Thermally stable polyester molding materials
    161.
    发明授权
    Thermally stable polyester molding materials 失效
    耐热聚酯成型材料

    公开(公告)号:US06894112B1

    公开(公告)日:2005-05-17

    申请号:US10129979

    申请日:2000-11-10

    摘要: The invention relates to thermoplastic molding materials containing the following main components: A) 2 to 97.9 wt. % of at least one polyester; B) 0 to 95.9 wt. % of at least one polycarbonate; C) 1 to 80 wt. % of at least one graft polymer which is made up of c1) 40 to 80 wt. % of a graft base consisting of a rubber elastic polymer based on alkyl acrylates with 1 to 8 C-atoms in the alkyl radical and with a glass transition temperature of less than 10° C., c2) 20 to 60 wt. % of a graft support consisting of c21) 60 to 95 wt. % styrene or substituted styrenes of general formula (I), wherein R represents an alkyl radical with 1 to 8 C-atoms or a hydrogen atoms and R1 represents an alcohol radical with 1 to 8 C-atoms and the value of n is 1, 2 or 3 and c22) 5 to 40 wt. % of at least one unsaturated nitrile; D) 1 to 80 wt. % of a copolymer consisting of d1) 60 to 95 % styrene or substituted styrenes of general formula (I) or mixtures thereof and d2) 5 to 40 wt. % of at least one unsaturated nitrile; E) 0.1 to 10 wt. % of an epoxyde resin; and F) 0 to 80 wt. % other additives, the sum of the weight percentages of components A) to F) being 100%.

    摘要翻译: 本发明涉及含有以下主要成分的热塑性成型材料:A)2-97.9wt。 至少一种聚酯的%; B)0〜95.9重量% %的至少一种聚碳酸酯; C)1〜80重量% %的由至少一种由C 1〜1构成的接枝聚合物)40〜80重量% %的由基于丙烯酸烷基酯的橡胶弹性聚合物和烷基中具有1至8个碳原子并且玻璃化转变温度低于10℃,C 2 N 2)组成的接枝基质, 20〜60重量份 %的由C 21 21组成的移植物支持物)60至95重量% %苯乙烯或通式(I)的取代苯乙烯,其中R表示具有1至8个C原子或氢原子的烷基,R 1表示具有1至8个C原子的醇基 n的值为1,2或3,c 22)5〜40wt。 %的至少一种不饱和腈; D)1〜80重量% %)由60%至95%的苯乙烯或通式(I)的取代的苯乙烯或其混合物和d 2 O 2)组成的共聚物。5至40wt。 %的至少一种不饱和腈; E)0.1〜10重量% %的环氧树脂; 和F)0至80wt。 %其他添加剂,组分A)至F)的重量百分比之和为100%。

    Polyester/polycarbonate blends
    163.
    发明授权
    Polyester/polycarbonate blends 失效
    聚酯/聚碳酸酯共混物

    公开(公告)号:US06784233B1

    公开(公告)日:2004-08-31

    申请号:US10018341

    申请日:2001-12-19

    IPC分类号: C08K55317

    摘要: The invention relates to thermoplastic molding compound that contain A) 1 to 97.85% by weight of at least one thermoplastic polyester, B) 1 to 97.85% by weight of at least one polycarbonate, C) 1 to 50% by weight of a rubber-elastic polymer, D) 0.1 to 5% by weight of a phosphorous stabilizer, E) 0.05 to 2% by weight of an organic acid, F) 0 to 60% by weight of further additives. The weight percentages of the components A) to F) add up to 100%.

