPC分类号： B24B53/017 ,  B24B49/14 ,  B24B49/18

摘要： A polishing apparatus is used for polishing a substrate such as a semiconductor wafer to a flat mirror finish. The polishing apparatus includes a polishing table having a polishing surface, a top ring configured to hold and press the substrate against the polishing surface, a top ring shaft configured to lift and lower the top ring, and an elongation detecting device configured to detect an elongation of the top ring shaft. The polishing apparatus further includes a controller configured to set a vertical position of the top ring at the time of polishing, and control a lifting and lowering mechanism to lower the top ring to a preset polishing position as the set vertical position. The controller corrects the preset polishing position based on the elongation of the top ring shaft which has been detected by the elongation detecting device.

摘要翻译： 抛光装置用于将半导体晶片等基板研磨成平面镜面。 抛光装置包括具有抛光表面的抛光台，被配置为将基板保持并压靠在抛光表面上的顶环，构造成升高和降低顶环的顶环轴，以及延伸检测装置，其被配置为检测伸长率 的顶环轴。 抛光装置还包括控制器，其构造成在抛光时设置顶环的垂直位置，并且控制提升和降低机构以将顶环降低到作为设定垂直位置的预设抛光位置。 控制器基于由伸长检测装置检测到的顶环轴的伸长率来校正预设的抛光位置。

公开(公告)号：US08100743B2

公开(公告)日：2012-01-24

申请号：US12285941

申请日：2008-10-16

申请人： Osamu Nabeya ,  Tetsuji Togawa ,  Hozumi Yasuda ,  Koji Saito ,  Makoto Fukushima

发明人： Osamu Nabeya ,  Tetsuji Togawa ,  Hozumi Yasuda ,  Koji Saito ,  Makoto Fukushima

IPC分类号： B24B5/00

CPC分类号： B24B37/32

摘要： A polishing apparatus is used for polishing a substrate such as a semiconductor wafer to a flat mirror finish. The polishing apparatus includes a polishing table having a polishing surface, a top ring body configured to hold and press a substrate against the polishing surface, a retainer ring provided at an outer peripheral portion of the top ring body and configured to press the polishing surface, and a retainer ring guide fixed to the top ring body and configured to be brought into sliding contact with a ring member of the retainer ring to guide a movement of said ring member. Either one of sliding contact surfaces of the ring member and the retainer ring guide which are brought into sliding contact with each other comprises a low friction material.

摘要翻译： 抛光装置用于将半导体晶片等基板研磨成平面镜面。 抛光装置包括具有研磨面的研磨台，配置为将基板保持并压靠在研磨面上的顶环体，设置在顶环体的外周部并构造成按压抛光面的保持环， 以及保持环导向件，其固定到所述顶环主体并且被构造成与所述保持环的环形构件滑动接触以引导所述环构件的运动。 彼此滑动接触的环构件和保持器环导向件的滑动接触表面中的任一个包括低摩擦材料。

公开(公告)号：US07632378B2

公开(公告)日：2009-12-15

申请号：US11078495

申请日：2005-03-14

申请人： Kunihiko Sakurai ,  Tetsuji Togawa ,  Nobuyuki Takada ,  Satoshi Wakabayashi ,  Kenichiro Saito ,  Masahiko Sekimoto ,  Takuji Hayama ,  Daisuke Koga

发明人： Kunihiko Sakurai ,  Tetsuji Togawa ,  Nobuyuki Takada ,  Satoshi Wakabayashi ,  Kenichiro Saito ,  Masahiko Sekimoto ,  Takuji Hayama ,  Daisuke Koga

IPC分类号： C23F1/00 ,  H01L21/306

CPC分类号： B24B37/345 ,  B24B37/042 ,  H01L21/30625

摘要： A polishing apparatus is used for polishing a workpiece such as a semiconductor wafer to a flat mirror finish. The polishing apparatus comprises a turntable having a polishing surface, a top ring for holding a workpiece and pressing the workpiece against the polishing surface to polish the workpiece, at least three cleaning apparatuses for cleaning polished workpieces, and a transfer structure for transferring the polished workpieces between at least three cleaning apparatuses. The polishing apparatus further includes a rotary transporter disposed in a position which can be accessed by said top rings and having a plurality of portions positioned on a predetermined circumference from a center of rotation of the rotary transporter for holding the workpieces.

