公开(公告)号：US4689505A

公开(公告)日：1987-08-25

申请号：US930165

申请日：1986-11-13

Applicant: Uttam S. Ghoshal

Inventor： Uttam S. Ghoshal

IPC: H03K19/094 ,  H03K19/017 ,  H03K17/06 ,  H03K19/096

CPC classification number: H03K19/01714

Abstract: A bootstrapped CMOS driver circuit capable of driving large capacitance loads with small internal delays. Higher driving capability is achieved by using only n-channel transistors at the output and overdriving the transistors during the transitions. A total internal delay of less than one nanosecond for a driver may be provided with 100 ohms compatible output impedance.

公开(公告)号：US5830533A

公开(公告)日：1998-11-03

申请号：US985663

申请日：1992-12-04

Applicant: Charles W. C. Lin ,  Randy L. German

Inventor： Charles W. C. Lin ,  Randy L. German

IPC: H05K3/18 ,  B05D1/32

CPC classification number: H05K3/182 ,  H01L2224/02333

Abstract: A method of selectively fabricating metallization on a dielectric substrate is disclosed. A seed layer is sputtered on a polymer dielectric, a patterned photoresist mask is disposed over the seed layer, exposed portions of the seed layer are etched, the photoresist is stripped, and copper is deposited without a mask by electroless plating on the unetched seed layer to form well-adhering high density copper lines without exposing the photoresist to the electroless bath.

Abstract translation: 公开了一种在电介质基片上选择性地制造金属化的方法。 将种子层溅射在聚合物电介质上，将图案化的光致抗蚀剂掩模设置在种子层上，蚀刻种子层的暴露部分，剥离光致抗蚀剂，并且通过在未蚀刻的种子层上进行化学镀而不用掩模沉积铜 以形成良好粘附的高密度铜线，而不将光致抗蚀剂暴露于无电镀浴。

公开(公告)号：US5601966A

公开(公告)日：1997-02-11

申请号：US475167

申请日：1995-06-07

Applicant: Nalin Kumar ,  Chenggang Xie

Inventor： Nalin Kumar ,  Chenggang Xie

IPC: H01J9/02 ,  H01J17/06 ,  H01J19/02 ,  H01J29/04 ,  H01J31/12 ,  H04N1/00 ,  G03F7/00

CPC classification number: H01J9/025 ,  H01J31/127 ,  H01J2201/30457

Abstract: A method is provided for fabricating a display cathode which includes forming a conductive line adjacent a face of a substrate. A region of amorphic diamond is formed adjacent a selected portion of the conductive line.

公开(公告)号：US5503948A

公开(公告)日：1996-04-02

申请号：US285055

申请日：1994-08-02

Applicant: Colin A. MacKay ,  Michael A. Olla

Inventor： Colin A. MacKay ,  Michael A. Olla

IPC: H01M2/22 ,  H01M6/18 ,  H01M6/40 ,  H01M6/42 ,  H01M10/04

CPC classification number: H01M10/0436 ,  H01M2/22 ,  H01M6/181 ,  H01M6/40 ,  H01M6/42 ,  Y10T29/49108

Abstract: Multicell system and method for making a multicell system. Systems include relatively thin (less than about 50 mil) electrochemical cells layered upon one another to minimize volume and weight. Cells systems are formed with cells that are layered such that first charge sides of each cell are coupled to first charge sides of other cells, and such that second charge sides of each cell are coupled to second charge sides of other cells. Cells and/or cell systems is connected to other cells and/or cell systems to form battery systems by layering cells such that a first charge side of a cell are coupled to second charge side of another cell. In this manner the number of electrically insulating separators is reduced, thereby also reducing weight and volume of resulting systems.

Abstract translation: 用于制造多单元系统的多芯片系统和方法。 系统包括彼此分层的较薄（小于约50密耳）的电化学电池，以使体积和重量最小化。 单元系统由分层的单元形成，使得每个单元的第一电荷侧耦合到其它单元的第一电荷侧，并且使得每个单元的第二电荷侧耦合到其它单元的第二电荷侧。 细胞和/或细胞系统连接到其它细胞和/或细胞系统以通过分层细胞形成电池系统，使得细胞的第一电荷侧耦合到另一细胞的第二电荷侧。 以这种方式，电绝缘隔板的数量减少，从而也减少了所得系统的重量和体积。

