公开(公告)号：US20120212904A1

公开(公告)日：2012-08-23

申请号：US13358506

申请日：2012-01-25

Applicant: Robert Fleming ,  Lex Kosowsky ,  Junjun Wu

Inventor： Robert Fleming ,  Lex Kosowsky ,  Junjun Wu

IPC: H05K1/03

CPC classification number: H01B1/18 ,  H01C7/1006 ,  H01L27/0288 ,  H05K1/0259 ,  H05K1/036 ,  H05K1/0373 ,  H05K1/0393 ,  H05K1/167 ,  H05K2201/0738

Abstract: Embodiments described herein provide for flexible circuits and flexible substrates comprising VSD material that has superior characteristics for its use as an integral structural component of a device.

Abstract translation: 本文描述的实施例提供了柔性电路和包括VSD材料的柔性基底，其具有优异的特性，用作其作为装置的整体结构部件。

公开(公告)号：US20120200963A1

公开(公告)日：2012-08-09

申请号：US13291090

申请日：2011-11-07

Applicant: Daniel Vasquez ,  Lex Kosowsky

Inventor： Daniel Vasquez ,  Lex Kosowsky

IPC: H02H9/04 ,  G06F17/50

CPC classification number: G06F17/5068 ,  H05K1/0259 ,  H05K1/0293 ,  H05K1/0373 ,  H05K3/0005 ,  H05K2201/0738 ,  H05K2203/105

Abstract: Embodiments described herein provide for programmatic design or simulation of substrates carrying electrical elements to integrate voltage switchable dielectric (“VSD”) material as a protective feature. In particular, VSD material may be incorporated into the design of a substrate device for purpose of providing protection against transient electrical conditions, such as electrostatic discharge (ESD).

Abstract translation: 本文描述的实施例提供了用于编程设计或模拟承载电气元件的基板以将可切换电压（“VSD”）材料集成为保护特征。 特别地，可以将VSD材料并入衬底装置的设计中，以便提供对诸如静电放电（ESD）等瞬态电气条件的保护。

公开(公告)号：US20110211319A1

公开(公告)日：2011-09-01

申请号：US13035791

申请日：2011-02-25

Applicant: Lex Kosowsky ,  Robert Fleming ,  Bhret Graydon ,  Daniel Vasquez

Inventor： Lex Kosowsky ,  Robert Fleming ,  Bhret Graydon ,  Daniel Vasquez

IPC: H05K1/18

CPC classification number: H05K1/0254 ,  H05K1/0259 ,  H05K1/181 ,  H05K2201/0738 ,  H05K2203/304

Abstract: Printed circuit boards including voltage switchable dielectric materials (VSDM) are disclosed. The VSDMs are used to protect electronic components, arranged on or embedded in printed circuit boards, against electric discharges, such as electrostatic discharges or electric overstresses. During an overvoltage event, a VSDM layer shunts excess currents to ground, thereby preventing electronic components from destruction or damage.

Abstract translation: 公开了包括可切换电介质材料（VSDM）的印刷电路板。 VSDM用于保护布置在印刷电路板上或嵌入印刷电路板中的电子部件，以防止放电，例如静电放电或电动过载。 在过电压事件期间，VSDM层将多余的电流分流到地，从而防止电子部件破坏或损坏。

公开(公告)号：US20110132645A1

公开(公告)日：2011-06-09

申请号：US12954605

申请日：2010-11-24

Applicant: Ning Shi ,  Robert Fleming ,  Junjun Wu ,  Lex Kosowsky

Inventor： Ning Shi ,  Robert Fleming ,  Junjun Wu ,  Lex Kosowsky

IPC: H05K1/09 ,  C01G9/02 ,  C01G29/00 ,  C01G41/02 ,  C01B19/04 ,  B32B15/04 ,  H01C17/06

CPC classification number: H01C7/105 ,  C01G9/02 ,  C01G29/00 ,  C01G41/02 ,  C01P2006/40 ,  H01C7/10 ,  H01C7/112 ,  H01C17/06 ,  H01L2224/48091 ,  H01L2224/48465 ,  H01L2224/73265 ,  H05K1/0257 ,  H05K1/0259 ,  H05K2201/0738 ,  Y10T29/49099 ,  Y10T428/31678 ,  H01L2924/00014 ,  H01L2924/00

Abstract: Embodiments described include a non-polymeric voltage switchable dielectric (VSD) material comprising substantially of a grain structure formed from only a single compound, processes for making same, and applications for using such non-polymeric VSD materials.

