Drawing Apparatus
    131.
    发明申请
    Drawing Apparatus 有权
    绘图仪

    公开(公告)号:US20080244158A1

    公开(公告)日:2008-10-02

    申请号:US12033549

    申请日:2008-02-19

    IPC分类号: G06F12/00

    摘要: A drawing apparatus which can create an exposure pattern rapidly. The drawing apparatus has a raster conversion processing module for converting vector images as wiring patterns into bitmap image data, an image cache module for temporarily storing a predetermined-size cached image supplied from the raster conversion processing module, a first compression module for compressing the cached image stored in the image cache module, a second compression module for compressing the cached image stored in the image cache module in a compression ratio differing from that of the first compression module, a comparison module for comparing data sizes of compressed data generated by the first and second compression modules and selecting one having a smaller data size, a memory access module for writing the compressed data selected by the comparison module, into a storage module, and a cache region control module for controlling a compression status of the cached image.

    摘要翻译: 可以快速创建曝光图案的绘图装置。 绘图装置具有用于将作为布线图案的矢量图像转换为位图图像数据的光栅转换处理模块,用于临时存储从光栅转换处理模块提供的预定大小的缓存图像的图像高速缓存模块,用于压缩缓存的第一压缩模块 存储在图像缓存模块中的图像,用于以与第一压缩模块不同的压缩比压缩存储在图像缓存模块中的高速缓存图像的第二压缩模块,用于比较由第一压缩模块生成的压缩数据的数据大小的比较模块 和第二压缩模块,并且选择具有较小数据大小的存储器访问模块,用于将由比较模块选择的压缩数据写入存储模块的存储器访问模块,以及用于控制缓存图像的压缩状态的高速缓存区域控制模块。

    Laser Beam Machining Method for Printed Circuit Board
    132.
    发明申请
    Laser Beam Machining Method for Printed Circuit Board 审中-公开
    印刷电路板激光束加工方法

    公开(公告)号:US20080237204A1

    公开(公告)日:2008-10-02

    申请号:US12031232

    申请日:2008-02-14

    IPC分类号: B23K26/38

    摘要: A laser beam machining method for a printed circuit board, for enabling to bring the depth of a bottom surface of grooves within an overlap region, which is irradiated with a laser beam, repetitively, to be nearly equal to that of the bottom surface of grooves within other regions, comprises the following steps of: fixing a line beam 4, which is shaped into a rectangular having a length sufficiently larger than its width, in a cross-section perpendicular to a central axis thereof; executing a belt-like machining on a certain region of the printed circuit board 6, while moving a mask 1 and the printed circuit board 6 in opposite directions, in a direction of the width of the line beam 4 (i.e., X-direction); and thereafter moving the mask 1 and the printed circuit board 6, relatively, into a direction perpendicular to the belt-like machining direction, and repeating the belt-like machining upon other region, newly, thereby machining a groove on the printed circuit board 6, wherein when repeating the machining overlapping the regions, the machining is conducted with using the line beam 4 being shaped to be oblique on its overlapping side, to be overlapped on that region.

    摘要翻译: 一种用于印刷电路板的激光束加工方法,其能够使被激光束照射的重叠区域内的凹槽的底面的深度重复地与槽的底面的深度相等 在其他区域内,包括以下步骤:在垂直于其中心轴线的横截面中固定成形为具有足够大于其宽度的长度的矩形的线束4; 在沿着线束4的宽度方向(即X方向)移动掩模1和印刷电路板6的相反方向上,在印刷电路板6的某个区域上执行带状加工, ; 然后将掩模1和印刷电路板6相对地移动到垂直于带状加工方向的方向上,并且重新进行其他区域的带状加工,从而在印刷电路板6上加工凹槽 其中,当重复所述加工与所述区域重叠时,使用在其重叠侧成形为倾斜的线束4进行加工,以在该区域上重叠。

    Method and Apparatus for Forming a Plurality of Laser Beams With Ultraviolet Wavelength, and Laser Machining Apparatus
    133.
    发明申请
    Method and Apparatus for Forming a Plurality of Laser Beams With Ultraviolet Wavelength, and Laser Machining Apparatus 审中-公开
    用紫外线波长形成多个激光束的方法和装置以及激光加工装置

