公开(公告)号：US20180370256A1

公开(公告)日：2018-12-27

申请号：US16017397

申请日：2018-06-25

Applicant: SHIBAURA MECHATRONICS CORPORATION

Inventor： Azusa HIRANO ,  Yasutsugu TSURUOKA ,  Hironori HAIJIMA ,  Toru KURIBAYASHI

IPC: B41J11/00

Abstract: According to one embodiment, a tablet printing apparatus performs printing by using an inkjet print head device for a tablet conveyed by a conveying device. The conveying device includes a conveyor belt having a suction hole and configured to convey the tablet while sucking the tablet from the suction hole. The tablet printing apparatus further includes a rectifying board arranged at a distance from the conveyor belt so as to face a surface of the conveyor belt. The rectifying board has a gas permeability to let an airflow flowing toward the suction hole pass therethrough.

公开(公告)号：US20180311974A1

公开(公告)日：2018-11-01

申请号：US15963549

申请日：2018-04-26

Applicant: SHIBAURA MECHATRONICS CORPORATION

Inventor： Yasutsugu Tsuruoka ,  Hironori Haijima ,  Toru Kuribayashi ,  Yuki Umemura

IPC: B41J11/00 ,  B41J3/407 ,  B65G15/58

CPC classification number: B41J11/007 ,  B41J3/407 ,  B41J11/0085 ,  B65G15/58

Abstract: According to one embodiment, a tablet printing apparatus includes: a conveyor belt including a suction hole to suck a tablet; and an ink jet print head configured to perform printing on the tablet; wherein the conveyor belt further includes a plurality of protrusions formed around the suction hole and configured to support the tablet in contact with the tablet, and a recess formed between the protrusions and communicated with the suction hole, each of the protrusions has a bottom surface, an upper surface, area of which is smaller than that of the bottom surface, and a side surface having an inclined surface, the protrusions support the tablet such that a gap is formed between a surface of the tablet on conveyor belt side and the suction hole, and a suction force is applied to the gap and space of the recess through the suction hole to suck the tablet.

公开(公告)号：US20180286645A1

公开(公告)日：2018-10-04

申请号：US15941853

申请日：2018-03-30

Applicant: SHIBAURA MECHATRONICS CORPORATION

Inventor： Yoshio KAWAMATA ,  Yu KAMBE

IPC: H01J37/34 ,  H01J37/32

Abstract: A plasma processing apparatus includes a conveyance unit that has a rotator in a vacuum container, and circulating carries a workpiece by the rotator along a circular conveyance path, a cylindrical member extended in a direction toward the conveyance path in the vacuum container, a window member that divides a gas space where a process gas is introduced and an exterior, and an antenna causing the process gas to generate inductive coupling plasma for plasma processing when power is applied. The cylindrical member is provided with an opposing part with the opening and faces the rotator, a dividing wall is provided between the opposing part and the rotator so as not to contact the opposing part and the rotator and not to move relative to the vacuum container, and the dividing wall is provided with an adjustment opening that faces the opening, and adjusts a range of the plasma processing.

公开(公告)号：US20180284603A1

公开(公告)日：2018-10-04

申请号：US15941174

申请日：2018-03-30

Applicant: Shibaura Mechatronics Corporation

Inventor： Yoshinori Iino ,  Takashi Miyamoto

IPC: G03F1/80 ,  H01J37/32 ,  G03F1/26 ,  G03F1/76 ,  B23K10/00

Abstract: An outer mask used when manufacturing a photo mask by etching an object to be processed, the object having a surface on which a pattern portion is provided, the outer mask includes: a base portion exhibiting a plate shape and including an opening in a central region, and a frame portion exhibiting a frame shape and provided along a periphery of the base portion. The frame portion has a surface which contacts the surface of the object at four corners of the surface of the object.

公开(公告)号：US20180104966A1

公开(公告)日：2018-04-19

申请号：US15846843

申请日：2017-12-19

Applicant: SHIBAURA MECHATRONICS CORPORATION

Inventor： Hitoshi AOYAGI ,  Junsuke KOMITO

IPC: B41J11/00

CPC classification number: B41J11/0095 ,  A61J3/06 ,  B41J2/01

Abstract: According to one embodiment, a tablet printing apparatus includes: a first conveyor conveying a tablet while holding a other surface of the tablet; a second conveyor conveying the tablet transferred from the first conveyor while holding a one surface of the tablet; a first print head performing printing on the one surface of the tablet; a second print head performing printing on the other surface of the tablet; a first detection mechanism detecting the one surface of the tablet; a second detection mechanism detecting the other surface of the tablet; and a controller sending a printing instruction to the first and the second print heads based on information related to the state of a split line included in detection information on the one surface of the tablet or detection information on the other surface of the tablet.