Abstract translation: 所描述的实施例包括基本上由仅由单一化合物形成的晶粒结构，其制备方法和使用这种非聚合物VSD材料的应用的非聚合物电压可切换电介质（VSD）材料。

公开(公告)号：US20110058291A1

公开(公告)日：2011-03-10

申请号：US12878344

申请日：2010-09-09

Applicant: Lex Kosowsky ,  Robert Fleming

Inventor： Lex Kosowsky ,  Robert Fleming

IPC: H02H9/00 ,  H01C7/10 ,  H01C7/12 ,  H05K1/00 ,  H05K7/00 ,  H02H3/22 ,  H03H11/40

CPC classification number: H01C7/10 ,  H01C7/12 ,  H05K1/0257 ,  H05K1/0259 ,  H05K1/167 ,  H05K2201/0738

Abstract: an electrical device that includes a first electrode and a second electrode that are separated from one another so as to form a gap structure. A layer of protective material spans the gap structure to contact the first electrode and the second electrode. A dimension of the gap structure, corresponding to a separation distance between the first electrode and the second electrode, is varied and includes a minimum separation distance that coincides with a critical path of the layer of protective material between the first electrode and the second electrode.

Abstract translation: 电气装置，其包括彼此分离以形成间隙结构的第一电极和第二电极。 一层保护材料跨越间隙结构以接触第一电极和第二电极。 相应于第一电极和第二电极之间的间隔距离的间隙结构的尺寸是变化的并且包括与第一电极和第二电极之间的保护材料层的关键路径一致的最小间隔距离。

公开(公告)号：US07883643B2

公开(公告)日：2011-02-08

申请号：US10274904

申请日：2002-10-21

Applicant: Chi-Ming Chan ,  Kai-Mo Ng ,  Catherine Yuen-Chien Wong ,  Ying Kit Cheung

Inventor： Chi-Ming Chan ,  Kai-Mo Ng ,  Catherine Yuen-Chien Wong ,  Ying Kit Cheung

IPC: H01C7/12 ,  H01C7/10

CPC classification number: H01B1/22 ,  H05K1/0257 ,  H05K1/0259 ,  H05K1/167 ,  H05K2201/0738 ,  Y10T428/257 ,  Y10T428/31663

Abstract: The invention provides a process for preparing an overvoltage protection material comprising: (i) preparing a mixture comprising a polymer binder precursor and a conductive material; and (ii) heating the mixture to cause reaction of the polymer binder precursor and generate a polymer matrix having conductive material dispersed therein, wherein the polymer binder precursor is chosen such that substantially no solvent is generated during the reaction.

Abstract translation: 本发明提供一种制备过电压保护材料的方法，包括：（i）制备包含聚合物粘合剂前体和导电材料的混合物; 和（ii）加热混合物以引起聚合物粘合剂前体的反应并产生其中分散有导电材料的聚合物基质，其中选择聚合物粘合剂前体使得在反应期间基本上不产生溶剂。

公开(公告)号：US20100264224A1

公开(公告)日：2010-10-21

申请号：US12820897

申请日：2010-06-22

Applicant: Lex Kosowsky

Inventor： Lex Kosowsky

IPC: G06K19/077 ,  G06K19/02

CPC classification number: G06K19/02 ,  G06K19/0701 ,  G06K19/0715 ,  G06K19/07735 ,  G06K19/07749 ,  H01L23/60 ,  H01L23/66 ,  H01L2223/6677 ,  H01L2924/0002 ,  H01L2924/12044 ,  H01L2924/14 ,  H01Q1/2225 ,  H01Q7/00 ,  H05K1/0254 ,  H05K1/0373 ,  H05K2201/0738 ,  Y10T29/49016 ,  H01L2924/00

