公开(公告)号：US5698819A

公开(公告)日：1997-12-16

申请号：US420061

申请日：1995-04-11

Applicant: Stephen Neil Brockett ,  Colin Stratford

Inventor： Stephen Neil Brockett ,  Colin Stratford

IPC: H01H36/00 ,  H05K3/34 ,  H02G3/08 ,  H05K7/10

CPC classification number: H05K3/3426 ,  H01H36/0033 ,  H01H2001/5888 ,  H05K2201/10053 ,  H05K2201/10651 ,  H05K2201/10916 ,  Y02P70/613

Abstract: A surface mount electronic reed switch component (10) is provided having a rod-shaped pad element (40) connected in transverse relationship to the outer end (30) of each switch lead (12, 14) of the reed switch (10) to provide a stable surface mounting foot without bending the leads (12,14) to thus avoid adversely affecting the switch gap (28) defined by the inner ends (22,24) of the leads (12,14). Element (40) may be of round, square, rectangular or tubular cross-section.

Abstract translation: 提供了一种表面安装式电子舌簧开关元件（10），其具有与舌簧开关（10）的每个开关引线（12,14）的外端（30）横向相连的杆形垫元件（40）， 提供稳定的表面安装脚而不弯曲引线（12,14），从而避免不利地影响由引线（12,14）的内端（22,24）限定的开关间隙（28）。 元件（40）可以是圆形，正方形，矩形或管状横截面。

公开(公告)号：US5461539A

公开(公告)日：1995-10-24

申请号：US386337

申请日：1995-02-10

Applicant: Chojiro Kuriyama ,  Eisaku Tanaka

Inventor： Chojiro Kuriyama ,  Eisaku Tanaka

IPC: G01K11/12 ,  H01G4/224 ,  H01G9/00 ,  H01G9/08 ,  H01G9/12 ,  H01H85/30 ,  H01L23/28 ,  H01L23/544 ,  H05K1/02 ,  H05K3/34 ,  H01G9/06

CPC classification number: H01G4/224 ,  H01G9/08 ,  H01H85/30 ,  H01L23/544 ,  H05K1/0201 ,  H01L2223/5442 ,  H01L2223/54473 ,  H01L2223/54486 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/8592 ,  H01L2924/181 ,  H05K1/0266 ,  H05K1/0269 ,  H05K2201/10015 ,  H05K2201/10151 ,  H05K2201/10651 ,  H05K2203/161 ,  H05K2203/304 ,  H05K3/341

Abstract: An electronic component is provided which comprises a resin package for enclosing inside parts. The package has a heat sensitive surface portion provided with a heat sensitive material which irreversibly discolors at a temperature higher than the soldering temperature for the electronic component. The component may be a solid tantalum capacitor, solid aluminum capacitor, diode or transistor which generates heat under abnormal operating conditions.

Abstract translation: 提供一种电子部件，其包括用于封闭内部部件的树脂封装。 该封装具有设置有热敏材料的热敏表面部分，其在比电子部件的焊接温度高的温度下不可逆地变色。 该组件可以是在异常操作条件下产生热量的固体钽电容器，固体铝电容器，二极管或晶体管。

公开(公告)号：US5451716A

公开(公告)日：1995-09-19

申请号：US302454

申请日：1994-09-09

Applicant: Miki Hasegawa ,  Yasuo Kanetake

Inventor： Miki Hasegawa ,  Yasuo Kanetake

IPC: H01L23/48 ,  H01L21/48 ,  H01L23/495 ,  H01L23/50 ,  H05K1/18 ,  H05K3/34 ,  H01L23/02

CPC classification number: H01L21/4842 ,  H01L23/49555 ,  H05K3/3426 ,  H01L2924/0002 ,  H05K2201/10651 ,  H05K2201/10689 ,  H05K2201/10984 ,  H05K2203/041 ,  Y02P70/613 ,  Y10T29/4914

Abstract: An electronic component is provided which comprises a resin package for enclosing inside parts, and at least one lead terminal projecting out from the resin package to have a bonding end. The lead terminal is bent to provide an armpit-like portion between the lead terminal and the resin package for retaining a solder wire in a sandwiched state. At the time of mounting the electronic component to a circuit board, the solder wire be caused to melt at a soldering temperature for merging with solder fillets along the bonding end of the lead terminal.

