公开(公告)号：US5597470A

公开(公告)日：1997-01-28

申请号：US491809

申请日：1995-06-18

Applicant: Konstantine Karavakis ,  Thomas H. DiStefano ,  Joseph Fjelstad

Inventor： Konstantine Karavakis ,  Thomas H. DiStefano ,  Joseph Fjelstad

IPC: H01L21/48 ,  H01L23/498 ,  H05K3/40 ,  C25D5/02

CPC classification number: H01L23/4985 ,  H01L21/4846 ,  H05K3/4092 ,  H01L2924/0002

Abstract: A method for providing a flexible lead for a microelectronic device. A lead such as nickel or a nickel alloy is provided in elongated strips on a base material such as copper, which in turn overlies a dielectric sheet. The base material is etched from beneath bond regions of the lead material strips and a cover layer of a bondable material such as gold selectively provided around the lead material strips. The lead material strips act as plating mandrels, and allow rapid deposition of the cover material. A detachment area may be provided in each lead so that the leads may be detached and displaced within a bonding window in the dielectric sheet for attachment to chip contacts.

Abstract translation: 一种用于为微电子器件提供柔性引线的方法。 诸如镍或镍合金的引线设置在诸如铜的基底材料上的细长条中，其又覆盖在电介质片上。 从铅材料条的接合区下方蚀刻基材，并且可以选择性地设置在引线材料带周围的诸如金的可结合材料的覆盖层。 铅材料条作为电镀心轴，并允许覆盖材料的快速沉积。 可以在每个引线中设置分离区域，使得引线可以在电介质片中的接合窗口内分离和移位以附接到芯片触点。

公开(公告)号：US5590460A

公开(公告)日：1997-01-07

申请号：US277336

申请日：1994-07-19

Applicant: Thomas H. DiStefano ,  John W. Smith ,  Konstantine N. Karavakis ,  Zlata Kovac ,  Joseph Fjelstad

Inventor： Thomas H. DiStefano ,  John W. Smith ,  Konstantine N. Karavakis ,  Zlata Kovac ,  Joseph Fjelstad

IPC: H01R12/50 ,  H01R12/71 ,  H01R13/24 ,  H01R43/02 ,  H05K1/02 ,  H05K1/03 ,  H05K1/05 ,  H05K1/11 ,  H05K1/18 ,  H05K3/00 ,  H05K3/42 ,  H05K3/44 ,  H05K3/46 ,  H05K3/36

CPC classification number: H01R13/2414 ,  H01R12/714 ,  H05K3/445 ,  H05K3/462 ,  H05K3/4641 ,  H05K1/0272 ,  H05K1/036 ,  H05K1/056 ,  H05K1/116 ,  H05K2201/0382 ,  H05K2201/09536 ,  H05K2201/09554 ,  H05K2201/096 ,  H05K2201/09827 ,  H05K2201/10378 ,  H05K2203/0554 ,  H05K2203/0582 ,  H05K2203/135 ,  H05K2203/308 ,  H05K3/0032 ,  H05K3/4623 ,  Y10T29/49126 ,  Y10T29/49155 ,  Y10T29/49165

Abstract: An interposer for interconnection between microelectronic circuit panels has contacts at its surfaces. Each contact has a central axis normal to the surface and a peripheral portion adapted to expand radially outwardly from the central axis responsive to a force applied by a pad on the engaged circuit panel. Thus, when the circuit panels are compressed with the interposers, the contacts expand radially and wipe across the pads. The wiping action facilitates bonding of the contacts to the pads, as by conductive bonding material carried on the contacts themselves.

Abstract translation: 用于微电子电路板之间的互连的插入件在其表面具有接触。 每个接触件具有垂直于表面的中心轴线和适于根据由接合电路板上的焊盘施加的力而从中心轴线径向向外扩张的外围部分。 因此，当电路板被内插件压缩时，触头径向膨胀并擦过焊盘。 擦拭动作有助于将接触件接合到焊盘，如通过接触件本身上承载的导电接合材料。