Abstract: A wireless communication device, such as an RFID tag, is provided material that is dielectric, unless a voltage is applied that exceeds the materials characteristic voltage level. In the presence of such voltage, the material becomes conductive. The integration of such material into the device may be mechanical and/or electrical.

公开(公告)号：US20100155672A1

公开(公告)日：2010-06-24

申请号：US12714354

申请日：2010-02-26

Applicant: Lex KOSOWSKY ,  Robert Fleming

Inventor： Lex KOSOWSKY ,  Robert Fleming

IPC: H01B1/04 ,  H01B1/02 ,  H01B1/12

CPC classification number: H01C17/06586 ,  B82Y10/00 ,  H01C7/105 ,  H01C17/0652 ,  H05K1/0257 ,  H05K1/0259 ,  H05K1/0373 ,  H05K2201/0209 ,  H05K2201/026 ,  H05K2201/0281 ,  H05K2201/0323 ,  H05K2201/0738

Abstract: One or more embodiments provide for a composition that includes (i) organic material that is conductive or semi-conductive, and (ii) conductor and/or semiconductor particles other than the organic material. The organic material and the conductor and/or semiconductor particles are combined to provide the composition with a characteristic of being (i) dielectric in absence of a voltage that exceeds a characteristic voltage level, and (ii) conductive with application of the voltage exceeding the characteristic voltage level.

Abstract translation: 一个或多个实施方案提供了组合物，其包括（i）导电或半导电的有机材料，和（ii）有机材料以外的导体和/或半导体颗粒。 有机材料和导体和/或半导体颗粒被组合以提供组合物的特征是：（i）不存在超过特征电压水平的电压的电介质，以及（ii）通过施加超过 特征电压电平。

公开(公告)号：US20100148129A1

公开(公告)日：2010-06-17

申请号：US12638632

申请日：2009-12-15

Applicant: Lex Kosowsky ,  Robert Fleming ,  Ning Shi ,  Junjun Wu ,  Pragnya Saraf

Inventor： Lex Kosowsky ,  Robert Fleming ,  Ning Shi ,  Junjun Wu ,  Pragnya Saraf

IPC: H01B1/12 ,  H01B1/22 ,  H01B1/08

CPC classification number: H05K1/0257 ,  H05K1/0259 ,  H05K1/0373 ,  H05K2201/0221 ,  H05K2201/0272 ,  H05K2201/0738

Abstract: A composition of voltage switchable dielectric (VSD) material that comprises a concentration of core shell particles that individually comprise an insulative core and one or more shell layers.

Abstract translation: 可变压电介质（VSD）材料的组合物，其包含单独包含绝缘芯和一个或多个壳层的芯壳颗粒的浓度。

公开(公告)号：US07688598B2

公开(公告)日：2010-03-30

申请号：US11356562

申请日：2006-02-16

Applicant: George Dudnikov, Jr. ,  Franz Gisin ,  Gregory J. Schroeder

Inventor： George Dudnikov, Jr. ,  Franz Gisin ,  Gregory J. Schroeder

IPC: H05K7/00

CPC classification number: H05K1/0257 ,  H01L23/62 ,  H01L2924/0002 ,  H05K1/0259 ,  H05K1/0298 ,  H05K1/167 ,  H05K2201/0738 ,  H05K2201/09309 ,  H01L2924/00

Abstract: The protection of sensitive components on printed circuit boards by using planar transient protection material in one or more layers of a printed circuit board stackup is disclosed.

Abstract translation: 公开了通过在印刷电路板叠层的一层或多层中使用平面瞬态保护材料来保护印刷电路板上的敏感部件。