    公开(公告)号:US20080232421A1

    公开(公告)日:2008-09-25

    申请号:US12111224

    申请日:2008-04-29

    IPC分类号: H01S3/08

    摘要: The invention provides a method and an apparatus for forming a plurality of ultraviolet-wavelength laser beams, and a laser machining apparatus, in which the machining efficiency can be improved due to easy maintenance and inspection while deterioration of wavelength conversion means can be prevented to reduce the running cost. A laser beam with a near infrared wavelength output from a laser oscillator is branched into a plurality of laser beams by a laser distribution unit. Each branched laser beam is partially converted into a laser beam whose wavelength is ½ of the near infrared wavelength by a wavelength converter. An ultraviolet laser beam whose wavelength is ⅓ of the near infrared wavelength of the laser beam is formed out of the branched laser beam and the laser beam with the wavelength which is ½ of the near infrared wavelength by another wavelength converter, both the branched laser beam and the laser beam with the wavelength which is ½ of the near infrared wavelength being output from the wavelength converter. The ultraviolet laser beam is extracted and supplied to a portion to be machined, by a wavelength separator.

    摘要翻译: 本发明提供一种用于形成多个紫外波长激光束的方法和装置,以及激光加工装置,其中由于易于维护和检查而可以提高加工效率,同时可以防止波长转换装置的劣化降低 运行成本。 从激光振荡器输出的具有近红外波长的激光束通过激光分配单元分支成多个激光束。 每个分支的激光束被波长转换器部分地转换成其波长为近红外波长的1/2的激光束。 波长为激光束的近红外波长的1/3的紫外激光束由分支激光束和波长为近红外波长的1/2的激光束由另一波长转换器形成, 激光束和波长为近红外波长1/2的波长的激光束从波长转换器输出。 通过波长分离器将紫外线激光束提取并供给到待加工的部分。

    Method and apparatus for perforating printed circuit board
    134.
    发明申请
    Method and apparatus for perforating printed circuit board 失效
    印刷电路板穿孔方法和装置

    公开(公告)号:US20060211158A1

    公开(公告)日:2006-09-21

    申请号:US11365657

    申请日:2006-03-02

    摘要: A method and an apparatus for perforating a printed circuit board are provided so that the processing efficiency and the board densification can be improved. In test processing, a conductor layer 50i is irradiated with a pulsed laser beam 4a whose energy density is set at a value high enough to process the conductor layer 50i while emission 23a from a processed portion is monitored. Thus, the number of pulses of irradiation required for processing a window in the conductor layer 50i is obtained. An insulating layer 51i is irradiated with a pulsed laser beam 5a whose energy density is set at a value high enough to process the insulating layer 51i but low enough not to process a conductor layer 50i+1 under the insulating layer 51i. Thus, the number of pulses of irradiation required for processing a window in the insulating layer 51i is obtained. The conductor layer 50i is irradiated with the laser beam 4a the obtained number of pulses of irradiation, and the insulating layer 51i is irradiated with the laser beam 5a the obtained number of pulses of irradiation. Thus, a hole is processed in the printed circuit board.

    摘要翻译: 提供了一种用于穿孔印刷电路板的方法和装置,从而可以提高处理效率和电路板致密化。 在测试处理中,用脉冲激光束4a照射导体层50i,脉冲激光束4a的能量密度被设定为足够高的值来处理导体层50i,同时监视来自处理部分的发射23a。 因此,获得了在导体层50i中处理窗口所需的照射脉冲数。 用脉冲激光束5a照射绝缘层51i,脉冲激光束5a的能量密度设定在足够高的值以处理绝缘层51i,但是足够低以至于不能在绝缘层51 i下处理导体层50i + 1 。 因此,获得了在绝缘层51i中处理窗口所需的照射脉冲数。 导体层50i用激光束4照射所获得的照射脉冲数,绝缘层51i用激光束5照射所获得的照射脉冲数。 因此,在印刷电路板中处理孔。

    Method and apparatus for laser drilling
    135.
    发明申请
    Method and apparatus for laser drilling 审中-公开
    激光钻孔的方法和装置

    公开(公告)号:US20060076323A1

    公开(公告)日:2006-04-13

    申请号:US11243998

    申请日:2005-10-06

    IPC分类号: B23K26/38

    摘要: There is provided a laser drilling method that prevents hanging, expansion, or crinkles of copper foil caused when an ultraviolet laser beam that requires no surface roughening is used for a thin double-sided copper-clad film. The drilling method of the copper-clad film comprises the steps of: using an ultraviolet laser as a laser beam; drilling after bonding a resin film to the backside of the film which is the opposite side to the laser-beam-incidence; and delaminating the resin film on the backside after drilling. The resin film bonded to the backside prevents the copper foil from hanging, thus allowing the laser beam to be efficiently applied to the copper foil, and allowing the copper foil to be completely removed by ablation. In the case of a blind hole, the resin film bonded to the backside prevents expansion of the copper foil. Crinkles can be also prevented.

