公开(公告)号：US20150037506A1

公开(公告)日：2015-02-05

申请号：US14376955

申请日：2013-02-06

Applicant: Nederlandse Organisatie voor toegepast- natuurwetenschappelijk onderzoek TNO

Inventor： Ike Gerke De Vries ,  Hieronymus Antonius Josephus Maria Andriessen ,  Arjan Langen

IPC: B05B13/02 ,  B05D3/02 ,  B05D1/38 ,  B05C9/08 ,  B05C9/14

CPC classification number: B05B13/0221 ,  B05B13/0207 ,  B05C9/08 ,  B05C9/14 ,  B05D1/38 ,  B05D3/0254 ,  H01L21/67173 ,  H01L21/6719

Abstract: A manufacturing facility is provided for manufacturing a product on a foil (FO). The manufacturing facility comprises a deposition zone (10) formed by a clean room wherein at least a first and a second deposition facility (21, 22) are arranged for depositing a layer of a material on the foil. The manufacturing facility further comprises at least one processing facility (31) for processing the deposited layer, said processing facility being arranged outside said deposition zone and comprising a processing trajectory with a first path (31a) away from said deposition zone, towards a turning facility (41) and with a second path (31b) from said turning facility back towards said deposition zone.

Abstract translation: 提供制造设备用于在箔（FO）上制造产品。 制造设备包括由洁净室形成的沉积区（10），其中布置有至少第一和第二沉积设备（21,22），用于在箔上沉积材料层。 所述制造设备还包括至少一个用于处理所述沉积层的处理设备（31），所述处理设备布置在所述沉积区域的外部，并且包括具有远离所述沉积区域的第一路径（31a）朝向转向设备 （41）并且具有从所述车削设备返回到所述沉积区的第二路径（31b）。

公开(公告)号：US08912079B2

公开(公告)日：2014-12-16

申请号：US13266337

申请日：2010-04-28

Applicant: Motoichi Ohtsu ,  Takashi Yatsui ,  Tadashi Kawazoe ,  Shunsuke Yamazaki ,  Koichi Kajiyama ,  Michinobu Mizumura ,  Keiichi Ito

Inventor： Motoichi Ohtsu ,  Takashi Yatsui ,  Tadashi Kawazoe ,  Shunsuke Yamazaki ,  Koichi Kajiyama ,  Michinobu Mizumura ,  Keiichi Ito

IPC: H01L21/20 ,  B05C9/08 ,  C23C16/48 ,  C23C16/30 ,  C30B25/00 ,  C30B29/40 ,  H01L21/02 ,  H01L33/00 ,  C23C14/54 ,  C23C16/52

CPC classification number: C23C16/481 ,  C23C14/548 ,  C23C16/303 ,  C23C16/52 ,  C30B25/00 ,  C30B29/403 ,  H01L21/0237 ,  H01L21/0242 ,  H01L21/0254 ,  H01L21/0262 ,  H01L33/0062

Abstract: Provided is a compound semiconductor deposition method of adjusting the luminous wavelength of a compound semiconductor of a ternary or higher system in a nanometer order in depositing the compound semiconductor on a substrate. In the compound semiconductor deposition method of depositing a compound semiconductor of a ternary or higher system on a substrate, propagation light of a smaller energy than a desired ideal excitation energy for the compound semiconductor is irradiated onto the substrate 13 while depositing the compound semiconductor on the substrate 13, near-field light is generated based on the irradiated propagation light from fine particles of the compound semiconductor deposited on the substrate 13, new vibrational levels for the compound semiconductor are formed in multiple stages based on the generated near-field light, and a component in the compound semiconductor corresponding to the excitation energy is excited with the propagation light through a vibrational level, among the new vibrational levels, which has an excitation energy equal to or smaller than the energy of the propagation light is excited to desorb the component.

