公开(公告)号：US20140179043A1

公开(公告)日：2014-06-26

申请号：US14138923

申请日：2013-12-23

Applicant: Seoul Viosys Co., Ltd.

Inventor： Jong Min Jang ,  Hwa Mok Kim ,  Kyu Ho Lee ,  Chang Hoon Kim ,  Daewoong Suh ,  Chi Hyun In ,  Dae Seok Park ,  Jong Hyeon Chae

IPC: H01L33/00

CPC classification number: H01L33/0079 ,  H01L33/007 ,  H01L33/0075 ,  H01L33/0095 ,  H01L33/22

Abstract: A method of fabricating a semiconductor device, the method including: forming a first mask pattern including a masking region and an open region on a substrate; forming a sacrificial layer to cover the substrate and the first mask pattern; patterning the sacrificial layer to form a seed layer and to expose the first mask pattern; forming a second mask pattern on the exposed first mask pattern; forming an epitaxial layer on the seed layer and the second mask pattern, and forming a void between the second mask pattern and the epitaxial layer; and separating the substrate from the epitaxial layer.

Abstract translation: 一种制造半导体器件的方法，所述方法包括：在衬底上形成包括掩模区域和开放区域的第一掩模图案; 形成覆盖衬底和第一掩模图案的牺牲层; 图案化所述牺牲层以形成种子层并暴露所述第一掩模图案; 在所述暴露的第一掩模图案上形成第二掩模图案; 在种子层和第二掩模图案上形成外延层，并在第二掩模图案和外延层之间形成空隙; 以及将衬底与外延层分离。

公开(公告)号：US12125941B2

公开(公告)日：2024-10-22

申请号：US17106150

申请日：2020-11-29

Applicant: SEOUL VIOSYS CO., LTD.

Inventor： Jong Hyeon Chae ,  Seom Geun Lee ,  Seong Kyu Jang

IPC: H01L33/08 ,  H01L33/38 ,  H01L33/42

CPC classification number: H01L33/08 ,  H01L33/382 ,  H01L33/42

Abstract: A light emitting device for a display including a first LED stack, a second LED stack disposed under the first LED stack, a third LED stack disposed under the second LED stack, and including a first conductivity type semiconductor layer and a second conductivity type semiconductor layer, a surface protection layer at least partially covering side surfaces of the first LED stack, the second LED stack, or the third LED stack, a first bonding layer interposed between the second LED stack and the third LED stack, a second bonding layer interposed between the first LED stack and the second LED stack, lower buried vias passing through the second LED stack and the first bonding layer, and electrically connected to the first conductivity type semiconductor layer and the second conductivity type semiconductor layer of the third LED stack, respectively, and upper buried vias passing through the first LED stack.

公开(公告)号：US12046587B2

公开(公告)日：2024-07-23

申请号：US18226779

申请日：2023-07-27

Applicant: SEOUL VIOSYS CO., LTD.

Inventor： Seom Geun Lee ,  Seong Kyu Jang ,  Yong Woo Ryu ,  Jong Hyeon Chae

IPC: H01L25/075 ,  H01L33/42 ,  H01L33/62

CPC classification number: H01L25/0756 ,  H01L25/0753 ,  H01L33/42 ,  H01L33/62

Abstract: A light emitting module including a circuit board and a lighting emitting device thereon and including first, second, and third LED stacks each including first and second conductivity type semiconductor layers, a first bonding layer between the second and third LED stacks, a second bonding layer between the first and second LED stacks, a first planarization layer between the second bonding layer and the third LED stack, a second planarization layer on the first LED stack, a lower conductive material extending along sides of the first planarization layer, the second LED stack, the first bonding layer, and electrically connected to the first conductivity type semiconductor layers of each LED stack, respectively, and an upper conductive material between the circuit board and the lower conductive material.

公开(公告)号：US12021111B2

公开(公告)日：2024-06-25

申请号：US17518602

申请日：2021-11-04

Applicant: SEOUL VIOSYS CO., LTD.

Inventor： Jong Hyeon Chae ,  Seong Gyu Jang ,  Ho Joon Lee ,  Chang Yeon Kim ,  Chung Hoon Lee

IPC: H01L27/15 ,  H01L25/075 ,  H01L25/13 ,  H01L33/00 ,  H01L33/10 ,  H01L33/40 ,  H01L33/42 ,  H01L33/50 ,  H01L33/62 ,  H10K10/84 ,  H10K50/81 ,  H10K50/82 ,  H10K59/32 ,  H10K59/35 ,  H01L25/065 ,  H01L25/11 ,  H01L33/38 ,  H10K50/813 ,  H10K50/818 ,  H10K50/822 ,  H10K50/828