    摘要翻译: 提供了一种激光打孔方法,当不需要表面粗糙化的紫外线激光束用于薄的双面覆铜膜时,防止铜箔的悬挂,膨胀或皱缩。 铜包膜的钻孔方法包括以下步骤:使用紫外线激光器作为激光束; 在将树脂膜粘合到与激光束入射的相反侧的膜的背面之后进行钻孔; 并在钻孔后在背面剥离树脂膜。 结合到背面的树脂膜防止铜箔悬垂,从而允许激光束有效地施加到铜箔上,并且通过烧蚀使铜箔完全去除。 在盲孔的情况下,结合到背面的树脂膜防止铜箔膨胀。 也可以防止皱纹。

    Active mass damper
    136.
    发明授权
    Active mass damper 失效
    主动减震器

    公开(公告)号:US06992450B2

    公开(公告)日:2006-01-31

    申请号:US11039947

    申请日:2005-01-24

    IPC分类号: H02P7/00

    CPC分类号: F16F7/1005 F16F15/02

    摘要: The invention provides an active mass damper by use of which a machining apparatus can be downsized. The active mass damper includes a support unit for supporting a weight movably and horizontally, a motor for driving the weight, and a controller for controlling the motor. A torque command signal to be given to a motor of an X-table and a torque command signal to be given to a motor of a Z-table are put into the controller of the active mass damper so that the motor for driving the weight can be driven by feed-forward control using the torque command signals and feedback control based on the displacement of the weight.

    摘要翻译: 本发明提供一种主动质量阻尼器,通过使用这种减震器可以减小加工装置的尺寸。 有源质量阻尼器包括用于可移动和水平地支撑重物的支撑单元,用于驱动重物的电动机和用于控制电动机的控制器。 将给予X台的电动机的转矩指令信号和给予Z表的电动机的转矩指令信号放入有源质量阻尼器的控制器中,使得用于驱动重量的电动机 通过使用转矩指令信号的前馈控制和基于重量位移的反馈控制来驱动。

    Method for determining position of reference point
    137.
    发明申请
    Method for determining position of reference point 有权
    确定参考点位置的方法

    公开(公告)号:US20050270518A1

    公开(公告)日:2005-12-08

    申请号:US11141393

    申请日:2005-06-01

    IPC分类号: H05K1/02 G03B27/32 H05K3/00

    摘要: A method for determining a position of a reference point in which there is no influence of aberration of a camera lens or the like, but an error caused by a failure in shape of an alignment mark can be reduced. An alignment mark consisting of a plurality of pattern portions (and background portions) centering at a design reference point is provided in advance. Positions of centers of border lines of the patterns are calculated. Obtained coordinate values of the centers are averaged in each axial direction. The averaged coordinate values are regarded as coordinate values of a machining reference point. Thus, even when a defect occurs in any pattern portion, an error caused by the defect is reduced so that the accuracy in machining can be improved.

    摘要翻译: 可以减小用于确定在其中没有一个照相机透镜等的像差的影响的参考点的位置的方法,但由在对准标记的形状的失败的错误。 预先设置由以设计基准点为中心的多个图案部分(和背景部分)构成的对准标记。 计算模式边界线中心的位置。 获得的中心坐标值在每个轴向平均。 平均坐标值被认为是加工参考点的坐标值。 因此,即使当在任何图案部分发生缺陷时,由缺陷引起的误差降低,从而可以提高加工精度。

    Optical scanner control method, optical scanner and laser machining apparatus
    138.
    发明申请
    Optical scanner control method, optical scanner and laser machining apparatus 有权
    光学扫描仪控制方法,光学扫描仪和激光加工设备

