Dual conversion gain image sensor cell
    162.
    发明授权
    Dual conversion gain image sensor cell 有权
    双转换增益图像传感器单元

    公开(公告)号:US09590127B2

    公开(公告)日:2017-03-07

    申请号:US14335095

    申请日:2014-07-18

    Inventor: Francois Roy

    CPC classification number: H01L31/103 H01L27/14612 H01L27/14643 H04N5/378

    Abstract: An image sensor cell formed inside and on top of a substrate of a first conductivity type, including: a read region of the second conductivity type; and, adjacent to the read region, a storage region of the first conductivity type topped with a first insulated gate electrode. The first electrode is arranged to receive, in a first operating mode, a first voltage causing the inversion of the conductivity type of the storage region, so that the storage region behaves as an extension of the read region, and, in a second operating mode, a second voltage causing no inversion of the storage region.

    Abstract translation: 在第一导电类型的衬底的内部和顶部形成的图像传感器单元,包括:第二导电类型的读取区域; 并且与读取区域相邻的第一导电类型的存储区域顶上第一绝缘栅电极。 第一电极被布置成在第一操作模式中接收导致存储区域的导电类型的反转的第一电压,使得存储区域表现为读取区域的延伸,并且在第二操作模式 ,不会导致存储区域的反转的第二电压。

    INTEGRATED CIRCUIT INCLUDING AN ACTIVE DEVICE FOR CONFINEMENT OF A LIGHT FLUX
    163.
    发明申请
    INTEGRATED CIRCUIT INCLUDING AN ACTIVE DEVICE FOR CONFINEMENT OF A LIGHT FLUX 审中-公开
    集成电路,包括用于限制光通量的活动设备

    公开(公告)号:US20170059774A1

    公开(公告)日:2017-03-02

    申请号:US15051904

    申请日:2016-02-24

    Inventor: Charles Baudot

    Abstract: An integrated circuit includes an active device for confinement of a light flux that is formed in a semiconducting substrate. A confinement rib is separated from two doped zones by two trenches. Each doped zone includes a contacting zone on an upper face. Each trench widens from a bottom wall towards the upper face of the corresponding doped zone. The widening trenches present a sidewall having a tiered profile between the trench and the doped zone. An opposite sidewall presents a straight profile.

    Abstract translation: 集成电路包括用于限制形成在半导体衬底中的光束的有源器件。 限制肋通过两个沟槽与两个掺杂区分离。 每个掺杂区包括在上表面上的接触区。 每个沟槽从底壁朝向相应掺杂区的上表面变宽。 加宽的沟槽具有在沟槽和掺杂区域之间具有分层轮廓的侧壁。 相对的侧壁呈直线轮廓。

    Method for testing a photonic integrated circuit including a device under test
    170.
    发明授权
    Method for testing a photonic integrated circuit including a device under test 有权
    包括被测设备的光子集成电路的测试方法

    公开(公告)号:US09453723B1

    公开(公告)日:2016-09-27

    申请号:US14754747

    申请日:2015-06-30

    CPC classification number: G01B11/27 G01R31/31728 G02B6/12019

    Abstract: A method is for testing a photonic integrated circuit (IC) that includes a test structure having a test optical splitter, a test optical input, and first and second test optical outputs. A device under test (DUT) is coupled between the first test optical output and the first output of the test optical splitter. The deembedding structure includes a deembedding optical splitter, a deembedding optical input and first and second deembedding optical outputs. The method includes coupling a test probe device to the test optical inputs and outputs and the deembedding optical inputs and outputs and operating the test probe device to make at least one test measurement related to the DUT and at least one deembedding measurement. The at least one test measurement is processed with the at least one deembedding measurement to determine whether the DUT is acceptable and independent of alignment error.

    Abstract translation: 一种用于测试包括具有测试光分路器,测试光输入以及第一和第二测试光输出的测试结构的光子集成电路(IC)的方法。 被测设备(DUT)耦合在第一测试光输出端和测试光分路器的第一输出端之间。 该装饰结构包括一个嵌入式光分路器,一个嵌入式光输入端和第一和第二嵌入式光输出端。 该方法包括将测试探针装置耦合到测试光输入和输出以及去嵌入光输入和输出,并操作测试探针装置以进行至少一个与DUT相关的测试测量和至少一个去镶嵌测量。 用至少一个去镶嵌测量来处理至少一个测试测量,以确定DUT是否可接受并且不依赖于对准误差。

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