Abstract:
A spectral filter is manufactured using a process wherein a first rectangular bar is formed within a first layer made of a first material, said first rectangular bar being made of a second material having a different optical index. The process further includes, in a second layer over the first layer, a second rectangular bar made of the second material. The second rectangular bar is positioned in contact with the first rectangular bar. The second layer is also made of the first material.
Abstract:
An image sensor cell formed inside and on top of a substrate of a first conductivity type, including: a read region of the second conductivity type; and, adjacent to the read region, a storage region of the first conductivity type topped with a first insulated gate electrode. The first electrode is arranged to receive, in a first operating mode, a first voltage causing the inversion of the conductivity type of the storage region, so that the storage region behaves as an extension of the read region, and, in a second operating mode, a second voltage causing no inversion of the storage region.
Abstract:
An integrated circuit includes an active device for confinement of a light flux that is formed in a semiconducting substrate. A confinement rib is separated from two doped zones by two trenches. Each doped zone includes a contacting zone on an upper face. Each trench widens from a bottom wall towards the upper face of the corresponding doped zone. The widening trenches present a sidewall having a tiered profile between the trench and the doped zone. An opposite sidewall presents a straight profile.
Abstract:
An IC image sensor device may include image sensing IC pixels arranged in an array, and pixel line pairs coupled to the image sensing IC pixels. The IC image sensor device may include circuitry coupled to the pixel line pairs and configured to operate the array in a global shutter mode. Each pair of the pixel line pairs may include a pair of spaced electrical conductors having a twist.
Abstract:
A method manufactures a capacitor having polycrystalline dielectric layer between two metallic electrodes. The dielectric layer is formed by a polycrystalline growth of a dielectric metallic oxide on one of the metallic electrodes. At least one polycrystalline growth condition of the dielectric oxide is modified during the formation of the polycrystalline dielectric layer, which results in a variation of the polycrystalline properties of the dielectric oxide within the thickness of said layer.
Abstract:
A support is provided, including a reception zone in which the external envelope matches the shape of a plate configured to be placed on a droplet deposited at least in the reception zone in order to achieve capillary self-assembly of the plate and the support, and at least one pair of tracks that extend on the support from the reception zone and that have a lyophilic-type affinity with the droplet such that an overflow of the droplet beyond the reception zone is guided in the tracks, wherein the at least one pair of tracks includes a first track and a second track that do not have the same lyophilic-type degree of affinity with the droplet.
Abstract:
An electronic device has a rear plate that includes a substrate rear layer, a substrate front layer and a dielectric intermediate layer between the substrate rear and front layers. An electronic structure is on the substrate front layer and includes electronic components and electrical connections. The substrate rear layer includes a solid local region and a hollowed-out local region. The hollowed-out local region extends over all of the substrate rear layer. The substrate rear layer does not cover at least one local zone of the dielectric intermediate layer corresponding to the hollowed-out local region.
Abstract:
The present disclosure relates to a photodiode comprising: a P-conductivity type substrate region, an electric charge collecting region for collecting electric charges appearing when a rear face of the substrate region receives light, the collecting region comprising an N-conductivity type region formed deep in the substrate region, an N-conductivity type read region formed in the substrate region, and an isolated transfer gate, formed in the substrate region in a deep isolating trench extending opposite a lateral face of the N-conductivity type region, next to the read region, and arranged for receiving a gate voltage to transfer electric charges stored in the collecting region toward the read region.
Abstract:
The present disclosure concerns a method involving: forming a strained silicon germanium layer by epitaxial growth over a silicon layer disposed on a substrate; implanting atoms to amorphize the silicon layer and a lower portion of the silicon germanium layer, without amorphizing a surface portion of the silicon germanium layer; and annealing, to at least partially relax the silicon germanium layer and to re-crystallize the lower portion of the silicon germanium layer and the silicon layer, so that the silicon layer becomes a strained silicon layer.
Abstract:
A method is for testing a photonic integrated circuit (IC) that includes a test structure having a test optical splitter, a test optical input, and first and second test optical outputs. A device under test (DUT) is coupled between the first test optical output and the first output of the test optical splitter. The deembedding structure includes a deembedding optical splitter, a deembedding optical input and first and second deembedding optical outputs. The method includes coupling a test probe device to the test optical inputs and outputs and the deembedding optical inputs and outputs and operating the test probe device to make at least one test measurement related to the DUT and at least one deembedding measurement. The at least one test measurement is processed with the at least one deembedding measurement to determine whether the DUT is acceptable and independent of alignment error.