    公开(公告)号:US20050184156A1

    公开(公告)日:2005-08-25

    申请号:US10929519

    申请日:2004-08-31

    CPC分类号: G02B26/105 G02B7/1821

    摘要: A optical scanner control method and a optical scanner capable of positioning a mirror at a high speed independently of a rocking angle, and a laser machining apparatus for irradiating a printed circuit board with a laser beam by use of the optical scanner to thereby perforate the printed circuit board. In order to operate an actuator for rocking the mirror based on a deviation of a current position from an commanded value, a change in gain of the actuator is measured in accordance with each rocking angle in advance, and the manipulated variable of the actuator is corrected to cancel the change in gain. Thus, the influence of the alteration of a torque constant in accordance with the rocking angle can be suppressed so that the response characteristic becomes uniform all over a scanning region, and the positioning speed can be improved.

    摘要翻译: 一种光学扫描仪控制方法和能够独立于摇摆角度高速定位反射镜的光学扫描仪,以及激光加工设备,用于通过使用光学扫描器用激光束照射印刷电路板,从而穿孔印刷 电路板。 为了操作基于当前位置与指令值的偏差来摇动反射镜的致动器,预先根据每个摇摆角度来测量致动器的增益的变化,并且校正致动器的操纵变量 取消收益变动。 因此,可以抑制根据摆动角度的转矩常数的变化的影响,使得在整个扫描区域上的响应特性变得均匀,并且可以提高定位速度。

    Active mass damper
    139.
    发明申请
    Active mass damper 失效
    主动减震器

    公开(公告)号:US20050162110A1

    公开(公告)日:2005-07-28

    申请号:US11039947

    申请日:2005-01-24

    CPC分类号: F16F7/1005 F16F15/02

    摘要: The invention provides an active mass damper by use of which a machining apparatus can be downsized. The active mass damper includes a support unit for supporting a weight movably and horizontally, a motor for driving the weight, and a controller for controlling the motor. A torque command signal to be given to a motor of an X-table and a torque command signal to be given to a motor of a Z-table are put into the controller of the active mass damper so that the motor for driving the weight can be driven by feed-forward control using the torque command signals and feedback control based on the displacement of the weight.

    摘要翻译: 本发明提供一种主动质量阻尼器,通过使用这种减震器可以减小加工装置的尺寸。 有源质量阻尼器包括用于可移动和水平地支撑重物的支撑单元,用于驱动重物的电动机和用于控制电动机的控制器。 将给予X台的电动机的转矩指令信号和给予Z表的电动机的转矩指令信号放入有源质量阻尼器的控制器中,使得用于驱动重量的电动机 通过使用转矩指令信号的前馈控制和基于重量位移的反馈控制来驱动。

    Laser beam machining apparatus
    140.
    发明申请
    Laser beam machining apparatus 审中-公开
    激光束加工设备

    公开(公告)号:US20050098549A1

    公开(公告)日:2005-05-12

    申请号:US11014778

    申请日:2004-12-20

    IPC分类号: B23K26/08 H05K3/00

    摘要: The present invention relates to a laser beam machining apparatus which enables plural sheets of work to be mounted so as to be simultaneously processed, and which has a small size, even in the case where the number of sheets of work is increased. The laser beam machining apparatus includes a XY table which enables a work to be mounted on a bed of the laser beam machining unit and which is movable in the X and Y axis directions, and a gate-shaped over-frame having a laser irradiation optical system which irradiates a laser beam on the above described work so as to perform drilling or cutting, wherein the above described laser irradiation optical system is supported so as to be movable in the Z axis direction, wherein the bed of the laser beam machining unit is cut out in left and right front portions so as to make installation parts for leg parts of the gate-shaped over-frame left behind, and wherein a work feed unit and a work discharge unit are arranged so as to be inserted into the above described left and right front cutout portions.

    摘要翻译: 激光束加工装置技术领域本发明涉及即使在增加工作张数的情况下,能够使多张作业被同时加工并且尺寸小的激光加工装置。 激光束加工装置包括XY工作台,其能够将工件安装在激光加工单元的床上并且可以在X和Y轴方向上移动,并且具有激光照射光学的门形过框架 在上述工件上照射激光以进行钻孔或切割的系统,其中上述激光照射光学系统被支撑为能够在Z轴方向上移动,其中激光束加工单元的床是 在左右前部切割,以便使门形的超框架的腿部的安装部件留在后面,并且其中工件供给单元和卸料单元布置成插入到上述 左右前切口部。