公开(公告)号：US5438166A

公开(公告)日：1995-08-01

申请号：US979541

申请日：1992-11-23

Applicant: David H. Carey ,  Barry H. Whalen

Inventor： David H. Carey ,  Barry H. Whalen

IPC: H01L23/498 ,  H01L23/538 ,  H05K1/00 ,  H05K1/02

CPC classification number: H01L23/5383 ,  H01L23/4985 ,  H01L23/5382 ,  H05K1/0289 ,  H05K1/0298 ,  H01L2224/45124 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L24/45 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01014 ,  H01L2924/01039 ,  H01L2924/01067 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025 ,  Y10T29/49156 ,  Y10T29/49162

Abstract: A customizable circuit using a programmable interconnect and compatible TAB chip bonding design. The programmable interconnect comprises layers of wire segments forming programmable junctions rather than continuous wires. This segmentation is performed with an offset from line to line in each layer such that the ends of the segments in each layer form long diagonal lines having a pitch determined by the basic wire segment length. Uniform capacitance effects are achieved by alternating the layers of the wire segments. The terminal ends of the segments are positioned in a plane such that segments may be connected by short links to form the desired interconnect. The links which join the line segments customize the otherwise undedicated interconnect. Resistive links may be used to minimize undesirable transmission line effects. The segment ends may also be connected through electrically programmable elements. Carrier tape bonds the integrated circuit chips to the programmable interconnect. Also disclosed are methods for forming the interconnect and the TAB chip bonding design.

Abstract translation: 可定制电路采用可编程互连和兼容的TAB芯片焊接设计。 可编程互连包括形成可编程结而不是连续导线的线段层。 这种分割是以每层中的线对线的偏移来执行的，使得每层中的段的端部形成具有由基本线段长度确定的间距的长对角线。 通过交替线段的层来实现均匀的电容效应。 段的终端位于平面中，使得段可以通过短链路连接以形成期望的互连。 连接线段的链接可自定义否则未插入的互连。 可以使用电阻链路来最小化不期望的传输线效应。 段末端也可以通过电可编程元件连接。 载带将集成电路芯片连接到可编程互连。 还公开了用于形成互连和TAB芯片接合设计的方法。

公开(公告)号：US5399238A

公开(公告)日：1995-03-21

申请号：US232790

申请日：1994-04-22

Applicant: Nalin Kumar

Inventor： Nalin Kumar

IPC: H01J9/02 ,  H05K3/00 ,  H01J9/00

CPC classification number: H01J9/025 ,  H01J2201/30407 ,  H01J2201/30457 ,  H05K2201/2081 ,  H05K2203/0554 ,  H05K2203/107 ,  H05K3/0023 ,  H05K3/0041

Abstract: A method of making sub-micron low work function field emission tips without using photolithography. The method includes physical vapor deposition of randomly located discrete nuclei to form a discontinuous etch mask. In one embodiment an etch is applied to low work function material covered by randomly located nuclei to form emission tips in the low work function material. In another embodiment an etch is applied to base material covered by randomly located nuclei to form tips in the base material which are then coated with low work function material to form emission tips. Diamond is the preferred low work function material.

Abstract translation: 一种制造亚微米低功函数场发射尖端而不使用光刻的方法。 该方法包括随机定位的离散核的物理气相沉积以形成不连续的蚀刻掩模。 在一个实施例中，蚀刻被施加到由随机定位的核覆盖的低功函数材料，以在低功函数材料中形成发射尖端。 在另一个实施例中，蚀刻被施加到由随机定位的核覆盖的基材上，以在基材中形成尖端，然后用低功函数材料涂覆以形成发射尖端。 钻石是首选的低功能材料。

公开(公告)号：US5393613A

公开(公告)日：1995-02-28

申请号：US162490

申请日：1993-12-03

Applicant: Colin A. MacKay

Inventor： Colin A. MacKay

IPC: B22D23/06 ,  B22F3/10 ,  B22F3/105 ,  B22F7/00

CPC classification number: B22F3/10 ,  B22D23/06 ,  B22F3/1055 ,  Y02P10/295 ,  Y10T428/12111 ,  Y10T428/1234

Abstract: Direct fabrication of three-dimensional metal parts by irradiating a thin layer of a mixture of metal powder and temperature equalization and unification vehicle to melt the metal powder and form a solid metal film. The vehicle also protects the molten metal from oxidation. The metal powder can contain an elemental metal or several metals, the vehicle can be an organic resin or an amalgam, and the irradiation can be selectively applied by a YAG laser.