    摘要翻译: 本发明涉及含有A)1至97.85重量%的至少一种热塑性聚酯的热塑性模塑料,B)1至97.85重量%的至少一种聚碳酸酯,C)1至50重量%的橡胶 - 弹性聚合物,D)0.1〜5重量%的磷稳定剂,E)0.05〜2重量%的有机酸,F)0〜60重量%的其他添加剂。 组分A)至F)的重量百分比加起来为100%。

    Moulding materials with a polyarylene ether sulfone and aliphatic polyamide base
    164.
    发明授权
    Moulding materials with a polyarylene ether sulfone and aliphatic polyamide base 失效
    具有聚芳醚砜和脂肪族聚酰胺基的成型材料

    公开(公告)号:US06509403B1

    公开(公告)日:2003-01-21

    申请号:US09763698

    申请日:2001-02-26

    IPC分类号: C08K310

    摘要: Molding compositions comprise A) at least one polyarylene ether sulfone, B) at least one aliphatic polyamide, C) at least one filler, and also if desired D) an impact-modifying rubber or a mixture of various impact-modifying rubbers, and E) an additive or a mixture of various additives wherein the viscosity number of the polyamides B (measured in 0.5% strength by weight solution in 96% strength by weight sulfuric acid to DIN 53 727) is at least 180 ml/g, and the molding compositions comprise F) from 100 ppm to 0.5% by weight, based on the total weight of A to E, of copper bromide or copper iodide or a mixture of these.

    摘要翻译: 成型组合物包含A)至少一种聚亚芳基醚砜,B)至少一种脂肪族聚酰胺,C)至少一种填料,以及如果需要D)冲击改性橡胶或各种冲击改性橡胶的混合物,和E)添加剂 或各种添加剂的混合物,其中聚酰胺B的粘度数(以按重量百分比计的硫酸按重量计按DIN 53727标准的重量百分比为0.5%的溶液)为至少180ml / g,模塑组合物包含F) 基于A至E的总重量,从100ppm至0.5重量%的溴化铜或碘化铜或其混合物。

    Installation for wet-treating substrates
    165.
    发明授权
    Installation for wet-treating substrates 失效
    用于湿处理底物的装置

    公开(公告)号:US06269822B1

    公开(公告)日:2001-08-07

    申请号:US09171271

    申请日:1999-03-22

    IPC分类号: B08B304

    摘要: In a device for the wet treatment of substrates (3) in a container (1), containing a treatment fluid (2), whereby the substrates (3) are introduced into the container (1) with a substrate carrier (5), an optimal alignment and centering of the substrates (3) will result within the container (1) upon lifting from the container (1) with the aid of a substrate receiving device (4) provided within the container (1).

    摘要翻译: 在用于湿处理容器(1)中的基材(3)的装置中,包含处理流体(2),由此基板(3)用基板载体(5)引入到容器(1)中, 借助于设置在容器(1)内的基板接收装置(4),从容器(1)提起时,基板(3)的最佳对准和定心将导致容器(1)内。

    Molding compounds consisting of a polycarbonate mixture and a siloxane reticular rubber
    166.
    发明授权
    Molding compounds consisting of a polycarbonate mixture and a siloxane reticular rubber 失效
    由聚碳酸酯混合物和硅氧烷网状橡胶组成的成型化合物

    公开(公告)号:US06232397B1

    公开(公告)日:2001-05-15

    申请号:US09242733

    申请日:1999-02-22

    IPC分类号: C08G6400

    CPC分类号: C08L69/00 C08L2666/02

    摘要: Molding materials contain, as essential components, an aromatic polycarbonate, a graft polymer based on alkyl acrylates, styrenes and unsaturated nitriles, a copolymer based on styrenes and unsaturated nitrites, a siloxane network rubber, a copolymer of at least two different esters of acrylic acid or of methacrylic acid or mixtures thereof, if desired halogen-free phosphorus compounds and additives, and moldings, films or fibers are obtainable from the molding materials.