公开(公告)号：US20090191791A1

公开(公告)日：2009-07-30

申请号：US12320471

申请日：2009-01-27

申请人： Makoto Fukushima ,  Tetsuji Togawa ,  Hozumi Yasuda ,  Osamu Nabeya ,  Shingo Saito

发明人： Makoto Fukushima ,  Tetsuji Togawa ,  Hozumi Yasuda ,  Osamu Nabeya ,  Shingo Saito

IPC分类号： B24B1/00 ,  B24B49/10 ,  B24B57/02

CPC分类号： B24B37/345

摘要： A polishing method can safely detach and lift up a workpiece from a polishing surface without carrying out the operation of making the workpiece overhang the polishing surface. The polishing method includes carrying out processing of a surface to be polished of a workpiece by supplying a liquid to a polishing surface while pressing the surface to be polished of the workpiece held by a holding device against the polishing surface and moving the workpiece and the polishing surface relative to each other, attracting the workpiece after the processing to the holding device while supplying the liquid to the polishing surface at a decreased flow rate, thereby detaching the workpiece from the polishing surface, and lifting up the holding device together with the workpiece on confirmation of detachment of the workpiece from the polishing surface and attachment of the workpiece to the holding device.

摘要翻译： 抛光方法可以安全地从抛光表面上分离和提起工件，而不必进行使工件伸出抛光表面的操作。 抛光方法包括：通过向抛光表面供给液体来进行待研磨表面的加工，同时将由保持装置保持的工件的待抛光表面压在抛光表面上并移动工件和抛光 相对于彼此的表面，在将处理后的工件吸收到保持装置的同时，以降低的流量向抛光表面供给液体，从而将工件从抛光表面分离，并将工件与工件一起提起 确认工件与抛光表面分离并将工件附着到保持装置上。

公开(公告)号：US20090142996A1

公开(公告)日：2009-06-04

申请号：US12292677

申请日：2008-11-24

申请人： Hozumi Yasuda ,  Makoto Fukushima ,  Tetsuji Togawa

发明人： Hozumi Yasuda ,  Makoto Fukushima ,  Tetsuji Togawa

IPC分类号： B24B1/00 ,  B24B7/10

CPC分类号： B24B37/30

摘要： A polishing apparatus is used for polishing a substrate such as a semiconductor wafer to a flat mirror finish. The polishing apparatus includes a polishing table having a polishing surface, a polishing head having at least one elastic membrane configured to form a plurality of pressure chambers for being supplied with a pressurized fluid, and a controller configured to control supply of the pressurized fluid to the pressure chambers. The controller controls supply of the pressurized fluid so that the pressurized fluid is supplied first to the pressure chamber located at a central portion of the substrate when the substrate is brought into contact with the polishing surface, and then the pressurized fluid is supplied to the pressure chamber located at a radially outer side of the pressure chamber located at the central portion of the substrate.

摘要翻译： 抛光装置用于将半导体晶片等基板研磨成平面镜面。 抛光装置包括具有抛光表面的抛光台，具有至少一个弹性膜的抛光头，所述弹性膜被构造成形成用于供应加压流体的多个压力室，以及控制器，其构造成控制加压流体供应到 压力室。 控制器控制加压流体的供给，使得当基板与抛光表面接触时，加压流体首先被供应到位于基板的中心部分处的压力室，然后将加压流体供应到压力 位于位于基板中心部分处的压力室的径向外侧的腔室。

公开(公告)号：US20090011690A1

公开(公告)日：2009-01-08

申请号：US12230839

申请日：2008-09-05

申请人： Tetsuji Togawa

发明人： Tetsuji Togawa

IPC分类号： B24B41/06 ,  B24B1/00

CPC分类号： B24B37/30 ,  H01L21/3212

摘要： A polishing apparatus comprises a first polishing table having a first polishing surface, a substrate carrier for holding a substrate and positioning the substrate so as to bring a surface of the substrate into contact with the first polishing surface, a pressing mechanism for pressing, against the first polishing surface, the surface of the substrate which has been brought into contact with the first polishing surface by the substrate carrier, a retainer ring mounted on the substrate carrier so as to surround the substrate which has been pressed against the first polishing surface by the pressing mechanism, and a retainer-ring-position-adjustment mechanism for adjustably positioning the retainer ring relative to the substrate, which has been pressed against the first polishing surface, in directions toward and away from the first polishing surface.