Abstract translation: 提供一种电子部件，其包括用于封装内部部件的树脂封装体和至少一个从树脂封装体伸出以具有粘结端的引线端子。 引线端子被弯曲以在引线端子和树脂封装之间提供腋窝状部分，用于将焊丝保持在夹持状态。 在将电子部件安装到电路板时，使焊丝在焊接温度下熔化，以与沿着引线端子的接合端的焊锡焊片合并。

公开(公告)号：US5143277A

公开(公告)日：1992-09-01

申请号：US825068

申请日：1992-01-24

Applicant: Pascal Roche ,  Claude Courtin

Inventor： Pascal Roche ,  Claude Courtin

IPC: H01L23/50 ,  B23K20/02 ,  H01L21/603 ,  H05K1/00 ,  H05K1/02 ,  H05K3/34 ,  H05K13/04

CPC classification number: H01L24/80 ,  B23K20/023 ,  H05K13/0465 ,  H05K3/3421 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01014 ,  H01L2924/01033 ,  H01L2924/01058 ,  H01L2924/01063 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/351 ,  H05K1/0271 ,  H05K1/0393 ,  H05K2201/10469 ,  H05K2201/10484 ,  H05K2201/10651 ,  H05K2201/10757 ,  H05K2203/0195 ,  Y02P70/613 ,  Y10T29/49135

Abstract: Disclosed is a method for the mounting, on an flexible substrate, of miniature electronic components of the beam lead type. Said method consists, after a first connection lead of a component has been soldered to the substrate, in arching each of the other connection leads of the component considered during their soldering by pressing the connection lead considered on a metallized zone of the substrate by means of a tip of a soldering tool while, at the same time, making a approaching movement towards the body of the component considered with this tip before carrying out the soldering operation itself. Through this mounting method, the beam lead electronic components are no longer placed flat against the substrate with their connection leads in an extended position but are arched on these leads. This gives them a freedom of play that enables them to absorb mechanical stresses by adopting positions of greater flatness or lesser flatness on the substrate.

Abstract translation: 公开了一种用于在柔性基板上安装光束引线型微型电子部件的方法。 所述方法包括：在将部件的第一连接引线焊接到基板之后，在焊接期间考虑的部件的其它连接引线中的每个连接引线，通过在基板的金属化区域上压制连接引线，借助于 同时在进行焊接操作本身之前同时朝向与该尖端相关的部件的主体接近移动。 通过这种安装方法，光束引线电子部件不再放置在基板的平面上，其连接引线处于延伸位置，而是在这些引线上拱起。 这使它们具有游戏自由度，使得它们能够通过采用更大的平坦度或更小平坦度的位置来吸收机械应力。

公开(公告)号：US4918573A

公开(公告)日：1990-04-17

申请号：US393154

申请日：1989-08-14

Applicant: Dean J. Stavraka ,  John W. Swann

Inventor： Dean J. Stavraka ,  John W. Swann

IPC: H05K3/30

CPC classification number: H05K3/306 ,  H05K2201/09127 ,  H05K2201/09954 ,  H05K2201/10651 ,  H05K2201/2036 ,  H05K3/301

Abstract: A component spacer is disposed in an electrical circuit between a circuit component such as a resistor having two leads and a printed circuit board to which the resistor leads are connected to maintain a gap between them. The component spacer has a generally flat partition with vertically extending projections for contacting the printed circuit board. An elongated slot defined by a bifurcated section and a spaced aperture extend through the partition for receiving the resistor leads.