CPC classification number: H01L27/156 ,  H01L25/0756 ,  H01L25/13 ,  H01L33/0093 ,  H01L33/10 ,  H01L33/405 ,  H01L33/42 ,  H01L33/507 ,  H01L33/62 ,  H01L25/0655 ,  H01L25/0753 ,  H01L25/115 ,  H01L33/38 ,  H01L33/382 ,  H10K10/84 ,  H10K50/813 ,  H10K50/818 ,  H10K50/822 ,  H10K50/828 ,  H10K59/32 ,  H10K59/35

Abstract: A light emitting diode (LED) stack for a display including a first LED stack including a first conductivity-type semiconductor layer and a second conductivity-type semiconductor layer, a second LED stack disposed on the first LED stack, a third LED stack disposed on the second LED stack, an intermediate bonding layer disposed between the first LED stack and the second LED stack to bond the second LED stack to the first LED stack, an upper bonding layer disposed between the second LED stack and the third LED stack to couple the third LED stack to the second LED stack, and a first hydrophilic material layer disposed between the first LED stack and the upper bonding layer.

公开(公告)号：US11935912B2

公开(公告)日：2024-03-19

申请号：US17847136

申请日：2022-06-22

Applicant: SEOUL VIOSYS CO., LTD.

Inventor： Jong Hyeon Chae ,  Seong Gyu Jang ,  Ho Joon Lee ,  Chang Yeon Kim ,  Chung Hoon Lee

IPC: H10K50/81 ,  H01L25/075 ,  H01L25/13 ,  H01L27/15 ,  H01L33/00 ,  H01L33/10 ,  H01L33/40 ,  H01L33/42 ,  H01L33/50 ,  H01L33/62 ,  H10K50/82 ,  H10K59/32 ,  H10K59/35 ,  H01L25/065 ,  H01L25/11 ,  H01L33/38 ,  H10K10/84 ,  H10K50/813 ,  H10K50/818 ,  H10K50/822 ,  H10K50/828

CPC classification number: H01L27/156 ,  H01L25/0756 ,  H01L25/13 ,  H01L33/0093 ,  H01L33/10 ,  H01L33/405 ,  H01L33/42 ,  H01L33/507 ,  H01L33/62 ,  H01L25/0655 ,  H01L25/0753 ,  H01L25/115 ,  H01L33/38 ,  H01L33/382 ,  H10K10/84 ,  H10K50/813 ,  H10K50/818 ,  H10K50/822 ,  H10K50/828 ,  H10K59/32 ,  H10K59/35

Abstract: A display apparatus including a thin film transistor (TFT) substrate; a first LED sub-unit, a second LED sub-unit, and a third LED sub-unit; first, second, third, and fourth electrode pads disposed between the TFT substrate and the first LED sub-unit; and connectors connecting the first, second, and third LED sub-units to a respective one of the electrode pads, in which the first, second, and third sub-units are configured to be independently driven; light generated from the first LED sub-unit is emitted to the outside of the display apparatus by passing through the second and third LED sub-units; light generated from the second LED sub-unit is emitted to the outside of the display apparatus by passing through the third LED sub-unit; and at least one of the connectors includes a first portion electrically connecting a first surface of the first LED sub-unit to the second electrode pad.

公开(公告)号：US20230343810A1

公开(公告)日：2023-10-26

申请号：US18218386

申请日：2023-07-05

Applicant: SEOUL VIOSYS CO., LTD.

Inventor： Chang Yeon KIM ,  Jong Hyeon Chae ,  Jong Ming Jang ,  Ho Joon Lee ,  Seong Gyu Jang

IPC: H01L27/15 ,  H01L33/22 ,  H01L33/38 ,  H01L33/40 ,  H01L33/42 ,  G02B5/26 ,  H01L33/62 ,  H01L33/08 ,  H01L25/075

CPC classification number: H01L27/15 ,  H01L33/22 ,  H01L33/38 ,  H01L33/405 ,  H01L33/42 ,  G02B5/26 ,  H01L33/62 ,  H01L33/08 ,  H01L25/0756 ,  H01L33/46

Abstract: A light emitting device including a first LED sub-unit, a second LED sub-unit disposed under the first LED sub-unit, a third LED sub-unit disposed under the second LED sub-unit, a first ohmic electrode interposed between the first LED sub-unit and the second LED sub-unit, and in ohmic contact with the first LED sub-unit, a second ohmic electrode interposed between the second LED sub-unit and the third LED sub-unit, and in ohmic contact with the second LED sub-unit, a third ohmic electrode interposed between the second ohmic electrode and the third LED sub-unit, and in ohmic contact the third LED sub-unit, a plurality of electrode pads disposed on the first LED sub-unit, in which at least one of the first ohmic electrode, the second ohmic electrode, and the third ohmic electrode has a patterned structure.

公开(公告)号：US11764253B2

公开(公告)日：2023-09-19

申请号：US17403793

申请日：2021-08-16

Applicant: SEOUL VIOSYS CO., LTD.