    摘要翻译: 成型材料作为必需成分含有芳族聚碳酸酯,基于丙烯酸烷基酯,苯乙烯和不饱和腈的接枝聚合物,基于苯乙烯和不饱和亚硝酸盐的共聚物,硅氧烷网络橡胶,至少两种不同的丙烯酸酯的共聚物 或甲基丙烯酸或其混合物,如果需要,无卤素的磷化合物和添加剂,以及模制品,膜或纤维可从成型材料获得。

    Dimensionally stable thermoplastic moulding materials
    167.
    发明授权
    Dimensionally stable thermoplastic moulding materials 有权
    尺寸稳定的热塑性成型材料

    公开(公告)号:US06211266B1

    公开(公告)日:2001-04-03

    申请号:US09554195

    申请日:2000-05-11

    IPC分类号: C08K906

    摘要: Thermoplastic molding compositions comprise A) from 10 to 97.9% by weight of a partly crystalline polyamide, B) from 0.1 to 50% by weight of a copolyamide composed of B1) from 60 to 90 mol % of units derived from s-caprolactam and B2) from 10 to 40 mol % of units derived from aliphatic dicarboxylic acids and from aliphatic diamines, C) from 1 to 40% by weight of a copolymer based on styrene or on substituted styrenes and on unsaturated nitriles, D) from 1 to 50% by weight of a fibrous filler and E) from 0 to 30% by weight of other additives, where the percentages by weight of components A) to E) are 100% in total.

    摘要翻译: 热塑性成型组合物包含A)10至97.9重量%的部分结晶的聚酰胺,B)0.1至50重量%的由B1组成的共聚酰胺),60至90摩尔%的源自ε-己内酰胺和B 2的单元),10) 至40摩尔%的衍生自脂族二羧酸和脂族二胺的单元,C)1至40重量%的基于苯乙烯或取代的苯乙烯和不饱和腈的共聚物,D)1至50重量% 纤维填料和E)0至30重量%的其它添加剂,其中组分A)至E)的重量百分比总计为100%。

    Thermoplastic moulding compounds
    170.
    发明授权
    Thermoplastic moulding compounds 失效
    热塑性模塑料

    公开(公告)号:US6162867A

    公开(公告)日:2000-12-19

    申请号:US254916

    申请日:1999-03-17

    摘要: The invention relates to thermoplastic molding compositions comprisingA) from 30 to 98% by weight of a graft copolymer comprisinga.sub.K) from 30 to 90% by weight of an elastomeric graft core,a.sub.S) from 10 to 70% by weight of a graft shell comprisinga.sub.S /1) from 50 to 100% by weight of a styrene compound or a C.sub.1 -C.sub.8 -alkyl acrylate or methacrylate, or a mixture thereof, anda.sub.S /2) from 0 to 50% by weight of one or more other monomers,B) from 1 to 50% by weight of a thermoplastic polymer andC) from 1 to 70% by weight of an elastomeric block copolymer prepared by anionic polymerization of the monomers with addition of a potassium compound soluble in non-polar solvents (Step 1) followed by hydrogenation of all or virtually all the olefinic double bonds of the polymer obtained in Step 1, as described in greater detail herein.

    摘要翻译: PCT No.PCT / EP97 / 04912 Sec。 371日期1999年3月17日 102(e)1999年3月17日PCT 1997年9月9日PCT公布。 公开号WO98 / 12256 1998年3月26日本发明涉及热塑性模塑组合物,其包含A)30至98重量%的接枝共聚物,其包含aK = 30至90重量%的弹性体接枝芯,aS)10至70重量% 包含50重量%至100重量%的苯乙烯化合物或丙烯酸或甲基丙烯酸C 1 -C 8烷基酯或其混合物的S / 1)的重量,S / 2)0至50重量% 一种或多种其它单体,B)1至50重量%的热塑性聚合物和C)1至70重量%的通过单体的阴离子聚合制备的弹性体嵌段共聚物,加入可溶于非离子的钾化合物 - 极性溶剂(步骤1),随后氢化步骤1中获得的聚合物的所有或几乎所有的烯属双键,如本文更详细描述的。