Abstract translation: 组件间隔件设置在诸如具有两个引线的电阻器的电路部件和连接有电阻器引线的印刷电路板之间的电路中，以在它们之间保持间隙。 部件间隔件具有大致平坦的隔板，其具有用于接触印刷电路板的垂直延伸的突起。 由分叉部分和间隔开的孔限定的细长槽延伸穿过隔板以接收电阻器引线。

公开(公告)号：US4704790A

公开(公告)日：1987-11-10

申请号：US805693

申请日：1985-12-06

Applicant: Henry J. Soth

Inventor： Henry J. Soth

IPC: H05K3/30 ,  H05K3/34 ,  H05K13/04

CPC classification number: H05K3/308 ,  H05K13/0473 ,  H05K2201/10651 ,  H05K2201/10856 ,  H05K2201/10878 ,  H05K3/3447 ,  Y10T29/4914

Abstract: A component lead tip protruding from a hole of a circuit board is split and displaced in order to attach the component to the circuit board. Trimming of the lead to a preferred length generally simultaneously with the splitting is also possible.

Abstract translation: 从电路板的孔突出的部件引线端头被分离和移位，以将部件附接到电路板。 通常与分割同时将导线修剪到优选长度也是可能的。

公开(公告)号：US4696105A

公开(公告)日：1987-09-29

申请号：US925849

申请日：1986-10-30

Applicant: Edward F. Breya

Inventor： Edward F. Breya

IPC: H05K3/30 ,  H05K3/34

CPC classification number: H05K3/3447 ,  H05K3/306 ,  H05K2201/09063 ,  H05K2201/10469 ,  H05K2201/10492 ,  H05K2201/10651 ,  Y10T29/49144

Abstract: A method for mounting electrical components or wires having connections both on and off circuit boards is provided in which the component is machine inserted and flow soldered along with other parts. Leads to be connected off the board are inserted into dummy holes, i.e., holes having no metallic pads or plating, so that these leads are not bonded to the board during the flow solder process. In the final assembly stage, the unbonded leads are raised from the board and electrically and mechanically connected to a terminal of an off-board component.

Abstract translation: 提供了一种用于安装具有接通和断开电路板连接的电气部件或电线的方法，其中所述部件被机器插入并与其他部件一起流动焊接。 导线从板上连接插入虚拟孔，即没有金属焊盘或电镀的孔，使得这些引线在流焊过程中不粘合到板上。 在最终组装阶段，未连接的引线从板上升起并且电气和机械地连接到板外部件的端子。

公开(公告)号：US4554614A

公开(公告)日：1985-11-19

申请号：US498618

申请日：1983-05-27

Applicant: Hendricus M. van der Wijst

Inventor： Hendricus M. van der Wijst

IPC: H04B1/06 ,  H05K1/02 ,  H05K1/03 ,  H05K1/18 ,  H05K3/34

CPC classification number: H05K1/0353 ,  H05K1/024 ,  H05K1/18 ,  H05K2201/0187 ,  H05K2201/1003 ,  H05K2201/10166 ,  H05K2201/10174 ,  H05K2201/1053 ,  H05K2201/10651 ,  H05K3/3447

Abstract: A supporting plate having a network of conductors, on which supporting plate a number of circuit components are placed which are interconnected in the network of conductors in an electric circuit. In a place of the circuit which is sensitive to moisture, a board opening is provided in which a member of a minimum moisture-absorbing material is fitted. The connections of the surrounding circuit components extend in an aperture of the member and are electrically interconnected there. The stability of the circuit is considerably improved thereby in particular in the case in which the circuit is an oscillator circuit.

Abstract translation: 具有导体网络的支撑板，支撑板上放置有多个电路部件，其在电路中的导体网络中互连。 在对水分敏感的电路的位置，提供了一个板开口，其中安装了最小吸湿材料的构件。 周围的电路元件的连接部分延伸在该元件的孔中，并在其中电连接。 电路的稳定性大大提高，特别是在电路是振荡电路的情况下。

公开(公告)号：US4542439A

公开(公告)日：1985-09-17

申请号：US625273

申请日：1984-06-27

Applicant: Bernard M. Dick

Inventor： Bernard M. Dick

IPC: H05K3/30 ,  H05K3/34 ,  H05K1/18

CPC classification number: H05K3/303 ,  H05K3/3426 ,  H05K2201/10583 ,  H05K2201/10651 ,  H05K2203/0186 ,  Y02P70/613

Abstract: A surface mount component (11) has at least one lead (12) which extends from a body portion (16) of the component (11) along an axis (14) through the component. An outer end portion of the lead (12) is formed into a circuit termination (20) of a shape which, when projected onto a plane perpendicular to the axis, encompasses a projection of the body portion (16) of the component onto the plane.