摘要翻译： 抛光装置包括具有第一抛光表面的第一抛光台，用于保持基板的基板载体，并且定位基板以使基板的表面与第一抛光表面接触;按压机构， 第一抛光表面，已经通过基板载体与第一抛光表面接触的基板的表面，安装在基板载体上的保持环，以便围绕已经被第一抛光表面压靠在基板上的基板 按压机构，以及保持环位置调节机构，用于相对于已经被压靠在第一抛光表面上的保持环可调节地定位在朝向和远离第一抛光表面的方向上。

公开(公告)号：US07465214B2

公开(公告)日：2008-12-16

申请号：US10555702

申请日：2004-02-25

申请人： Tetsuji Togawa ,  Osamu Nabeya

发明人： Tetsuji Togawa ,  Osamu Nabeya

IPC分类号： B24B49/00

CPC分类号： H01L21/6838 ,  B24B37/30 ,  B24B49/16 ,  H01L21/67092

摘要： A substrate holding apparatus holds a substrate such as a semiconductor and presses the substrate against a polishing surface. The substrate holding apparatus includes a top ring body (2) for holding the substrate, a plurality of fluid passages (33, 34, 35, 36) for supplying a fluid to a plurality of pressure chambers (22, 23, 24, 25) defined in the top ring body, and a plurality of sensors (S1, S2, S3, S4) disposed in the fluid passages, respectively, for detecting flowing states of the fluid which flows through the fluid passages.

摘要翻译： 基板保持装置保持诸如半导体的基板，并将基板压靠在抛光表面上。 基板保持装置包括用于保持基板的顶环体（2），用于向多个压力室（22,23,24,25）供给流体的多个流体通道（33,34,35,36） 以及分别设置在流体通道中的多个传感器（S1，S2，S3，S4），用于检测流过流体通道的流体的流动状态。

公开(公告)号：US20080287043A1

公开(公告)日：2008-11-20

申请号：US12010738

申请日：2008-01-29

申请人： Kenichiro Saito ,  Osamu Nabeya ,  Kimihide Nagata ,  Tetsuji Togawa

发明人： Kenichiro Saito ,  Osamu Nabeya ,  Kimihide Nagata ,  Tetsuji Togawa

IPC分类号： B24B29/00

CPC分类号： B24B53/017 ,  B24B49/14 ,  B24B49/18

摘要： A polishing apparatus is used for polishing a substrate such as a semiconductor wafer to a flat mirror finish. The polishing apparatus includes a polishing table having a polishing surface, a top ring configured to hold and press the substrate against the polishing surface, a top ring shaft configured to lift and lower the top ring, and an elongation detecting device configured to detect an elongation of the top ring shaft. The polishing apparatus further includes a controller configured to set a vertical position of the top ring at the time of polishing, and control a lifting and lowering mechanism to lower the top ring to a preset polishing position as the set vertical position. The controller corrects the preset polishing position based on the elongation of the top ring shaft which has been detected by the elongation detecting device.