Abstract translation: 提供一种在将化合物半导体沉积在基板上时以纳米级调节三元或更高系统的化合物半导体的发光波长的化合物半导体沉积方法。 在将三元或更高系统的化合物半导体沉积在衬底上的化合物半导体沉积方法中，将化合物半导体所需的理想激发能的能量较小的传播光照射到衬底13上，同时将化合物半导体沉积在 基板13，基于沉积在基板13上的化合物半导体的微粒的照射的传播光产生近场光，基于产生的近场光，以多个阶段形成化合物半导体的新的振动电平，以及 对应于激发能的化合物半导体中的成分被传播光激发，通过振动水平，激发能量等于或小于传播光的能量的新的振动水平被激发，从而解吸部件 。

公开(公告)号：US20130040246A1

公开(公告)日：2013-02-14

申请号：US13206441

申请日：2011-08-09

Applicant: Shinichiro KAWAKAMI

Inventor： Shinichiro KAWAKAMI

IPC: G03F7/40 ,  B05C13/00 ,  B05C9/08

CPC classification number: G03F7/40 ,  G03F7/3021 ,  H01L21/6715

Abstract: A method and system for patterning a substrate with reduced defectivity is described. Once a pattern is formed in a layer of radiation-sensitive material using lithographic techniques, the substrate is rinsed to remove residual developing solution and/or other material. Thereafter, a first chemical treatment is performed using a first chemical solution, and a second chemical treatment is performed using a second chemical solution, wherein the second chemical solution has a different chemical composition than the first chemical solution. In one embodiment, the first chemical solution is selected to reduce pattern collapse, and the second chemical solution is selected to reduce pattern deformity, such as line edge roughness (LER) and/or line width roughness (LWR).

Abstract translation: 描述了一种用于使缺陷度降低的衬底图案化的方法和系统。 一旦使用光刻技术在辐射敏感材料层中形成图案，则冲洗基底以除去残余的显影溶液和/或其它材料。 此后，使用第一化学溶液进行第一化学处理，并且使用第二化学溶液进行第二化学处理，其中第二化学溶液具有与第一化学溶液不同的化学组成。 在一个实施方案中，选择第一化学溶液以减少图案塌陷，并且选择第二化学溶液以减少图案变形，例如线边缘粗糙度（LER）和/或线宽粗糙度（LWR）。

公开(公告)号：US20120318190A1

公开(公告)日：2012-12-20

申请号：US13582041

申请日：2011-08-25

Applicant: Peter Jöst

Inventor： Peter Jöst

IPC: B24B21/16 ,  B24B53/00 ,  B05C11/00 ,  B24B21/20 ,  B05C9/08 ,  B24B21/22 ,  B24B47/00

CPC classification number: B24B21/16 ,  B24B55/08

Abstract: The present invention relates a grinding device 1 for the machine-based grinding of rotor blades 100 for wind energy systems, comprising a belt grinding unit 10 with a circulating grinding belt 12.

Abstract translation: 本发明涉及一种用于风能系统的转子叶片100的机器研磨的研磨装置1，包括具有循环研磨带12的带式研磨单元10。

公开(公告)号：US20120273007A1

公开(公告)日：2012-11-01

申请号：US13421913

申请日：2012-03-16

Applicant: JUERGEN VOGT ,  EDUARD FRANSEN

Inventor： JUERGEN VOGT ,  EDUARD FRANSEN

IPC: B05C9/08 ,  B05C9/00

CPC classification number: A61M5/00

Abstract: The invention concerns a device (1) for wetting a medical equipment component (20) with a liquid medium (M), having a dispenser (10) for applying the liquid medium (M) to a section (200) of the component (20) that is to be wetted. A device of this type is characterized by a suction device (12) for drawing off at least a portion of the liquid medium (M) from the section (200) of the component (20) that is to be wetted. The invention furthermore concerns a method for wetting a component. In this manner, a device and a method for wetting a component with a liquid medium is created, with which a wetting procedure can be executed in an at least partially automated manner, at least partially reducing the risk thereby of blockage at the opening of the component as a result of too much liquid being applied.