Abstract translation: 通过照射金属粉末和温度均化和统一载体的混合物的薄层来直接制造三维金属部件，以熔化金属粉末并形成固体金属膜。 车辆还保护熔融金属不被氧化。 金属粉末可以含有元素金属或多种金属，车辆可以是有机树脂或汞齐，并且可以通过YAG激光器选择性地施加照射。

公开(公告)号：US5379191A

公开(公告)日：1995-01-03

申请号：US257235

申请日：1994-06-09

Applicant: David H. Carey ,  Barry H. Whalen

Inventor： David H. Carey ,  Barry H. Whalen

IPC: H01L23/00 ,  H01L23/31 ,  H01L23/433 ,  H01L23/498 ,  H05K7/02 ,  H01R9/09

CPC classification number: H01L23/562 ,  H01L23/3107 ,  H01L23/4334 ,  H01L23/49827 ,  H01L23/4985 ,  H01L2224/16 ,  H01L2924/01019 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/15173 ,  H01L2924/19041 ,  H01L2924/3025

Abstract: An peripheral to area adapter for an integrated circuit chip. The adapter comprises pads on an upper surface of a support in a pattern corresponding to the terminals on a integrated circuit, planar reroute lines on the upper surface with first ends at the pads, and vertical conductive vias extending through the support. The vias are connected at the upper surface to the second ends of the reroute lines. The vias are connected at the lower surface of the support to an area array of coupling elements. The pads and reroute lines can be fabricated on a tape-automated-bonding (TAB) frame support and personalized to match a particular configuration of terminals or bumps on a chip. The coupling elements can form a generic array compatible with a wide variety of interconnect substrates.

Abstract translation: 用于集成电路芯片的外围设备适配器。 适配器包括在支撑体的上表面上的与集成电路上的端子相对应的图案的焊盘，在上表面上的平面重新路线，其中在焊盘处具有第一端，以及垂直导电通孔延伸穿过支撑件。 通孔在上表面连接到再路由线的第二端。 通孔在支撑体的下表面处连接到耦合元件的区域阵列。 焊盘和重新路由线可以在带自动绑定（TAB）框架支架上制造并且被个性化以匹配芯片上的端子或凸块的特定配置。 耦合元件可以形成与各种互连基板兼容的通用阵列。

公开(公告)号：US5317006A

公开(公告)日：1994-05-31

申请号：US771353

申请日：1991-10-04

Applicant: Nalin Kumar

Inventor： Nalin Kumar

IPC: C23C14/34 ,  C23C14/56 ,  H01J37/34 ,  H01L39/24 ,  H01L39/00 ,  C23C14/35

CPC classification number: H01J37/3402 ,  C23C14/3407 ,  C23C14/56 ,  H01J37/3277 ,  H01J37/342 ,  H01L39/2435 ,  Y10S505/731 ,  Y10S505/786 ,  Y10S505/816

Abstract: An improved cathode for a sputtering system includes a metal cylinder and strips of material bonded to the inside of the metal cylinder and/or material sprayed onto the inside of the metal cylinder. The strips may have various specified compositions and/or configurations and/or other characteristics which enhance the ability of the sputtering system to deposit films of high temperature superconductor material on substrates.

Abstract translation: 用于溅射系统的改进的阴极包括金属圆筒和粘合到金属圆筒内部和/或喷射到金属圆筒内部的材料的材料条。 条带可以具有各种指定的组成和/或构造和/或其他特性，其增强了溅射系统将高温超导体材料的膜沉积在衬底上的能力。

公开(公告)号：US5314003A

公开(公告)日：1994-05-24

申请号：US813960

申请日：1991-12-24

Applicant: Colin A. Mackay

Inventor： Colin A. Mackay

IPC: B22D23/06 ,  B22F3/10 ,  B22F3/105

CPC classification number: B22F3/10 ,  B22D23/06 ,  B22F3/1055 ,  Y02P10/295 ,  Y10T428/12111 ,  Y10T428/1234

Abstract: Three-dimensional metal parts are fabricated by irradiating a thin layer of a mixture of metal powder and temperature equalization and unification vehicle to melt the metal powder and form a solid metal film. The vehicle also protects the molten metal from oxidation. The metal powder can contain an elemental metal or several metals, the vehicle can be an organic resin or an amalgam, and the irradiation can be selectively applied by a YAG laser.

Abstract translation: 通过照射金属粉末和温度均衡和均匀载体的混合物的薄层来熔化金属粉末并形成固体金属膜来制造三维金属部件。 车辆还保护熔融金属不被氧化。 金属粉末可以含有元素金属或多种金属，车辆可以是有机树脂或汞齐，并且可以通过YAG激光器选择性地施加照射。