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    LED light source probe card technology for testing CMOS image scan devices
    161.
    发明授权
    LED light source probe card technology for testing CMOS image scan devices 有权

    公开(公告)号：US10352870B2

    公开(公告)日：2019-07-16

    申请号：US15835380

    申请日：2017-12-07

    Applicant: FormFactor, Inc.

    Inventor： Nobuhiro Kawamata ,  Toshihiro Kasai ,  Hiromitsu Sasanami ,  Shigeki Mori

    IPC: G01N21/88 ,  G01J1/42 ,  G02B27/09 ,  G01R31/28 ,  H04N1/028 ,  G01J1/08 ,  G01J1/32 ,  G01J1/04

    Abstract: Improved wafer-scale testing of optoelectronic devices, such as CMOS image scan devices, is provided. A probe card includes an LED light source corresponding to each device under test in the wafer. The LED light sources provide light from a phosphor illuminated by the LED. A pinhole and lens arrangement is used to collimate the light provided to the devices under test. Uniformity of illumination can be provided by closed loop control of the LED light sources using internal optical signals as feedback signals, in combination with calibration data relating the optical signal values to emitted optical intensity. Uniformity of illumination can be further improved by providing a neutral density filter for each LED light source to improve uniformity from one source to another and/or to improve uniformity of the radiation pattern from each LED light source.

    Probe Card Assembly For Testing Electronic Devices
    163.
    发明申请
    Probe Card Assembly For Testing Electronic Devices 有权
    用于测试电子设备的探针卡组件

    公开(公告)号：US20140327461A1

    公开(公告)日：2014-11-06

    申请号：US14270235

    申请日：2014-05-05

    Applicant: FormFactor, Inc.

    Inventor： Li Fan ,  Darcy K. Kelly-Greene ,  Edward J. Milovic ,  Gensaku Nagai ,  Mukesh K. Selvaraj ,  Jim Zhang

    IPC: G01R1/067 ,  G01R1/073

    CPC classification number: G01R1/06716 ,  G01R1/06727 ,  G01R1/06733 ,  G01R1/07342 ,  G01R1/07371 ,  G01R1/36 ,  G01R35/00

    Abstract: A probe card assembly can comprise a guide plate comprising probe guides for holding probes in predetermined positions. The probe card assembly can also comprise a wiring structure attached to the guide plate so that connection tips of the probes are positioned against and attached to contacts on the wiring structure. The attachment of the guide plate to the wiring structure can allow the wiring structure to expand or contract at a greater rate than the guide plate. The probes can include compliant elements that fail upon high electrical current and thermal stresses located away from the contact tips.

    Abstract translation: 探针卡组件可以包括导板，其包括用于将探针保持在预定位置的探针引导件。 探针卡组件还可以包括附接到引导板的布线结构，使得探针的连接尖端定位成抵靠并附接到布线结构上的触点。 引导板到布线结构的附接可以使布线结构以比引导板更大的速率膨胀或收缩。 探针可以包括顺应元件，其在远离接触尖端的高电流和热应力下失效。

    Wafer test cassette system
    164.
    发明授权
    Wafer test cassette system 有权
    晶圆测试盒系统

    公开(公告)号：US08872532B2

    公开(公告)日：2014-10-28

    申请号：US12979200

    申请日：2010-12-27

    Applicant: Keith J. Breinlinger ,  Eric D. Hobbs

    Inventor： Keith J. Breinlinger ,  Eric D. Hobbs

    IPC: G01R31/00 ,  G01R1/04 ,  G01R31/302

    CPC classification number: G01R1/0491 ,  G01R31/3025

    Abstract: Wafer cassette systems and methods of using wafer cassette systems. A wafer cassette system can include a base and a probe card assembly. The base and the probe card assembly can each include complementary interlocking alignment elements. The alignment elements can constrain relative movement of the base and probe card assembly in directions parallel to a wafer receiving surface of the base, while permitting relative movement in a direction perpendicular to the receiving surface.

    Abstract translation: 晶圆盒系统和使用晶片盒系统的方法。 晶片盒系统可以包括基座和探针卡组件。 基座和探针卡组件可以各自包括互补的互锁对准元件。 对准元件可以约束基部和探针卡组件在平行于基部的晶片接收表面的方向上的相对运动，同时允许在垂直于接收表面的方向上的相对运动。

    Probe card stiffener with decoupling
    166.
    发明授权
    Probe card stiffener with decoupling 有权
    探头卡加强件与去耦

    公开(公告)号：US08736294B2

    公开(公告)日：2014-05-27

    申请号：US12967302

    申请日：2010-12-14

    Applicant: Kevin S. Chang ,  Eric D. Hobbs

    Inventor： Kevin S. Chang ,  Eric D. Hobbs

    IPC: G01R31/00

    CPC classification number: G01R1/07378 ,  G01R31/2891

    Abstract: A stiffener for a probe card assembly can include decoupling mechanisms disposed within radial arms of the stiffener. The decoupling mechanisms can be compliant in a direction along a radial direction of said radial arm and rigid in a direction perpendicular to said radial arm. The decoupling mechanisms can decouple the stiffener from thermally induced differential radial contraction and expansion of the stiffener relative to the cardholder to which the stiffener is mounted. This can reduce thermally-induced vertical translation of the probe card assembly.