摘要翻译： 抛光装置用于将半导体晶片等基板研磨成平面镜面。 抛光装置包括具有抛光表面的抛光台，被配置为将基板保持并压靠在抛光表面上的顶环，构造成升高和降低顶环的顶环轴，以及延伸检测装置，其被配置为检测伸长率 的顶环轴。 抛光装置还包括控制器，其构造成在抛光时设置顶环的垂直位置，并且控制提升和降低机构以将顶环降低到作为设定垂直位置的预设抛光位置。 控制器基于由伸长检测装置检测到的顶环轴的伸长率来校正预设的抛光位置。

公开(公告)号：US20080166949A1

公开(公告)日：2008-07-10

申请号：US11980667

申请日：2007-10-31

申请人： Hiromi Yajima ,  Yukio Imoto ,  Shoichi Kodama ,  Riichiro Aoki ,  Takashi Omichi ,  Toyomi Nishi ,  Tetsuji Togawa

发明人： Hiromi Yajima ,  Yukio Imoto ,  Shoichi Kodama ,  Riichiro Aoki ,  Takashi Omichi ,  Toyomi Nishi ,  Tetsuji Togawa

IPC分类号： B24B1/00 ,  B24B27/00

CPC分类号： H01L21/67161 ,  B08B1/04 ,  B24B27/0023 ,  B24B37/04 ,  B24B37/345 ,  B24B51/00 ,  B24B55/12 ,  F24F3/161 ,  H01L21/67028 ,  H01L21/67046 ,  H01L21/67057 ,  H01L21/67167 ,  H01L21/67219 ,  H01L21/67745 ,  H01L21/67778 ,  H03M13/39 ,  H04N5/4401 ,  H04N5/455

摘要： A polishing apparatus includes an arrangement of a plurality of units to deal with various operations and a robot having at least one arm. The plurality of units are disposed around the robot and include a loading unit for receiving thereon a, e.g. dry, workpiece to be polished, a polishing system including at least one polishing unit for polishing the workpiece, a washing system and a drying system at least including one washing unit for washing and drying the polished workpiece, and an unloading unit for receiving thereon a resultant clean and dry polished workpiece.

摘要翻译： 抛光装置包括用于处理各种操作的多个单元的布置以及具有至少一个臂的机器人。 所述多个单元设置在所述机器人周围，并且包括用于在其上接收的加载单元。 干燥的待抛光工件，包括至少一个用于抛光工件的抛光单元的抛光系统，至少包括一个用于洗涤和干燥抛光的工件的洗涤单元的洗涤系统和干燥系统，以及用于在其上接收的卸载单元 得到清洁和干燥的抛光工件。

公开(公告)号：US20080119121A1

公开(公告)日：2008-05-22

申请号：US11987978

申请日：2007-12-06

申请人： Tetsuji Togawa ,  Osamu Nabeya ,  Makoto Fukushima ,  Kunihiko Sakurai ,  Hiroshi Yoshida ,  Teruhiko Ichimura

发明人： Tetsuji Togawa ,  Osamu Nabeya ,  Makoto Fukushima ,  Kunihiko Sakurai ,  Hiroshi Yoshida ,  Teruhiko Ichimura

IPC分类号： B24B7/04 ,  B24B29/02

CPC分类号： B24B37/30 ,  B24B41/061 ,  B24B49/105

摘要： The present invention relates to a substrate holding apparatus for holding a substrate such as a semiconductor wafer in a polishing apparatus for polishing the substrate to a flat finish. The substrate holding apparatus according to the present invention comprises a top ring body having a receiving space therein, and a vertically movable member which is vertically movable within the receiving space in the top ring body. An abutment member having an elastic membrane is attached to a lower surface of the vertically movable member. The elastic membrane of the abutment member comprises an abutment portion, having a flange projecting outwardly, brought into direct or indirect contact with the substrate, and a connecting portion extending upwardly from a base portion of the flange of the abutment portion and being connected to the vertically movable member. The connecting portion is made of a material having a flexibility higher than that of material of the abutment portion.

摘要翻译： 本发明涉及一种用于将基板（例如半导体晶片）保持在用于将基板抛光到抛光装置的平面光洁度的基板保持装置。 根据本发明的基板保持装置包括其中具有容纳空间的顶环主体和可在顶环体中的容纳空间内垂直移动的可垂直移动的构件。 具有弹性膜的邻接构件附接到可垂直移动构件的下表面。 邻接构件的弹性膜包括邻接部分，其具有向外突出的凸缘，与基底直接或间接接触;以及连接部分，其从邻接部分的凸缘的基部向上延伸并连接到 垂直活动件。 连接部由具有高于邻接部的材料的柔软性的材料制成。