Abstract translation: 本发明涉及一种用于用液体介质（M）润湿医疗设备部件（20）的装置（1），其具有用于将液体介质（M）施加到部件（20）的部分（200）的分配器（10） ）要润湿。 这种装置的特征在于用于从待润湿的部件（20）的部分（200）抽出至少一部分液体介质（M）的抽吸装置（12）。 本发明还涉及润湿组分的方法。 以这种方式，产生了用液体介质润湿组分的装置和方法，利用该装置和方法可以以至少部分自动化的方式执行润湿程序，至少部分地降低了在开口处的堵塞的风险 作为施加过多液体的结果的组分。

公开(公告)号：US20120097095A1

公开(公告)日：2012-04-26

申请号：US13341011

申请日：2011-12-30

Applicant: Vikas Gupta ,  Jeremias Perez Libres ,  Joseph Edward Grigalunas

Inventor： Vikas Gupta ,  Jeremias Perez Libres ,  Joseph Edward Grigalunas

IPC: H01L21/00 ,  B05C11/00 ,  B05C9/08

CPC classification number: H01L21/563 ,  H01L24/28 ,  H01L2224/73203 ,  H01L2224/83102 ,  H01L2224/92125 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/3512 ,  H01L2924/00

Abstract: Apparatus for assembling a semiconductor device has a plate with body and a surface heatable to a controlled a temperature profile from location to location across the plate. Mesas at same temperature of plate protrude from the surface are configured to support a portion of the substrate. Movable capillaries have openings for blowing cooled gas onto selected locations of the assembly. At least one movable syringe movable has an opening for dispensing a polymer precursor.

Abstract translation: 用于组装半导体器件的装置具有带有主体的板和可加热到可跨越板的位置到位置的温度分布的表面的板。 从表面突出的板的相同温度的台面构造成支撑基板的一部分。 可移动毛细管具有用于将冷却的气体吹送到组件的选定位置的开口。 可移动的至少一个活动注射器具有用于分配聚合物前体的开口。

公开(公告)号：US20120052658A1

公开(公告)日：2012-03-01

申请号：US13216848

申请日：2011-08-24

Applicant: Song Yun KANG ,  Satohiko HOSHINO

Inventor： Song Yun KANG ,  Satohiko HOSHINO

IPC: H01L21/20 ,  B05C9/08 ,  B82Y30/00 ,  B82Y40/00

CPC classification number: H01L21/02546 ,  B82Y20/00 ,  B82Y30/00 ,  B82Y40/00 ,  H01L21/0259 ,  H01L21/02617

Abstract: A quantum dot forming method for forming quantum dots on a surface of a substrate includes exciting a substrate surface with a laser beam having a standing wave which is irradiated from one side of the substrate along the surface of the substrate to excite the surface of the substrate at an interval of one half of a wavelength of the standing wave, and forming a quantum dot with a film differing in lattice constant from a base film forming the surface of the substrate by allowing the film differing in lattice constant to grow on the substrate to form the quantum dots in excited spots of the surface of the substrate.

Abstract translation: 用于在基板的表面上形成量子点的量子点形成方法包括：激发基板表面，该激光束具有沿基板表面从基板的一侧照射的驻波，以激发基板的表面 以驻波的波长的一半的间隔，通过使不同晶格常数的膜在基板上生长而形成具有与形成基板表面的基膜不同的晶格常数的量子点 在基板表面的激发点形成量子点。

公开(公告)号：US20110223348A1

公开(公告)日：2011-09-15

申请号：US12720685

申请日：2010-03-10

Applicant: Deanna McMillen

Inventor： Deanna McMillen

IPC: B05D3/06 ,  G21K5/00 ,  B05C9/08

CPC classification number: G03C5/00

Abstract: Methods and systems for presensitizing film, including presensitizing a first region of a film, where the first region is a first subset of an image region, presensitizing a second region of the film, where the second region is a second subset of the image region, and where the presensitizing the second region of the film is performed subsequently to the presensitizing the first region of the film.