    Abstract translation: 用于探针卡组件的加强件可以包括设置在加强件的径向臂内的解耦机构。 去耦机构可以沿着所述径向臂的径向的方向并且在垂直于所述径向臂的方向上是刚性的。 解耦机构可以将加强件与加热元件相对于加强件安装到的卡座上的热引起的差分径向收缩和膨胀相分离。 这可以减少探针卡组件的热诱导垂直平移。

    VERTICAL PROBES FOR MULTI-PITCH FULL GRID CONTACT ARRAY
    167.
    发明申请
    VERTICAL PROBES FOR MULTI-PITCH FULL GRID CONTACT ARRAY 审中-公开
    用于多点全网格接触阵列的垂直探测器

    公开(公告)号：US20140043054A1

    公开(公告)日：2014-02-13

    申请号：US13963567

    申请日：2013-08-09

    Applicant: FormFactor, Inc.

    Inventor： January Kister

    IPC: G01R1/067

    CPC classification number: G01R1/06711 ,  G01R1/0675 ,  G01R3/00 ,  G06Q30/0623

    Abstract: A testing method (and the probes used) comprising providing one or more probes each comprising: a body portion which is substantially straight; an extended portion extending from the body portion and comprising at least two separate probe portions; and a tip portion at the opposite end of the extended portion; and contacting an object to be tested with the one or more probes.

    Abstract translation: 一种测试方法（以及使用的探针），包括提供一个或多个探针，每个探针包括：主体部分，其基本上是直的; 延伸部分，其从主体部分延伸并且包括至少两个单独的探针部分; 以及在所述延伸部分的相对端处的末端部分; 以及使待测对象与所述一个或多个探针接触。

    Wiring substrate with customization layers
    168.
    发明授权
    Wiring substrate with customization layers 有权
    接线基板与定制层

    公开(公告)号：US08476538B2

    公开(公告)日：2013-07-02

    申请号：US12719136

    申请日：2010-03-08

    Applicant: Benjamin N. Eldridge ,  Gaetan L. Mathieu

    Inventor： Benjamin N. Eldridge ,  Gaetan L. Mathieu

    IPC: H05K1/11

    CPC classification number: H05K3/4664 ,  H05K3/1241 ,  H05K3/4015 ,  H05K3/4046 ,  H05K3/4647 ,  H05K2203/049 ,  Y10T29/49155 ,  Y10T29/49165

    Abstract: One or more customization layers can be added to a wiring substrate. The customization layers can provide customized electrical connections from electrical contacts of the base wiring substrate to electrical contacts at an outer surface of the customization layers, which can allow the contacts at the outer surface of the customization layers can be in a different pattern than the contacts at the surface of the base wiring substrate. The customization layers can comprise electrically insulating material, electrically conductive via structures through the insulating material, electrically conductive traces, electrically conductive jumpers electrically connecting two traces without contacting a trace disposed between the two traces, and/or other such elements. A jumper can be formed by making a relatively small deposit of electrically insulating material between the two traces to be connected and then making a relatively small deposit of electrically conductive material on parts of the two traces and the insulating material. Via structures can be coupled to traces and an insulating material can be cast around the via structures. Alternatively, via structures can be formed in openings with sloped side walls in an insulating layer.

    Abstract translation: 可以将一个或多个定制层添加到布线基板。 定制层可以提供从基底布线基板的电触点到定制层外表面处的电触点的定制电连接，这允许定制层外表面处的触点可以与触点不同的图案 在基极配线基板的表面。 定制层可以包括电绝缘材料，通过绝缘材料的导电通孔结构，导电迹线，电连接两个迹线的导电跳线，而不接触设置在两个迹线之间的迹线和/或其它这样的元件。 可以通过在要连接的两个迹线之间形成相对较小的电绝缘材料沉积，然后在两个迹线和绝缘材料的部分上形成相对较小的导电材料沉积物来形成跳线。 通孔结构可以耦合到迹线，并且绝缘材料可以围绕通孔结构铸造。 或者，通孔结构可以形成在具有绝缘层中的倾斜侧壁的开口中。

    Increasing thermal isolation of a probe card assembly
    170.
    发明授权
    Increasing thermal isolation of a probe card assembly 失效
    增加探针卡组件的热隔离

    公开(公告)号：US08324915B2

    公开(公告)日：2012-12-04

    申请号：US12275491

    申请日：2008-11-21

    Applicant: Kevin Y. Yasumura ,  Timothy Blomgren ,  Jacob C. Chang ,  Michael W. Huebner

    Inventor： Kevin Y. Yasumura ,  Timothy Blomgren ,  Jacob C. Chang ,  Michael W. Huebner

    IPC: G01R31/00

    CPC classification number: G01R31/2875 ,  G01R31/2863

    Abstract: A probe card assembly can include an electrical interface to a test system for testing electronic devices such as semiconductor dies. The probe card assembly can also include probes located at a first side of the probe card assembly. The probes, which can be electrically connected to the electrical interface, can be configured to contact terminals of the electronic devices in the test system while the probe card assembly is attached to the test system. The probe card assembly can be configured to impede thermal flow from the probe card assembly to the test system at places of physical contact between the probe card assembly and the test system while the probe card assembly is attached to the test system.

    Abstract translation: 探针卡组件可以包括用于测试诸如半导体管芯的电子器件的测试系统的电接口。 探针卡组件还可以包括位于探针卡组件的第一侧的探针。 可以电连接到电接口的探针可以被配置为在探针卡组件附接到测试系统时接触测试系统中的电子设备的端子。 探针卡组件可被配置为在探针卡组件与测试系统相连时探测卡组件与测试系统之间物理接触的位置处阻止从探针卡组件到测试系统的热流。

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