Inventor： Chung Hoon Lee ,  Jong Hyeon Chae

IPC: H01L27/15 ,  H01L25/065 ,  H01L25/18

CPC classification number: H01L27/156 ,  H01L25/0655 ,  H01L25/18

Abstract: A light-emitting diode (LED) unit for a display including a plurality of pixels each including a first light emitting cell, a second light emitting cell, and a third light emitting cell, each of the first, second, and third light emitting cells including a first conductivity type semiconductor layer, an active layer, and a second conductivity type semiconductor layer, a first wavelength converter configured to convert a wavelength of light emitted from the first light emitting cell, a second wavelength converter configured to convert a wavelength of light emitted from the second light emitting cell, in which the first, second, and third light emitting cells of each pixel share the first conductivity type semiconductor layer.

公开(公告)号：US11756940B2

公开(公告)日：2023-09-12

申请号：US17902893

申请日：2022-09-04

Applicant: SEOUL VIOSYS CO., LTD.

Inventor： Seom Geun Lee ,  Seong Kyu Jang ,  Yong Woo Ryu ,  Jong Hyeon Chae

IPC: H01L25/075 ,  H01L33/42 ,  H01L33/62

CPC classification number: H01L25/0756 ,  H01L25/0753 ,  H01L33/42 ,  H01L33/62

Abstract: A light emitting module including a circuit board and a lighting emitting device thereon and including first, second, and third LED stacks each including first and second conductivity type semiconductor layers, a first bonding layer between the second and third LED stacks, a second bonding layer between the first and second LED stacks, a first planarization layer between the second bonding layer and the third LED stack, a second planarization layer on the first LED stack, a lower conductive material extending along sides of the first planarization layer, the second LED stack, the first bonding layer, and electrically connected to the first conductivity type semiconductor layers of each LED stack, respectively, and an upper conductive material between the circuit board and the lower conductive material, in which a width of an upper end of the upper conductive material is greater than a width of the corresponding upper conductive material.

公开(公告)号：US11749652B2

公开(公告)日：2023-09-05

申请号：US17990735

申请日：2022-11-20

Applicant: SEOUL VIOSYS CO., LTD.

Inventor： Jong Hyeon Chae ,  Ik Kyu You ,  Seom Geun Lee ,  Seong Kyu Jang ,  Yong Woo Ryu

IPC: H01L25/075 ,  H01L33/62 ,  H01L23/00

CPC classification number: H01L25/0753 ,  H01L24/16 ,  H01L33/62 ,  H01L2224/16227 ,  H01L2224/16505

Abstract: A display panel including a circuit board having first pads, light emitting devices disposed on the circuit board and having second pads and including at least one first light emitting device to emit light having a first peak wavelength and second light emitting devices to emit light having a second peak wavelength, and a metal bonding layer electrically connecting the first pads and the second pads, in which the metal bonding layer of the first light emitting device has a thickness different from that of the metal bonding layer of the second light emitting devices while including a same material, and an upper surface of the second light devices are disposed at an elevation between an upper surface and a bottom surface of the first light emitting device.

公开(公告)号：US11664409B2

公开(公告)日：2023-05-30

申请号：US17366462

申请日：2021-07-02

Applicant: SEOUL VIOSYS CO., LTD.

Inventor： Jong Hyeon Chae ,  Chung Hoon Lee ,  Seong Gyu Jang ,  Chang Yeon Kim ,  Ho Joon Lee

IPC: H01L27/15 ,  H01L27/12 ,  H01L27/32 ,  H01L25/07 ,  H01L33/10 ,  H01L33/30 ,  H01L33/40 ,  H01L33/50 ,  H01L33/08 ,  H01L33/38 ,  H01L33/42 ,  H01L33/46 ,  H01L33/58 ,  H01L33/60 ,  H01L25/075 ,  H01L33/00 ,  H01L25/16 ,  G09G3/32 ,  H01L33/22 ,  H01L29/45 ,  H01L33/24

CPC classification number: H01L27/156 ,  H01L25/0756 ,  H01L33/10 ,  H01L33/30 ,  H01L33/405 ,  H01L33/504 ,  G09G3/32 ,  H01L25/167 ,  H01L27/1214 ,  H01L27/322 ,  H01L27/3209 ,  H01L27/3211 ,  H01L27/3216 ,  H01L27/3218 ,  H01L29/45 ,  H01L33/0008 ,  H01L33/0093 ,  H01L33/08 ,  H01L33/22 ,  H01L33/24 ,  H01L33/38 ,  H01L33/385 ,  H01L33/42 ,  H01L33/46 ,  H01L33/58 ,  H01L33/60 ,  H01L2251/301

Abstract: A light emitting diode (LED) stack for a display including a substrate, a first LED stack disposed on the substrate, a second LED stack disposed on the first LED stack, a third LED stack disposed on the second LED stack, a first color filter interposed between the first LED stack and the second LED stack, and a second color filter interposed between the second LED stack and the third LED stack, in which the second LED stack and the third LED stack are configured to transmit light generated from the first LED stack to the outside, and the third LED stack is configured to transmit light generated from the second LED stack to the outside.