公开(公告)号：US20180096864A1

公开(公告)日：2018-04-05

申请号：US15720928

申请日：2017-09-29

Applicant: Shibaura Mechatronics Corporation

Inventor： Yuji Nagashima ,  Konosuke Hayashi

IPC: H01L21/67 ,  H01L21/687 ,  H01L21/02 ,  B08B3/08 ,  B08B5/02 ,  B08B3/02 ,  F26B3/30

CPC classification number: H01L21/67051 ,  B08B3/02 ,  B08B3/08 ,  B08B5/02 ,  F26B3/30 ,  H01L21/02052 ,  H01L21/67115 ,  H01L21/68764

Abstract: According to one embodiment, a substrate processing apparatus includes a processing chamber, a support part, a heater, and an optical member. In the processing chamber, air flows from the top to the bottom. The support part is located in the processing chamber to support a substrate having a surface to be treated. The heater is arranged so as not to be above the support part and emits light for heating. The optical member is arranged in the processing chamber so as not to be above the support part to guide the light emitted by the heater and having passed above the support part to the surface to be treated of the substrate supported by the support part.

公开(公告)号：US20180015726A1

公开(公告)日：2018-01-18

申请号：US15716728

申请日：2017-09-27

Applicant: SHIBAURA MECHATRONICS CORPORATION

Inventor： Hitoshi AOYAGI ,  Azusa HIRANO ,  Yasutsugu TSURUOKA

IPC: B41J2/175 ,  A61J3/06 ,  B05C11/10 ,  B05D1/26

CPC classification number: B41J2/175 ,  A61J3/007 ,  A61J3/06 ,  B05C5/00 ,  B05C11/10 ,  B05D1/26 ,  B05D2258/02 ,  B41J2/17509 ,  B41J2/17566

Abstract: According to one embodiment, a tablet printing apparatus includes: a conveyor; an inkjet head configured to eject ink from a nozzle to a tablet conveyed by the conveyor to perform printing; an ink tank configured to contain the ink to be supplied to the inkjet head; a moving device configured to change the height of the ink tank; and a control unit configured to control the moving device. The control unit controls the moving device to change the height of the ink tank based on a use amount of the ink figured out in advance to maintain a head difference between the height of the liquid level of the ink in the ink tank and the height of a nozzle forming surface, where the nozzle is formed in the inkjet head, at a predetermined value.

公开(公告)号：US20170287767A1

公开(公告)日：2017-10-05

申请号：US15472671

申请日：2017-03-29

Applicant: SHIBAURA MECHATRONICS CORPORATION

Inventor： Masaaki FURUYA

IPC: H01L21/687 ,  H01L21/677 ,  H01L21/67

Abstract: According to one embodiment, a substrate transfer apparatus includes: a first gripping plate; a first claw that is supported by the first gripping plate, and has an abutment surface abutting on the outer peripheral surface of a substrate located above and below a surface of the first gripping plate; a second gripping plate arranged as overlapping with the first gripping plate; a second claw that is supported by the second gripping plate, and has an abutment surface abutting on the outer peripheral surface of the substrate located above and below the surface of the first gripping plate; and a gripping part configured to move the first gripping plate and the second gripping plate relative to each other such that the first claw and the second claw move close to and away from each other in a direction intersecting the outer peripheral surface of the substrate.

公开(公告)号：US20170275761A1

公开(公告)日：2017-09-28

申请号：US15467602

申请日：2017-03-23

Applicant: Shibaura Mechatronics Corporation

Inventor： Yoshinao Kamo

IPC: C23C16/50 ,  H01J37/32 ,  C23C16/458

CPC classification number: H01J37/32532 ,  C23C14/0068 ,  C23C14/0078 ,  C23C14/505 ,  C23C14/54 ,  H01J37/32082 ,  H01J37/32513 ,  H01J37/32541 ,  H01J37/32559 ,  H01J37/32651 ,  H01J37/32779 ,  H01J37/32899 ,  H01J37/3417

Abstract: A plasma processing apparatus includes a cylindrical electrode which has a lower end provided with an opening, an upper end that is a closed end, in which a process gas is introduced, and which obtains a plasma process gas upon application of the voltage, and a chamber that is a vacuum container provided with an opening. The cylindrical electrode, which has the upper end attached to the opening of the chamber via an insulation material, is extended in the chamber. The plasma processing apparatus also includes a rotation table carrying a workpiece to be processed by the process gas to a space below the opening of the cylindrical electrode, a shield covering the cylindrical electrode extended inside the chamber via a gap, and a spacer installed in the gap, and formed of an insulation material.

公开(公告)号：US20170256423A1

公开(公告)日：2017-09-07

申请号：US15450542

申请日：2017-03-06

Applicant: SHIBAURA MECHATRONICS CORPORATION

Inventor： Yuki SAITO ,  Konosuke HAYASHI ,  Takashi OOTAGAKI ,  Yuji NAGASHIMA

IPC: H01L21/67

CPC classification number: H01L21/6708 ,  H01L21/67017 ,  H01L21/67253

Abstract: According to the embodiment, a substrate treating device 10 for treating a semiconductor wafer W using an etchant L containing hydrofluoric acid and nitric acid includes a storage tank 210 that stores the etchant L; a concentration sensor 256 that measures a concentration of nitrous acid in the etchant L; an alcohol feeding line 280 that feeds IPA to the etchant L and maintains the concentration of nitrous acid to a predetermined value or more; and a substrate treating unit 100 that feeds the etchant L in the storage tank 210 to the semiconductor wafer W. The substrate treating device can improve the etching efficiency by efficiently generating nitrous acid, and thereby producing an etchant having a nitrous acid concentration suitable for etching.