Abstract translation: 用于预敏膜的方法和系统，包括使胶片的第一区域不敏感，其中所述第一区域是图像区域的第一子集，使所述膜的第二区域感光，其中所述第二区域是所述图像区域的第二子集， 并且其中在对胶片的第一区域进行不敏感性的情况下执行胶片的第二区域的预感。

公开(公告)号：US20110111134A1

公开(公告)日：2011-05-12

申请号：US12912116

申请日：2010-10-26

Applicant: Makarand P. Gore

Inventor： Makarand P. Gore

IPC: B05D3/06 ,  B05C9/08 ,  B41F33/00

CPC classification number: B41F23/0406 ,  C23C18/06 ,  C23C18/08 ,  C23C18/1216 ,  C23C18/14 ,  H01L31/022425 ,  H01L31/022466 ,  H01L31/18 ,  H01L31/184 ,  H01L31/1884 ,  H01L31/206 ,  H05K3/1283 ,  Y02E10/544 ,  Y02P70/521

Abstract: Described herein are systems and methods for deposition of films using energy dispensers combined with film-material dispensers. The processes achieve high energy efficiency and speed by deposition of film materials that absorb energy in a designed radiation band, coupled with delivery of energy using a radiation source with a band matched to the absorbance band of the film deposition material. It is possible to use the energy for drying, fusion, chemical conversion, sintering of the deposited materials to produce films for visual, graphic or electronic applications. The process does not cause significant heating of substrates. The energy can be delivered to specified material deposition locations, thus using substantially less energy than bulk heating.

Abstract translation: 本文描述了使用与薄膜材料分配器结合的能量分配器沉积膜的系统和方法。 这些工艺通过沉积在设计的辐射带中吸收能量的薄膜材料，并结合使用具有与成膜材料的吸收带相匹配的带的辐射源的能量输送而实现高能量效率和速度。 可以使用能量进行干燥，熔化，化学转化，沉积材料的烧结以产生用于视觉，图形或电子应用的膜。 该过程不会引起基板的显着加热。 能量可以传送到指定的材料沉积位置，因此使用比体积加热显着更少的能量。

公开(公告)号：US20110094440A1

公开(公告)日：2011-04-28

申请号：US12606301

申请日：2009-10-27

Applicant: Augusto E. BARTON ,  Anthony S. CONDELLO

Inventor： Augusto E. BARTON ,  Anthony S. CONDELLO

IPC: B05C9/08 ,  F25B29/00 ,  B05C9/14

CPC classification number: G03G15/6573 ,  G03G15/2039 ,  G03G2215/2006 ,  G03G2215/2032 ,  G03G2221/1645

Abstract: Apparatuses useful in printing, fixing devices and methods of preheating substrates in apparatuses useful in printing are provided. An exemplary embodiment of the apparatuses useful in printing includes a first member including a first surface; a second member including a second surface forming a nip with the first surface; a substrate cooler disposed downstream from the nip to receive a first substrate exiting the nip, the substrate cooler removing heat from the first substrate by conduction; a substrate pre-heater disposed upstream from the nip; and a first heat transfer system for transferring heat from the substrate cooler to the substrate pre-heater. The substrate pre-heater applies the heat to conductively pre-heat a second substrate before the second substrate enters the nip.

Abstract translation: 提供了用于印刷，定影装置和在用于印刷的装置中预热基板的方法的装置。 用于打印的设备的示例性实施例包括：第一构件，包括第一表面; 第二构件，其包括与所述第一表面形成辊隙的第二表面; 衬底冷却剂，其设置在所述辊隙的下游，以接收离开所述辊隙的第一衬底，所述衬底冷却剂通过传导从所述第一衬底去除热量; 设置在辊隙的上游的衬底预热器; 以及用于将热量从基板冷却器传递到基板预热器的第一传热系统。 衬底预热器在第二衬底进入辊隙之前施加热量以导电地预热第二衬底。