METHOD OF SEPARATING SUBSTRATE AND METHOD OF FABRICATING SEMICONDUCTOR DEVICE USING THE SAME
    131.
    发明申请
    METHOD OF SEPARATING SUBSTRATE AND METHOD OF FABRICATING SEMICONDUCTOR DEVICE USING THE SAME 有权
    分离基板的方法和使用其制造半导体器件的方法

    公开(公告)号:US20140179043A1

    公开(公告)日:2014-06-26

    申请号:US14138923

    申请日:2013-12-23

    Abstract: A method of fabricating a semiconductor device, the method including: forming a first mask pattern including a masking region and an open region on a substrate; forming a sacrificial layer to cover the substrate and the first mask pattern; patterning the sacrificial layer to form a seed layer and to expose the first mask pattern; forming a second mask pattern on the exposed first mask pattern; forming an epitaxial layer on the seed layer and the second mask pattern, and forming a void between the second mask pattern and the epitaxial layer; and separating the substrate from the epitaxial layer.

    Abstract translation: 一种制造半导体器件的方法,所述方法包括:在衬底上形成包括掩模区域和开放区域的第一掩模图案; 形成覆盖衬底和第一掩模图案的牺牲层; 图案化所述牺牲层以形成种子层并暴露所述第一掩模图案; 在所述暴露的第一掩模图案上形成第二掩模图案; 在种子层和第二掩模图案上形成外延层,并在第二掩模图案和外延层之间形成空隙; 以及将衬底与外延层分离。

    Light emitting device for display and display apparatus having the same

    公开(公告)号:US12125941B2

    公开(公告)日:2024-10-22

    申请号:US17106150

    申请日:2020-11-29

    CPC classification number: H01L33/08 H01L33/382 H01L33/42

    Abstract: A light emitting device for a display including a first LED stack, a second LED stack disposed under the first LED stack, a third LED stack disposed under the second LED stack, and including a first conductivity type semiconductor layer and a second conductivity type semiconductor layer, a surface protection layer at least partially covering side surfaces of the first LED stack, the second LED stack, or the third LED stack, a first bonding layer interposed between the second LED stack and the third LED stack, a second bonding layer interposed between the first LED stack and the second LED stack, lower buried vias passing through the second LED stack and the first bonding layer, and electrically connected to the first conductivity type semiconductor layer and the second conductivity type semiconductor layer of the third LED stack, respectively, and upper buried vias passing through the first LED stack.

    Light emitting device for display and display apparatus having the same

    公开(公告)号:US12046587B2

    公开(公告)日:2024-07-23

    申请号:US18226779

    申请日:2023-07-27

    CPC classification number: H01L25/0756 H01L25/0753 H01L33/42 H01L33/62

    Abstract: A light emitting module including a circuit board and a lighting emitting device thereon and including first, second, and third LED stacks each including first and second conductivity type semiconductor layers, a first bonding layer between the second and third LED stacks, a second bonding layer between the first and second LED stacks, a first planarization layer between the second bonding layer and the third LED stack, a second planarization layer on the first LED stack, a lower conductive material extending along sides of the first planarization layer, the second LED stack, the first bonding layer, and electrically connected to the first conductivity type semiconductor layers of each LED stack, respectively, and an upper conductive material between the circuit board and the lower conductive material.

    Light-emitting diode unit for display comprising plurality of pixels and display device having same

    公开(公告)号:US11764253B2

    公开(公告)日:2023-09-19

    申请号:US17403793

    申请日:2021-08-16

    CPC classification number: H01L27/156 H01L25/0655 H01L25/18

    Abstract: A light-emitting diode (LED) unit for a display including a plurality of pixels each including a first light emitting cell, a second light emitting cell, and a third light emitting cell, each of the first, second, and third light emitting cells including a first conductivity type semiconductor layer, an active layer, and a second conductivity type semiconductor layer, a first wavelength converter configured to convert a wavelength of light emitted from the first light emitting cell, a second wavelength converter configured to convert a wavelength of light emitted from the second light emitting cell, in which the first, second, and third light emitting cells of each pixel share the first conductivity type semiconductor layer.

    Light emitting device for display and display apparatus having the same

    公开(公告)号:US11756940B2

    公开(公告)日:2023-09-12

    申请号:US17902893

    申请日:2022-09-04

    CPC classification number: H01L25/0756 H01L25/0753 H01L33/42 H01L33/62

    Abstract: A light emitting module including a circuit board and a lighting emitting device thereon and including first, second, and third LED stacks each including first and second conductivity type semiconductor layers, a first bonding layer between the second and third LED stacks, a second bonding layer between the first and second LED stacks, a first planarization layer between the second bonding layer and the third LED stack, a second planarization layer on the first LED stack, a lower conductive material extending along sides of the first planarization layer, the second LED stack, the first bonding layer, and electrically connected to the first conductivity type semiconductor layers of each LED stack, respectively, and an upper conductive material between the circuit board and the lower conductive material, in which a width of an upper end of the upper conductive material is greater than a width of the corresponding upper conductive material.

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