Abstract translation: 表面安装部件（11）具有至少一个引线（12），其从部件（11）的主体部分（16）沿轴线（14）延伸穿过部件。 引线（12）的外端部形成为一个电路终端（20），该电路端子（20）当被投影到垂直于该轴线的平面上时，包围该部件的本体部分（16）在该平面上的突起 。

公开(公告)号：US4541034A

公开(公告)日：1985-09-10

申请号：US604297

申请日：1984-04-26

Applicant: William J. Fanning

Inventor： William J. Fanning

IPC: H05K3/30 ,  H01R9/00 ,  H05K1/00

CPC classification number: H01R12/58 ,  H05K3/308 ,  H05K2201/10651 ,  H05K2201/10757 ,  H05K2201/10856 ,  H05K2201/10871 ,  H05K2201/10878

Abstract: A thru-hole insertable terminal (10, 50, 60) includes an upper shank portion (12, 52, 66) preferably adapted for soldered securement to an end electrode (24) of a component (20), such as a capacitor. A lower shank portion (14, 54, 68) is dimensioned and adapted for minimal initial contact insertion into, and the temporary securement thereafter within, an oversized thru-hole (26, 58, 62) of a supporting substrate, such as a circuit board (28, 59, 64). At least one upwardly extending free-ended tab (32, 56, 72, 74) is formed in the lower terminal shank portion (14, 54, 68), and is oriented in the major plane thereof until after the insertion thereof within an associated substrate-formed thru-hole (26, 58, 62). Stop means (14b, 14c, 54b, 54c, 68b, 68c) also formed in the lower terminal shank portion is adapted to position the upper free end of the tab at an elevation preferably below the upper open end of a confining thru-hole. The tab (32, 56, 72, 74) is also dimensioned such that, when thusly positioned, the lower integral end thereof extends at least to the lower open end of the thru-hole. This results in the upper free end of the tab being pivoted against the sidewall of the confining thru-hole in response to a then downwardly protruding end region (14d, 54d, 68d) of the lower terminal shank portion being clinched against the underside of the supporting substrate (28, 59, 64). The thusly pivoted tab advantageously not only facilitates the temporary securement of the terminal within the associated thru-hole, but the establishment thereafter of a reliable, permanent soldered connection therebetween.

Abstract translation: 通孔可插入端子（10,50,60）包括优选地适于焊接固定到诸如电容器的部件（20）的端电极（24）的上部分部分（12,52,66）。 尺寸适合于下部柄部分（14,54,68），以便最小的初始接触插入到其后的临时固定中，在支撑衬底（例如电路）的过大通孔（26,58,62）内 （28,59,64）。 至少一个向上延伸的自由端突片（32,56,72,74）形成在下端子柄部分（14,54,68）中，并且在其主平面中定向，直到其插入相关联的 基板形成的通孔（26,58,62）。 还形成在下端子柄部分中的止动装置（14b，14c，54b，54c，68b，68c）适于将突出部的上自由端定位在优选在限制通孔的上开口端下方的高度处。 突片（32,56,72,74）的尺寸也被设计成使得当这样定位时，其下部整体端至少延伸到通孔的下开口端。 这导致突片的上部自由端响应于下端子柄部分的下一个向下突出的端部区域（14d，54d，68d）被抵靠着封闭通孔的侧壁 支撑衬底（28,59,64）。 有利的是，枢轴接头不仅有利于将端子临时固定在相关的通孔内，而且有利于在其间建立可靠的永久焊接连接。